WO2008126455A1 - Composition de résine photosensible, film photosensible, procédé pour former un motif à l'aide du film photosensible et carte de circuits imprimés - Google Patents

Composition de résine photosensible, film photosensible, procédé pour former un motif à l'aide du film photosensible et carte de circuits imprimés Download PDF

Info

Publication number
WO2008126455A1
WO2008126455A1 PCT/JP2008/051805 JP2008051805W WO2008126455A1 WO 2008126455 A1 WO2008126455 A1 WO 2008126455A1 JP 2008051805 W JP2008051805 W JP 2008051805W WO 2008126455 A1 WO2008126455 A1 WO 2008126455A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive
photosensitive film
resin composition
printed board
film
Prior art date
Application number
PCT/JP2008/051805
Other languages
English (en)
Japanese (ja)
Inventor
Kimi Ikeda
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Publication of WO2008126455A1 publication Critical patent/WO2008126455A1/fr

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Health & Medical Sciences (AREA)
  • Structural Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Architecture (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne une composition de résine photosensible ayant une bonne résistance au plaquage, une bonne sensibilité, une bonne dévelopabilité et une bonne force d'adhésion. L'invention concerne également un film photosensible, un procédé pour former un motif à l'aide du film photosensible, et une carte de circuits imprimés. La composition de résine photosensible est caractérisée par le fait qu'elle contient un liant, un composé polymérisable, un initiateur de photopolymérisation, une charge inorganique et un accélérateur d'adhésion. Le film photosensible est caractérisé par le fait qu'il est obtenu par la disposition d'une couche photosensible composée de la composition de résine photosensible, sur un corps de support. Le procédé pour former un motif est caractérisé par le fait qu'il comprend au moins une étape dans laquelle la couche photosensible du film photosensible est exposée à de la lumière. La carte de circuits imprimés est caractérisée par le fait qu'elle a un motif permanent formé par le procédé de formation de motif.
PCT/JP2008/051805 2007-03-30 2008-02-05 Composition de résine photosensible, film photosensible, procédé pour former un motif à l'aide du film photosensible et carte de circuits imprimés WO2008126455A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007095053A JP2010145425A (ja) 2007-03-30 2007-03-30 感光性樹脂組成物、感光性フィルム、並びにそれを用いたパターン形成方法及びプリント基板
JP2007-095053 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008126455A1 true WO2008126455A1 (fr) 2008-10-23

Family

ID=39863613

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051805 WO2008126455A1 (fr) 2007-03-30 2008-02-05 Composition de résine photosensible, film photosensible, procédé pour former un motif à l'aide du film photosensible et carte de circuits imprimés

Country Status (4)

Country Link
JP (1) JP2010145425A (fr)
KR (1) KR20100014433A (fr)
CN (1) CN101652716A (fr)
WO (1) WO2008126455A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040299A1 (fr) * 2009-09-30 2011-04-07 富士フイルム株式会社 Composition photosensible, composition d'épargne de soudage photosensible, film d'épargne de soudage photosensible, et modelage permanent, procédé pour former ceux-ci, et substrat imprimé
CN102399352A (zh) * 2010-09-15 2012-04-04 南开大学 一种含能热塑性弹性体及其合成方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2447773B1 (fr) * 2010-11-02 2013-07-10 Fujifilm Corporation Procédé pour la production d'un motif, procédé pour la production d'une structure MEMS, utilisation d'un film durci de résine photopolymérizable comme couche sacrificielle ou comme composant d'une structure MEMS
KR101781702B1 (ko) * 2012-09-18 2017-09-25 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물
KR101434659B1 (ko) * 2012-10-15 2014-08-28 금호석유화학 주식회사 광산발생제 및 이를 포함하는 레지스트 조성물
KR101361623B1 (ko) * 2012-10-15 2014-02-11 금호석유화학주식회사 광산발생제 및 이를 포함하는 레지스트 조성물
JP6495214B2 (ja) * 2016-09-23 2019-04-03 株式会社タムラ製作所 感光性樹脂組成物
CN106768052B (zh) * 2016-12-27 2023-12-15 江苏大学 一种智能碳纤维复合材料传感元件及其制作方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0411261A (ja) * 1990-04-27 1992-01-16 Mitsubishi Kasei Corp 感光性組成物
JPH05249670A (ja) * 1992-03-05 1993-09-28 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2001235858A (ja) * 1999-12-15 2001-08-31 Ciba Specialty Chem Holding Inc 感光性樹脂組成物
JP2004272203A (ja) * 2002-09-23 2004-09-30 E I Du Pont De Nemours & Co 有利な適用および除去特性を有する、耐ハロー性、感光画像形成性のカバーレイ組成物およびそれに関する方法
JP2005122048A (ja) * 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法
JP2006251385A (ja) * 2005-03-10 2006-09-21 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2006285179A (ja) * 2005-03-09 2006-10-19 Fuji Photo Film Co Ltd 感光性永久レジストフィルム及び永久パターン形成方法
JP2007003807A (ja) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd 感光性樹脂組成物および該組成物を用いたソルダーレジスト
JP2007025176A (ja) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp パターン形成材料、並びにパターン形成装置及び永久パターン形成方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0411261A (ja) * 1990-04-27 1992-01-16 Mitsubishi Kasei Corp 感光性組成物
JPH05249670A (ja) * 1992-03-05 1993-09-28 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2001235858A (ja) * 1999-12-15 2001-08-31 Ciba Specialty Chem Holding Inc 感光性樹脂組成物
JP2004272203A (ja) * 2002-09-23 2004-09-30 E I Du Pont De Nemours & Co 有利な適用および除去特性を有する、耐ハロー性、感光画像形成性のカバーレイ組成物およびそれに関する方法
JP2005122048A (ja) * 2003-10-20 2005-05-12 Mitsubishi Chemicals Corp 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法
JP2006285179A (ja) * 2005-03-09 2006-10-19 Fuji Photo Film Co Ltd 感光性永久レジストフィルム及び永久パターン形成方法
JP2006251385A (ja) * 2005-03-10 2006-09-21 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007003807A (ja) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd 感光性樹脂組成物および該組成物を用いたソルダーレジスト
JP2007025176A (ja) * 2005-07-14 2007-02-01 Fujifilm Holdings Corp パターン形成材料、並びにパターン形成装置及び永久パターン形成方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040299A1 (fr) * 2009-09-30 2011-04-07 富士フイルム株式会社 Composition photosensible, composition d'épargne de soudage photosensible, film d'épargne de soudage photosensible, et modelage permanent, procédé pour former ceux-ci, et substrat imprimé
JP2011095705A (ja) * 2009-09-30 2011-05-12 Fujifilm Corp 感光性組成物、感光性ソルダーレジスト組成物及び感光性ソルダーレジストフィルム、並びに、永久パターン、その形成方法及びプリント基板
CN102399352A (zh) * 2010-09-15 2012-04-04 南开大学 一种含能热塑性弹性体及其合成方法
CN102399352B (zh) * 2010-09-15 2013-05-22 南开大学 一种含能热塑性弹性体及其合成方法

