JP2010153787A - 半導体デバイスとその製造方法、および集積回路 - Google Patents
半導体デバイスとその製造方法、および集積回路 Download PDFInfo
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823412—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
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- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
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Abstract
【解決手段】 バンド端を制御されたVtオフセット・デバイス、バンド端を制御されたVtオフセット・デバイスの設計構造体、及びその構造体の製造方法を開示する。構造体は、第1のバンド構造及び第1の型をもたらす第1の原子比の第1の化合物半導体のチャネルを有する第1のFETを含む。この構造体はさらに、第2のバンド構造及び第1の型をもたらす第2の原子比の第2の化合物半導体のチャネルを有する第2のFETを含む。第1の化合物半導体は第2の化合物半導体とは異なり、その結果、第1のFETは第2のバンド構造とは異なる第1のバンド構造を有し、第2のFETの閾値電圧とは異なる閾値電圧を生じる。
【選択図】 図4
Description
12:浅いトレンチ分離構造部(STI)
14:マスク(誘電体材料)
16、16a、16b:SiGe層
18a、18b:ゲート構造部(FETS)
100:電流基準回路
105:p型FET
110:p型ドープFET
115:電流ミラー
200:電圧基準回路
900:設計フロー
910:設計プロセス
920、990:設計構造体
930:ライブラリ要素
940:設計仕様
950:特性データ
960:検証データ
970:設計ルール
980:ネットリスト
985:テスト・データ・ファイル
995:ステージ
Claims (18)
- 第1のバンド構造及び第1の型をもたらす第1の原子比の第1の化合物半導体のチャネルを備えた第1のFETと、
第2のバンド構造及び第1の型をもたらす第2の原子比の第2の化合物半導体のチャネルを備えた第2のFETと
を備え、
前記第1の化合物半導体は前記第2の化合物半導体とは異なり、その結果、前記第1のFETは前記第2のバンド構造と異なる第1のバンド構造を有し、前記第2のFETの閾値電圧とは異なる閾値電圧を生じる、
半導体デバイス構造体。 - 前記第1の化合物半導体はSi(1−x)Gex化合物半導体を含み、
前記第2の化合物半導体はSi(1−y)Geyを含み、
xはyに等しくない、
請求項1に記載の構造体。 - x=0である、請求項2に記載の構造体。
- 前記第1のFETと前記第2のFETは、チャネル材料の価電子帯エネルギーの違いにより異なる閾値電圧Vtを有する、請求項2に記載の構造体。
- 前記第1のFET及び前記第2のFETはSOI FETである、請求項4に記載の構造体。
- 前記第1のFETは、x=0を有し、前記第2のFETと実質的に同じチャネル・ドーピングを有し、そして前記第2のFETより高い閾値電圧Vtを有する、請求項5に記載の構造体。
- 第1のバンド構造を有する第1のチャネルを備えた第1のFETと、
第2のバンド構造を有する第2のチャネルを備えた第2のFETと
を備え、
前記第1のFET及び前記第2のFETは同一のチャネル・ドーピング、ソース及びドレイン構造体を有する、
集積回路。 - 前記第1のFETと前記第2のFETは、チャネル材料のバンド構造の違いにより異なる閾値電圧Vtを有する、請求項7に記載の集積回路。
- 前記第1のFET及び前記第2のFETは電圧基準回路をもたらす、請求項8に記載の集積回路。
- 前記第1のFET及び前記第2のFETは電流基準回路をもたらす、請求項8に記載の集積回路。
- 前記第1のFETはSi(1−x)Gex化合物半導体のチャネルを備え、前記第2のFETはSi(1−y)Geyのチャネルを備え、
xはyに等しくない、
請求項7に記載の集積回路。 - x=0である、請求項7に記載の集積回路。
- 集積回路を設計し、製造し、又はテストするための、機械可読媒体内に具体化された設計構造体であって、
第1のバンド構造及び第1の型をもたらす第1の原子比の第1の化合物半導体のチャネルを備えた第1のFETと、
第2のバンド構造及び第1の型をもたらす第2の原子比の第2の化合物半導体のチャネルを備えた第2のFETと
を備え、
前記第1の化合物半導体は前記第2の化合物半導体とは異なり、その結果、前記第1のFETは前記第2のバンド構造と異なる第1のバンド構造を有し、前記第2のFETの閾値電圧とは異なる閾値電圧を生じる、
前記設計構造体。 - 前記設計構造体はネットリストを含む、請求項13に記載の設計構造体。
- 前記設計構造体は、集積回路のレイアウト・データの交換に用いられるデータ形式で記憶媒体上又はプログラム可能ゲート・アレイ内に常駐する、請求項13に記載の設計構造体。
- Si(1−x)Gex化合物半導体のチャネルを備えた第1の型の第1のFETを形成するステップと、
Si(1−y)Geyのチャネルを備えた第1の型の第2のFETを形成するステップと
を含み、
xはyに等しくない、
半導体デバイスを形成する方法。 - x=0である、請求項16に記載の方法。
- 前記第1のFETと前記第2のFETは、チャネル材料の価電子帯エネルギーの違いにより異なる閾値電圧を有する、請求項16に記載の方法。
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US12/342,194 US8294222B2 (en) | 2008-12-23 | 2008-12-23 | Band edge engineered Vt offset device |
US12/342194 | 2008-12-23 |
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JP2010153787A true JP2010153787A (ja) | 2010-07-08 |
JP5587580B2 JP5587580B2 (ja) | 2014-09-10 |
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JP (1) | JP5587580B2 (ja) |
KR (1) | KR20100073965A (ja) |
CN (1) | CN101764137A (ja) |
