JP2010114179A - 表示装置および表示装置の製造方法 - Google Patents
表示装置および表示装置の製造方法 Download PDFInfo
- Publication number
- JP2010114179A JP2010114179A JP2008284037A JP2008284037A JP2010114179A JP 2010114179 A JP2010114179 A JP 2010114179A JP 2008284037 A JP2008284037 A JP 2008284037A JP 2008284037 A JP2008284037 A JP 2008284037A JP 2010114179 A JP2010114179 A JP 2010114179A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor film
- impurity
- display device
- film
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000012535 impurity Substances 0.000 claims abstract description 108
- 239000004065 semiconductor Substances 0.000 claims abstract description 94
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 24
- 238000009826 distribution Methods 0.000 claims description 20
- 230000007423 decrease Effects 0.000 claims description 8
- 230000005684 electric field Effects 0.000 claims description 8
- 150000002500 ions Chemical class 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 239000010408 film Substances 0.000 abstract description 133
- 239000010409 thin film Substances 0.000 abstract description 46
- 238000009413 insulation Methods 0.000 abstract 5
- 239000010410 layer Substances 0.000 description 31
- 239000011229 interlayer Substances 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000000528 statistical test Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- OFIYHXOOOISSDN-UHFFFAOYSA-N tellanylidenegallium Chemical compound [Te]=[Ga] OFIYHXOOOISSDN-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78678—Polycrystalline or microcrystalline silicon transistor with inverted-type structure, e.g. with bottom gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
- H01L29/78627—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile with a significant overlap between the lightly doped drain and the gate electrode, e.g. GOLDD
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】本発明にかかる表示装置は、ゲート電極が設けられた導電層と、前記導電層の上に設けられた第1の絶縁層と、前記第1の絶縁層の上に設けられ、前記ゲート電極の上方に多結晶シリコンを含む半導体膜が形成される半導体層と、前記半導体層の上に設けられる第2の絶縁層と、を含み、前記半導体膜は、前記ゲート電極と平面的に重なるチャネル領域を有し、前記チャネル領域において、前記半導体膜の前記第2の絶縁層に接する部分は前記半導体膜の前記第1の絶縁層に接する部分より不純物濃度が高い。
【選択図】図5
Description
の通りである。
Luminescence)等の素子を用いた表示装置に対しても適用することもできる。図12は、VA方式及びTN方式の液晶表示装置を構成するアレイ基板の等価回路を示す図である。VA方式及びTN方式の場合には、コモン電極CTがアレイ基板と対向するフィルタ基板に設けられているが、画素スイッチSWはIPS方式と同様に存在しており、ここに前述の薄膜トランジスタを用いることができる。
Claims (8)
- ゲート電極が設けられた導電層と、
前記導電層の上に設けられた第1の絶縁層と、
前記第1の絶縁層の上に設けられ、前記ゲート電極の上方に多結晶シリコンを含む半導体膜が形成される半導体層と、
前記半導体層の上に設けられる第2の絶縁層と、を含み、
前記半導体膜は、前記ゲート電極と平面的に重なるチャネル領域を有し、
前記チャネル領域において、前記半導体膜の前記第2の絶縁層に接する部分は前記半導体膜の前記第1の絶縁層に接する部分より不純物濃度が高い、
ことを特徴とする表示装置。 - 前記チャネル領域における前記半導体膜は、膜厚方向において前記半導体膜の中央より上側に不純物濃度が最大となるピークを有する、
ことを特徴とする請求項1に記載の表示装置。 - 前記チャネル領域における前記半導体膜は、前記ピークの位置から前記半導体膜の上面に向かうにつれて前記不純物の濃度が単調減少するとともに、前記ピークから前記半導体膜の下面に向かうにつれて前記不純物の濃度が単調減少する分布を有する、
ことを特徴とする請求項2に記載の表示装置。 - 前記半導体膜は、前記チャネル領域における前記半導体膜の中央より上側に前記不純物の分布のピークが位置するように、電界加速された前記不純物のイオンを注入されている、
ことを特徴とする請求項2に記載の表示装置。 - 前記不純物は、ボロンであることを特徴とする請求項4に記載の表示装置。
- 絶縁基板上にゲート電極が設けられた導電層を形成する工程と、
前記導電層の上層に第1の絶縁層を形成する工程と、
前記第1の絶縁層の上層に、多結晶シリコンを含み前記ゲート電極と平面的に重なる半導体膜が設けられた半導体層を形成する工程と、
前記半導体層の上層に前記第2の絶縁層を形成する工程と、
前記半導体膜の前記第1の絶縁層に接する部分より前記第2の絶縁層に接する部分の不純物の濃度が高くなるように前記半導体膜に前記不純物を添加する工程と、
を含むことを特徴とする表示装置の製造方法。 - 前記半導体膜に前記不純物を添加する前記工程は、前記半導体膜の中央より上側に前記不純物の膜厚方向の分布のピークが位置するように、前記半導体膜に電界加速された前記不純物のイオンを注入する工程である、
ことを特徴とする請求項6に記載の表示装置の製造方法。 - 前記不純物は、ボロンであることを特徴とする請求項7に記載の表示装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008284037A JP2010114179A (ja) | 2008-11-05 | 2008-11-05 | 表示装置および表示装置の製造方法 |
US12/611,951 US8319225B2 (en) | 2008-11-05 | 2009-11-04 | Display device and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008284037A JP2010114179A (ja) | 2008-11-05 | 2008-11-05 | 表示装置および表示装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010114179A true JP2010114179A (ja) | 2010-05-20 |
Family
ID=42130308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008284037A Pending JP2010114179A (ja) | 2008-11-05 | 2008-11-05 | 表示装置および表示装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8319225B2 (ja) |