Also Published As

Publication number Publication date
CN101652716A (zh) 2010-02-17
JP2010145425A (ja) 2010-07-01
KR20100014433A (ko) 2010-02-10

Similar Documents

Publication Publication Date Title
WO2008126455A1 (fr) Composition de résine photosensible, film photosensible, procédé pour former un motif à l'aide du film photosensible et carte de circuits imprimés
MY152732A (en) Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
WO2009038342A3 (fr) Film optique et procédé de fabrication
WO2006057423A3 (fr) Composition de resine photosensible et film sec photosensible l'utilisant
MY152075A (en) Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
TW200736832A (en) Photo-sensitive composition, photo-sensitive film, photo-sensitive laminate, permanent pattern-forming method, and printing substrate
ATE496977T1 (de) Deckschichtzusammensetzung, alkali- entwicklerlösliche deckschichtfolie mit der zusammensetzung und musterbildungsverfahren mit hilfe damit
WO2008009575A3 (fr) Bases photolatentes pour adhésifs
EP2328027A4 (fr) Composition de résine photosensible du type positif, procédé de fabrication d'un motif de réserve, et composant électronique
TW200721934A (en) Electronic component embedded board and its manufacturing method
TW200641523A (en) Photosensitive resin composition for use in forming light-blocking layer, light-blocking layer and color filter
WO2008123110A1 (fr) Composition adhésive photosensible, adhésif en forme de film, feuille adhesive, motif addhésif semi-conducteurs et procédé de fabrication de dispositif à semi-conducteurs
WO2009114572A3 (fr) Masques photographiques comportant une couche protectrice
WO2008140119A1 (fr) Procédé de formation d'un motif
TW201129865A (en) Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, permanent pattern, permanent pattern forming method and printed board
TW200745749A (en) Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel
TW200627064A (en) Photosensitive resin composition, method for preparating the same, and dry film resist comprising the same
WO2008093643A1 (fr) Elément photosensible
WO2003014831A8 (fr) Element flexographique photosensible et procede de production de plaques flexographiques conçues pour l'impression de journaux
MY174577A (en) Photosensitive resin composition and photosensitive resin laminate
TW200834231A (en) Black-colored photosensitive resin composition, method for formation of black matrix, method for production of color filter, and color filter
WO2009078380A1 (fr) Procédé pour fabriquer une réserve durcie à l'aide d'un stratifié de résine photosensible négative, stratifié de résine photosensible négative et utilisation du stratifié de résine photosensible négative
EP1767990A4 (fr) Résine photosensible pour plaque d"impression flexographique
TW200728062A (en) Tape-to-roll forming method for surface microstructure of light sensitive resin layer and optical film manufactured according to the method
TW200725178A (en) Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880010483.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08704432

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020097019360

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08704432

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP