JP2010156664A5 - - Google Patents

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Publication number
JP2010156664A5
JP2010156664A5 JP2009000465A JP2009000465A JP2010156664A5 JP 2010156664 A5 JP2010156664 A5 JP 2010156664A5 JP 2009000465 A JP2009000465 A JP 2009000465A JP 2009000465 A JP2009000465 A JP 2009000465A JP 2010156664 A5 JP2010156664 A5 JP 2010156664A5
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JP
Japan
Prior art keywords
electromagnetic wave
amplitude
inspection apparatus
thickness
propagation time
Prior art date
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Application number
JP2009000465A
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English (en)
Japanese (ja)
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JP2010156664A (ja
JP5173850B2 (ja
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Priority to JP2009000465A priority Critical patent/JP5173850B2/ja
Priority claimed from JP2009000465A external-priority patent/JP5173850B2/ja
Priority to CN200980153214XA priority patent/CN102272578B/zh
Priority to PCT/JP2009/071366 priority patent/WO2010076874A1/en
Priority to US13/142,554 priority patent/US8440971B2/en
Publication of JP2010156664A publication Critical patent/JP2010156664A/ja
Publication of JP2010156664A5 publication Critical patent/JP2010156664A5/ja
Application granted granted Critical
Publication of JP5173850B2 publication Critical patent/JP5173850B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009000465A 2009-01-05 2009-01-05 検査装置 Expired - Fee Related JP5173850B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009000465A JP5173850B2 (ja) 2009-01-05 2009-01-05 検査装置
CN200980153214XA CN102272578B (zh) 2009-01-05 2009-12-16 太赫兹检查装置
PCT/JP2009/071366 WO2010076874A1 (en) 2009-01-05 2009-12-16 Terahertz examining apparatus
US13/142,554 US8440971B2 (en) 2009-01-05 2009-12-16 Examining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009000465A JP5173850B2 (ja) 2009-01-05 2009-01-05 検査装置

Publications (3)

Publication Number Publication Date
JP2010156664A JP2010156664A (ja) 2010-07-15
JP2010156664A5 true JP2010156664A5 (enExample) 2012-02-23
JP5173850B2 JP5173850B2 (ja) 2013-04-03

Family

ID=42045380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009000465A Expired - Fee Related JP5173850B2 (ja) 2009-01-05 2009-01-05 検査装置

Country Status (4)