JP (1) | JP2010114179A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9698173B2 (en) * | 2014-08-24 | 2017-07-04 | Royole Corporation | Thin film transistor, display, and method for fabricating the same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05346591A (ja) * | 1992-06-15 | 1993-12-27 | Toshiba Corp | アクティブマトリックス型液晶表示素子の製造方法 |
JPH06216155A (ja) * | 1993-01-18 | 1994-08-05 | Toshiba Corp | 薄膜トランジスタの製造方法 |
JPH1074946A (ja) * | 1996-08-29 | 1998-03-17 | Nec Corp | 薄膜トランジスタおよびその製造方法 |
JPH10270701A (ja) * | 1997-03-27 | 1998-10-09 | Advanced Display:Kk | 薄膜トランジスタおよびその製法 |
JP2000196096A (ja) * | 1998-12-28 | 2000-07-14 | Fujitsu Ltd | 半導体装置、画像表示装置、半導体装置の製造方法、及び画像表示装置の製造方法 |
JP2000228526A (ja) * | 1998-12-03 | 2000-08-15 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2006005245A (ja) * | 2004-06-18 | 2006-01-05 | Sharp Corp | 半導体基板の製造方法、及び半導体基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3764396A (en) * | 1969-09-18 | 1973-10-09 | Kogyo Gijutsuin | Transistors and production thereof |
KR101455304B1 (ko) * | 2007-10-05 | 2014-11-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막트랜지스터, 및 박막트랜지스터를 가지는 표시장치, 및그들의 제작방법 |
-
2008
- 2008-11-05 JP JP2008284037A patent/JP2010114179A/ja active Pending
-
2009
- 2009-11-04 US US12/611,951 patent/US8319225B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05346591A (ja) * | 1992-06-15 | 1993-12-27 | Toshiba Corp | アクティブマトリックス型液晶表示素子の製造方法 |
JPH06216155A (ja) * | 1993-01-18 | 1994-08-05 | Toshiba Corp | 薄膜トランジスタの製造方法 |
JPH1074946A (ja) * | 1996-08-29 | 1998-03-17 | Nec Corp | 薄膜トランジスタおよびその製造方法 |
JPH10270701A (ja) * | 1997-03-27 | 1998-10-09 | Advanced Display:Kk | 薄膜トランジスタおよびその製法 |
JP2000228526A (ja) * | 1998-12-03 | 2000-08-15 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2000196096A (ja) * | 1998-12-28 | 2000-07-14 | Fujitsu Ltd | 半導体装置、画像表示装置、半導体装置の製造方法、及び画像表示装置の製造方法 |
JP2006005245A (ja) * | 2004-06-18 | 2006-01-05 | Sharp Corp | 半導体基板の製造方法、及び半導体基板 |
Also Published As
Publication number | Publication date |
---|---|
US20100109014A1 (en) | 2010-05-06 |
US8319225B2 (en) | 2012-11-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6503459B2 (ja) | 半導体装置及びその製造方法 | |
JP5384088B2 (ja) | 表示装置 | |
JP5306784B2 (ja) | 表示装置 | |
TWI447916B (zh) | 顯示裝置 | |
US8129724B2 (en) | Display device including first, second, and third semiconductor films | |
US8058654B2 (en) | Display device and manufacturing method thereof | |
US20100032681A1 (en) | Display device and manufacturing method thereof | |
US7173675B2 (en) | LCD display with contact hole and insulation layer above pixel electrode | |
KR20120088037A (ko) | 박막 트랜지스터 기판 및 이의 제조 방법 | |
JP2010114179A (ja) | 表示装置および表示装置の製造方法 | |
KR20080047773A (ko) | 폴리실리콘 박막 트랜지스터 기판 및 그 제조 방법 | |
US20210036163A1 (en) | Thin film transistor and production method therefor | |
JP2009206434A (ja) | 表示装置およびその製造方法 | |
JP3949650B2 (ja) | アクティブマトリクス型表示装置の作製方法 | |
WO2013008360A1 (ja) | 表示装置、表示装置に用いられる薄膜トランジスタ、及び薄膜トランジスタの製造方法 | |
JP2010205850A (ja) | 表示装置 | |
US11121262B2 (en) | Semiconductor device including thin film transistor and method for manufacturing the same | |
JPH10135474A (ja) | 絶縁ゲイト型電界効果トランジスタ及びその作製方法 | |
KR101351403B1 (ko) | 박막 트랜지스터, 이의 제조 방법 및 이를 이용한 표시장치의 제조 방법 | |
KR101447998B1 (ko) | 표시 장치의 제조 방법 | |
JP4455855B2 (ja) | 半導体装置及びその作製方法 | |
JP5539574B2 (ja) | 表示装置 | |
KR20080039194A (ko) | 박막 트랜지스터 및 그 제조 방법과, 그를 이용한 액정표시 장치 및 유기 발광 다이오드 표시 장치 | |
JP2009170477A (ja) | 薄膜トランジスタ及び表示装置 | |
JP2010251494A (ja) | 表示装置の製造方法および表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20110112 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111020 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130507 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130705 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140107 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140507 |