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US8294222B2 (en) * | 2008-12-23 | 2012-10-23 | International Business Machines Corporation | Band edge engineered Vt offset device |
US8435878B2 (en) * | 2010-04-06 | 2013-05-07 | International Business Machines Corporation | Field effect transistor device and fabrication |
DE102010063781B4 (de) * | 2010-12-21 | 2016-08-11 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Unterschiedliche Schwellwertspannungseinstellung in PMOS-Transistoren durch unterschiedliche Herstellung eines Kanalhalbleitermaterials |
US8377773B1 (en) * | 2011-10-31 | 2013-02-19 | Globalfoundries Inc. | Transistors having a channel semiconductor alloy formed in an early process stage based on a hard mask |
US9177803B2 (en) * | 2013-03-14 | 2015-11-03 | Globalfoundries Inc. | HK/MG process flows for P-type semiconductor devices |
CN104517637B (zh) * | 2013-09-30 | 2017-09-22 | 中芯国际集成电路制造(上海)有限公司 | Sram单元 |
US9356046B2 (en) | 2013-11-22 | 2016-05-31 | Globalfoundries Inc. | Structure and method for forming CMOS with NFET and PFET having different channel materials |
US9673221B2 (en) | 2015-03-03 | 2017-06-06 | International Business Machines Corporation | Semiconductor device with low band-to-band tunneling |
US11018254B2 (en) | 2016-03-31 | 2021-05-25 | International Business Machines Corporation | Fabrication of vertical fin transistor with multiple threshold voltages |
US9911656B1 (en) | 2016-08-19 | 2018-03-06 | International Business Machines Corporation | Wimpy device by selective laser annealing |
US9922983B1 (en) | 2016-09-22 | 2018-03-20 | International Business Machines Corporation | Threshold voltage modulation through channel length adjustment |
US10396076B2 (en) * | 2017-03-21 | 2019-08-27 | International Business Machines Corporation | Structure and method for multiple threshold voltage definition in advanced CMOS device technology |
US11004852B2 (en) * | 2018-10-30 | 2021-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure |
US10825835B1 (en) * | 2019-07-17 | 2020-11-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | IC including standard cells and SRAM cells |
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- 2009-09-30 JP JP2009227678A patent/JP5587580B2/ja not_active Expired - Fee Related
- 2009-11-13 CN CN200910222012A patent/CN101764137A/zh active Pending
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JPH08123566A (ja) * | 1994-08-31 | 1996-05-17 | Mitsubishi Electric Corp | 基準電圧発生回路および半導体装置の製造方法 |
JP2002280568A (ja) * | 2000-12-28 | 2002-09-27 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2007515800A (ja) * | 2003-12-23 | 2007-06-14 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | ヘテロ構造を有した電界効果トランジスタ、およびその製造方法 |
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KR20100073965A (ko) | 2010-07-01 |
US8294222B2 (en) | 2012-10-23 |
US8476716B2 (en) | 2013-07-02 |
US20130001693A1 (en) | 2013-01-03 |
US20100155855A1 (en) | 2010-06-24 |
CN101764137A (zh) | 2010-06-30 |
JP5587580B2 (ja) | 2014-09-10 |
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