JP2010153571A5 - - Google Patents

Download PDF

Info

Publication number
JP2010153571A5
JP2010153571A5 JP2008329733A JP2008329733A JP2010153571A5 JP 2010153571 A5 JP2010153571 A5 JP 2010153571A5 JP 2008329733 A JP2008329733 A JP 2008329733A JP 2008329733 A JP2008329733 A JP 2008329733A JP 2010153571 A5 JP2010153571 A5 JP 2010153571A5
Authority
JP
Japan
Prior art keywords
layer
wiring
wiring groove
groove
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008329733A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010153571A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008329733A priority Critical patent/JP2010153571A/ja
Priority claimed from JP2008329733A external-priority patent/JP2010153571A/ja
Publication of JP2010153571A publication Critical patent/JP2010153571A/ja
Publication of JP2010153571A5 publication Critical patent/JP2010153571A5/ja
Pending legal-status Critical Current

Links

JP2008329733A 2008-12-25 2008-12-25 配線基板及びその製造方法 Pending JP2010153571A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008329733A JP2010153571A (ja) 2008-12-25 2008-12-25 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008329733A JP2010153571A (ja) 2008-12-25 2008-12-25 配線基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2010153571A JP2010153571A (ja) 2010-07-08
JP2010153571A5 true JP2010153571A5 (cg-RX-API-DMAC7.html) 2012-01-05

Family

ID=42572348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008329733A Pending JP2010153571A (ja) 2008-12-25 2008-12-25 配線基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP2010153571A (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9888580B2 (en) * 2012-09-27 2018-02-06 Sekisui Chemical Co., Ltd. Method for manufacturing multilayer substrate, multilayer insulation film, and multilayer substrate
JP6162458B2 (ja) * 2013-04-05 2017-07-12 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP7397718B2 (ja) * 2020-02-28 2023-12-13 京セラ株式会社 印刷配線板及び印刷配線板の製造方法
JP2021197403A (ja) * 2020-06-10 2021-12-27 凸版印刷株式会社 多層配線基板及び多層配線基板の製造方法
JP2024008661A (ja) * 2022-07-08 2024-01-19 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0677985B1 (en) * 1994-04-14 1999-05-26 Hewlett-Packard GmbH Method of manufacturing printed circuit boards
JP2002324978A (ja) * 2001-04-24 2002-11-08 Kyocera Corp 多層配線基板
JP4895448B2 (ja) * 2001-09-27 2012-03-14 京セラ株式会社 多層配線基板
JP2005243831A (ja) * 2004-02-25 2005-09-08 Ngk Spark Plug Co Ltd セラミック配線基板及びその製造方法、並びにそれを用いた部品実装済み配線基板
JP4592333B2 (ja) * 2004-05-31 2010-12-01 三洋電機株式会社 回路装置およびその製造方法
JP4439336B2 (ja) * 2004-06-02 2010-03-24 三洋電機株式会社 回路装置の製造方法

Similar Documents

Publication Publication Date Title
TWI384600B (zh) 內埋線路基板及其製造方法
KR101506785B1 (ko) 인쇄회로기판
JP2012146793A5 (cg-RX-API-DMAC7.html)
JP2010141176A5 (cg-RX-API-DMAC7.html)
JP2012028735A5 (cg-RX-API-DMAC7.html)
CN103717013B (zh) 一种印制电路板的制造方法
JP2010153571A5 (cg-RX-API-DMAC7.html)
TW200833201A (en) Wiring substrate and method for manufacturing the same
JP2012256675A5 (cg-RX-API-DMAC7.html)
US20090008145A1 (en) Embedded circuit structure and fabricating process of the same
JP2015088729A (ja) 基板構造およびその製造方法
JP2009283739A5 (cg-RX-API-DMAC7.html)
JP2016092402A (ja) 印刷回路基板及びその製造方法
JP2011222948A (ja) 配線基板の製造方法
WO2012087058A3 (en) Printed circuit board and method for manufacturing the same
CN101695224A (zh) 多层印刷电路板的加工方法
KR101049678B1 (ko) 방열 인쇄회로기판 및 이를 제조하는 방법
JP2010103435A5 (cg-RX-API-DMAC7.html)
JP2010123830A5 (cg-RX-API-DMAC7.html)
WO2011030542A3 (ja) 電子部品モジュールおよびその製造方法
TWI452955B (zh) 基板結構的製作方法
JP2009147263A5 (cg-RX-API-DMAC7.html)
TW200623987A (en) Printed wiring board and method of manufacturing the same
TWI450656B (zh) 電路板及其製作方法
JP2014143237A (ja) ビアホールの形成方法及び多層プリント配線板の製造方法