Country Link
US (1) US8440971B2 (enExample)
JP (1) JP5173850B2 (enExample)
CN (1) CN102272578B (enExample)
WO (1) WO2010076874A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7733100B2 (en) * 2005-08-26 2010-06-08 Dcg Systems, Inc. System and method for modulation mapping
JP5462779B2 (ja) * 2010-12-27 2014-04-02 大日本スクリーン製造株式会社 基板検査装置及び基板検査方法
JP5580251B2 (ja) * 2011-06-13 2014-08-27 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ接合強度検査装置及び方法
JP5972536B2 (ja) * 2011-07-26 2016-08-17 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置および基板検査方法
US9140542B2 (en) * 2012-02-08 2015-09-22 Honeywell Asca Inc. Caliper coating measurement on continuous non-uniform web using THz sensor
JP2013174548A (ja) * 2012-02-27 2013-09-05 Otsuka Denshi Co Ltd 測定装置および測定方法
CN102621070B (zh) * 2012-04-13 2013-09-18 吴周令 一种二维太赫兹成像系统及其成像方法
KR101374321B1 (ko) * 2012-08-29 2014-03-17 한국전자통신연구원 비접촉 두께 측정 장치 및 그것의 두께 측정 방법
US9228826B2 (en) 2012-08-29 2016-01-05 Electronics And Telecommunications Research Institute Apparatus and method for contactless thickness measurement
JP2014122875A (ja) 2012-11-26 2014-07-03 Canon Inc 層状物体の測定装置および方法
CN103105368A (zh) * 2013-01-25 2013-05-15 大连理工大学 一种分析聚变装置第一镜杂质沉积层厚度及其结构的方法
CN103115893A (zh) * 2013-01-30 2013-05-22 大连理工大学 一种检测托卡马克钨第一壁灰尘沉积层成分及厚度的装置
WO2015051806A1 (en) * 2013-10-11 2015-04-16 Danmarks Tekniske Universitet Method for characterisation of electrical properties
FR3013128B1 (fr) * 2013-11-13 2016-01-01 Univ Aix Marseille Dispositif et methode de mise au point tridimensionnelle pour microscope
CN105628642A (zh) * 2016-01-08 2016-06-01 上海理工大学 一种提高太赫兹光学检测系统频谱信噪比的方法
DE102016119728A1 (de) * 2016-10-17 2018-04-19 Inoex Gmbh Lnnovationen Und Ausrüstungen Für Die Extrusionstechnik Terahertz-Messgerät
US11099001B2 (en) * 2016-12-06 2021-08-24 Pioneer Corporation Inspection apparatus, inspection method, computer program and recording medium
KR102350650B1 (ko) * 2017-03-30 2022-01-12 한양대학교 산학협력단 두께 측정 장치, 두께 측정 방법 및 두께 측정 프로그램
US11226286B2 (en) 2017-05-16 2022-01-18 Pioneer Corporation Inspection apparatus, inspection method, library generation apparatus, library generation method, computer program and recording medium
CN107703562B (zh) * 2017-09-26 2019-03-19 北京无线电计量测试研究所 一种用于高带宽平衡光电探测器共模抑制比校准的装置与方法
EP3769034A4 (en) 2018-03-22 2021-12-01 3M Innovative Properties Company TIME RANGE TERAHERTZ MEASURING SYSTEM WITH A SINGLE REFERENCE AREA
DE102018124175A1 (de) * 2018-10-01 2020-04-02 Sikora Ag Verfahren und Vorrichtung zum Steuern einer Produktionsanlage für plattenförmige oder strangförmige Körper
EP3742191A1 (en) * 2019-05-24 2020-11-25 Helmut Fischer GmbH Terahertz measuring device and method of operating a terahertz measuring device
DE102022105479B3 (de) * 2022-03-09 2023-08-03 Sikora Aktiengesellschaft Vorrichtung und Verfahren zum Bestimmen von Dimensionsdaten eines Objekts
CN114885179B (zh) * 2022-05-23 2024-10-22 浙大城市学院 一种太赫兹时域光谱透射成像数据压缩重构方法
CN115127779B (zh) * 2022-06-16 2025-04-15 中国科学院上海光学精密机械研究所 高功率激光系统的色散测量方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5710430A (en) 1995-02-15 1998-01-20 Lucent Technologies Inc. Method and apparatus for terahertz imaging
US5623145A (en) 1995-02-15 1997-04-22 Lucent Technologies Inc. Method and apparatus for terahertz imaging
US5939721A (en) 1996-11-06 1999-08-17 Lucent Technologies Inc. Systems and methods for processing and analyzing terahertz waveforms
GB2359716B (en) * 2000-02-28 2002-06-12 Toshiba Res Europ Ltd An imaging apparatus and method
JP4476462B2 (ja) 2000-03-27 2010-06-09 株式会社栃木ニコン 半導体の電気特性評価装置
JP2002096634A (ja) 2000-09-25 2002-04-02 Asahi Glass Co Ltd 取付用部材付き窓用板材の製造方法
GB2399626B (en) * 2003-03-21 2006-04-05 Teraview Ltd Spectroscopy apparatus and associated technique
GB2405466B (en) * 2003-08-27 2006-01-25 Teraview Ltd Method and apparatus for investigating a non-planner sample
JP4721416B2 (ja) * 2005-09-05 2011-07-13 キヤノン株式会社 検体検査素子、及び検体検査装置
US7459687B2 (en) * 2006-04-06 2008-12-02 New Jersey Institute Of Technology Non-linear terahertz spectroscopy for defect density identification in high k dielectric films
JP4829669B2 (ja) * 2006-04-28 2011-12-07 キヤノン株式会社 検体情報取得装置、及び検体情報取得方法
JP5037929B2 (ja) * 2006-12-18 2012-10-03 キヤノン株式会社 テラヘルツ波を用いた対象物の情報取得装置及び方法
GB2465896B (en) 2007-01-29 2011-12-07 Teraview Ltd A pharmaceutical analysis method and apparatus
DE102007011820B4 (de) * 2007-03-12 2013-04-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum schnellen Messen von Proben mit geringem optischen Wegunterschied mittels elektromagnetischer Strahlung im Terahertz-Bereich
JP2009000465A (ja) 2007-06-20 2009-01-08 Yasuki Sonobe バッグのテーブル格納構造
CN201340905Y (zh) * 2009-01-22 2009-11-04 山东科技大学 太赫兹波带片
CN102087211B (zh) * 2010-12-08 2012-08-15 南京邮电大学 生物薄膜的太赫兹光谱分析装置及检测方法

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