JP2010126725A - 耐熱性導電パターンを基板に形成するためのペースト組成物 - Google Patents

耐熱性導電パターンを基板に形成するためのペースト組成物 Download PDF

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Publication number
JP2010126725A
JP2010126725A JP2009225178A JP2009225178A JP2010126725A JP 2010126725 A JP2010126725 A JP 2010126725A JP 2009225178 A JP2009225178 A JP 2009225178A JP 2009225178 A JP2009225178 A JP 2009225178A JP 2010126725 A JP2010126725 A JP 2010126725A
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JP
Japan
Prior art keywords
paste composition
dianhydride
printing
aromatic
polyamic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009225178A
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English (en)
Japanese (ja)
Other versions
JP2010126725A5 (enExample
Inventor
Seong Sil Park
朴成實
Soon Yeong Heo
許順永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sonid Inc
Original Assignee
Exax Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090053873A external-priority patent/KR100999820B1/ko
Application filed by Exax Inc filed Critical Exax Inc
Publication of JP2010126725A publication Critical patent/JP2010126725A/ja
Publication of JP2010126725A5 publication Critical patent/JP2010126725A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2009225178A 2008-12-01 2009-09-29 耐熱性導電パターンを基板に形成するためのペースト組成物 Pending JP2010126725A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20080120347 2008-12-01
KR1020090053873A KR100999820B1 (ko) 2008-12-01 2009-06-17 직접인쇄방법으로 기판에 내열성 도전성 패턴을 형성하기 위한 페이스트 조성물

Publications (2)

Publication Number Publication Date
JP2010126725A true JP2010126725A (ja) 2010-06-10
JP2010126725A5 JP2010126725A5 (enExample) 2011-02-24

Family

ID=41830917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009225178A Pending JP2010126725A (ja) 2008-12-01 2009-09-29 耐熱性導電パターンを基板に形成するためのペースト組成物

Country Status (3)

Country Link
US (1) US20100133484A1 (enExample)
EP (1) EP2192598A1 (enExample)
JP (1) JP2010126725A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014115233A1 (ja) * 2013-01-28 2014-07-31 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、パターン硬化膜の製造方法及び半導体素子
WO2015099049A1 (ja) * 2013-12-27 2015-07-02 日本化薬株式会社 導電性ペーストおよび導電性フィルム
JP2016127210A (ja) * 2015-01-07 2016-07-11 株式会社日本触媒 炭素材料複合組成物
JP2022503855A (ja) * 2018-09-28 2022-01-12 カネカ アメリカズ ホールディング，インコーポレイティド ワイヤコーティング用途のためのｒｅａｃｈ承認溶媒系中のポリアミド酸樹脂

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8167190B1 (en) 2011-05-06 2012-05-01 Lockheed Martin Corporation Electrically conductive polymer compositions containing metal particles and a graphene and methods for production and use thereof
KR101301425B1 (ko) * 2011-10-25 2013-08-28 삼성전기주식회사 멀티 무선 충전 장치 및 그 제조 방법
US9178361B2 (en) * 2012-09-27 2015-11-03 ConvenientPower, Ltd. Methods and systems for detecting foreign objects in a wireless charging system
US10455696B2 (en) 2013-09-06 2019-10-22 Solvay Specialty Polymers Italy S.P.A. Electrically conducting assemblies
TWI625226B (zh) * 2016-04-01 2018-06-01 律勝科技股份有限公司 可撓性透明聚醯亞胺積層板及其製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0196246A (ja) * 1987-10-09 1989-04-14 Ube Ind Ltd 銅ペースト組成物および導電性配線体の製法
JP2003313427A (ja) * 2002-04-24 2003-11-06 Shin Etsu Chem Co Ltd 導電性樹脂組成物
WO2007028462A1 (de) * 2005-09-02 2007-03-15 Behr Gmbh & Co. Kg Mechanisch gefügter wärmetauscher
WO2008016148A1 (en) * 2006-08-04 2008-02-07 I.S.T. Corporation Conductive paste, and conductive coating film and conductive film using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3359525A (en) * 1964-10-14 1967-12-19 Du Pont Electric heating element
US4986946A (en) * 1988-06-29 1991-01-22 E. I. Du Pont De Nemours And Company Polyimide articles of intermediate electrical conductivity and a process for making them
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
US20040113127A1 (en) * 2002-12-17 2004-06-17 Min Gary Yonggang Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto
US7211205B2 (en) * 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US7169330B2 (en) * 2004-02-25 2007-01-30 E. I. Du Pont De Nemours And Company Composition of conductive paste
US7745516B2 (en) * 2005-10-12 2010-06-29 E. I. Du Pont De Nemours And Company Composition of polyimide and sterically-hindered hydrophobic epoxy

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0196246A (ja) * 1987-10-09 1989-04-14 Ube Ind Ltd 銅ペースト組成物および導電性配線体の製法
JP2003313427A (ja) * 2002-04-24 2003-11-06 Shin Etsu Chem Co Ltd 導電性樹脂組成物
WO2007028462A1 (de) * 2005-09-02 2007-03-15 Behr Gmbh & Co. Kg Mechanisch gefügter wärmetauscher
WO2008016148A1 (en) * 2006-08-04 2008-02-07 I.S.T. Corporation Conductive paste, and conductive coating film and conductive film using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014115233A1 (ja) * 2013-01-28 2014-07-31 日立化成デュポンマイクロシステムズ株式会社 樹脂組成物、パターン硬化膜の製造方法及び半導体素子
WO2015099049A1 (ja) * 2013-12-27 2015-07-02 日本化薬株式会社 導電性ペーストおよび導電性フィルム
JP2016127210A (ja) * 2015-01-07 2016-07-11 株式会社日本触媒 炭素材料複合組成物
JP2022503855A (ja) * 2018-09-28 2022-01-12 カネカ アメリカズ ホールディング，インコーポレイティド ワイヤコーティング用途のためのｒｅａｃｈ承認溶媒系中のポリアミド酸樹脂

Also Published As

Publication number Publication date
US20100133484A1 (en) 2010-06-03
EP2192598A1 (en) 2010-06-02

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