JP2010145425A - 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板 - Google Patents

感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板 Download PDF

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Publication number
JP2010145425A
JP2010145425A JP2007095053A JP2007095053A JP2010145425A JP 2010145425 A JP2010145425 A JP 2010145425A JP 2007095053 A JP2007095053 A JP 2007095053A JP 2007095053 A JP2007095053 A JP 2007095053A JP 2010145425 A JP2010145425 A JP 2010145425A
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JP
Japan
Prior art keywords
group
photosensitive
alkyl
resin composition
examples
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007095053A
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English (en)
Japanese (ja)
Inventor
Takami Ikeda
貴美 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2007095053A priority Critical patent/JP2010145425A/ja
Priority to KR1020097019360A priority patent/KR20100014433A/ko
Priority to PCT/JP2008/051805 priority patent/WO2008126455A1/fr
Priority to CN200880010483A priority patent/CN101652716A/zh
Publication of JP2010145425A publication Critical patent/JP2010145425A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2007095053A 2007-03-30 2007-03-30 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板 Pending JP2010145425A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007095053A JP2010145425A (ja) 2007-03-30 2007-03-30 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板
KR1020097019360A KR20100014433A (ko) 2007-03-30 2008-02-05 감광성 수지 조성물, 감광성 필름, 그것을 이용한 패턴 형성 방법 및 프린트 기판
PCT/JP2008/051805 WO2008126455A1 (fr) 2007-03-30 2008-02-05 Composition de résine photosensible, film photosensible, procédé pour former un motif à l'aide du film photosensible et carte de circuits imprimés
CN200880010483A CN101652716A (zh) 2007-03-30 2008-02-05 感光性树脂组合物、感光性膜、以及使用了它的图案形成方法及印制电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007095053A JP2010145425A (ja) 2007-03-30 2007-03-30 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板

Publications (1)

Publication Number Publication Date
JP2010145425A true JP2010145425A (ja) 2010-07-01

Family

ID=39863613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007095053A Pending JP2010145425A (ja) 2007-03-30 2007-03-30 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板

Country Status (4)

Country Link
JP (1) JP2010145425A (fr)
KR (1) KR20100014433A (fr)
CN (1) CN101652716A (fr)
WO (1) WO2008126455A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120046700A (ko) * 2010-11-02 2012-05-10 후지필름 가부시키가이샤 감광성 수지 조성물, 패턴 제작 방법, ｍｅｍｓ 구조체 및 그 제작 방법, 드라이 에칭 방법, 웨트 에칭 방법, ｍｅｍｓ 셔터 디바이스, 및, 화상 표시 장치
CN103728835A (zh) * 2012-10-15 2014-04-16 锦湖石油化学株式会社 光酸发生剂以及包含该光酸发生剂的抗蚀剂组合物
JP2018049220A (ja) * 2016-09-23 2018-03-29 株式会社タムラ製作所 感光性樹脂組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011095705A (ja) * 2009-09-30 2011-05-12 Fujifilm Corp 感光性組成物、感光性ソルダーレジスト組成物及び感光性ソルダーレジストフィルム、並びに、永久パターン、その形成方法及びプリント基板
CN102399352B (zh) * 2010-09-15 2013-05-22 南开大学 一种含能热塑性弹性体及其合成方法
CN104641293B (zh) * 2012-09-18 2019-04-19 旭化成株式会社 感光性树脂组合物
KR101434659B1 (ko) * 2012-10-15 2014-08-28 금호석유화학 주식회사 광산발생제 및 이를 포함하는 레지스트 조성물
CN106768052B (zh) * 2016-12-27 2023-12-15 江苏大学 一种智能碳纤维复合材料传感元件及其制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0411261A (ja) * 1990-04-27 1992-01-16 Mitsubishi Kasei Corp 感光性組成物
JPH05249670A (ja) * 1992-03-05 1993-09-28 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
SG97168A1 (en) * 1999-12-15 2003-07-18 Ciba Sc Holding Ag Photosensitive resin composition
US20040058276A1 (en) * 2002-09-23 2004-03-25 Dueber Thomas E. Halo resistent, photoimagable coverlay compositions, having, advantageous application and removal properties, and methods relating thereto
JP4501402B2 (ja) * 2003-10-20 2010-07-14 三菱化学株式会社 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法
JP2006285179A (ja) * 2005-03-09 2006-10-19 Fuji Photo Film Co Ltd 感光性永久レジストフィルム及び永久パターン形成方法
JP2006251385A (ja) * 2005-03-10 2006-09-21 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007003807A (ja) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd 感光性樹脂組成物および該組成物を用いたソルダーレジスト
JP2007025176A (ja) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp パターン形成材料、並びにパターン形成装置及び永久パターン形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120046700A (ko) * 2010-11-02 2012-05-10 후지필름 가부시키가이샤 감광성 수지 조성물, 패턴 제작 방법, ｍｅｍｓ 구조체 및 그 제작 방법, 드라이 에칭 방법, 웨트 에칭 방법, ｍｅｍｓ 셔터 디바이스, 및, 화상 표시 장치
KR101863644B1 (ko) 2010-11-02 2018-06-04 후지필름 가부시키가이샤 감광성 수지 조성물, 패턴 제작 방법, ｍｅｍｓ 구조체 및 그 제작 방법, 드라이 에칭 방법, 웨트 에칭 방법, ｍｅｍｓ 셔터 디바이스, 및, 화상 표시 장치
CN103728835A (zh) * 2012-10-15 2014-04-16 锦湖石油化学株式会社 光酸发生剂以及包含该光酸发生剂的抗蚀剂组合物
JP2018049220A (ja) * 2016-09-23 2018-03-29 株式会社タムラ製作所 感光性樹脂組成物

Also Published As

Publication number Publication date
WO2008126455A1 (fr) 2008-10-23
KR20100014433A (ko) 2010-02-10
CN101652716A (zh) 2010-02-17

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