JP2010109371A - プリント基板及びこれを備えたプローブ - Google Patents
プリント基板及びこれを備えたプローブ Download PDFInfo
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- JP2010109371A JP2010109371A JP2009246603A JP2009246603A JP2010109371A JP 2010109371 A JP2010109371 A JP 2010109371A JP 2009246603 A JP2009246603 A JP 2009246603A JP 2009246603 A JP2009246603 A JP 2009246603A JP 2010109371 A JP2010109371 A JP 2010109371A
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- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
- A61B8/4461—Features of the scanning mechanism, e.g. for moving the transducer within the housing of the probe
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10462—Flat component oriented parallel to the PCB surface
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
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- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
【解決手段】本発明のプローブは、トランスデューサと、このトランスデューサと面接触するパターン部を有するプリント基板と、前記トランスデューサを前記プリント基板のパターン部に接着させる接着部材とを備える。本発明によれば、プリント基板の接着部がパターン部を有することにより、接着部の接着面積が増加し、更に接着部材が接着部の金属層だけでなく、電気絶縁膜の部分とも接触できるようになるため、トランスデューサとプリント基板との間の接着力が向上する。これにより、トランスデューサとプリント基板とが、強固に接合されるようになり、両者間でのトランスデューサとプリント基板との間の接合不良による性能低下を防止すことができる。
【選択図】図2
Description
Claims (6)
- トランスデューサと、
前記トランスデューサと面接触するパターン部を有するプリント基板と、
前記トランスデューサと前記パターン部を接着させる接着部材と
を備えることを特徴とするプローブ。 - 前記パターン部は、多角形パターン、横縞パターン、縦縞パターン、斜線縞パターン、円形パターン、楕円形パターン、波型パターンのうちの少なくとも一つで形成されていることを特徴とする請求項1に記載のプローブ。
- 前記パターン部は、凸型形状で形成されていることを特徴とする請求項1に記載のプローブ。
- 前記パターン部は、凹型形状で形成されていることを特徴とする請求項1に記載のプローブ。
- 対象体に面接触する接着部と、前記接着部に形成されるパターン部とを備えることを特徴とするプリント基板。
- 前記パターン部は、多角形パターン、斜線縞パターン、横縞パターン、縦縞パターン、円形パターン、楕円形パターン、波形パターンのうちの少なくとも一つで形成されることを特徴とする請求項5に記載のプリント基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080106259A KR101031010B1 (ko) | 2008-10-29 | 2008-10-29 | 피씨비 및 이를 구비하는 프로브 |
Publications (1)
Publication Number | Publication Date |
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JP2010109371A true JP2010109371A (ja) | 2010-05-13 |
Family
ID=41210570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009246603A Pending JP2010109371A (ja) | 2008-10-29 | 2009-10-27 | プリント基板及びこれを備えたプローブ |
Country Status (4)
Country | Link |
---|---|
US (3) | US8228681B2 (ja) |
EP (1) | EP2182784A1 (ja) |
JP (1) | JP2010109371A (ja) |
KR (1) | KR101031010B1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101031010B1 (ko) * | 2008-10-29 | 2011-04-25 | 삼성메디슨 주식회사 | 피씨비 및 이를 구비하는 프로브 |
CN103429358A (zh) * | 2010-12-03 | 2013-12-04 | 三角形研究学会 | 用于形成超声设备的方法以及相关的装置 |
KR101222911B1 (ko) * | 2011-01-14 | 2013-01-16 | 경북대학교 산학협력단 | 2차원 배열 초음파 트랜스듀서 |
KR101435011B1 (ko) * | 2012-02-20 | 2014-08-27 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조방법 |
KR102171594B1 (ko) | 2014-04-03 | 2020-10-30 | 삼성디스플레이 주식회사 | 백라이트 유닛 및 이를 포함하는 액정 표시 장치 |
KR102293575B1 (ko) * | 2014-09-04 | 2021-08-26 | 삼성메디슨 주식회사 | 초음파 영상장치용 프로브 및 그 제조방법 |
CN105662462A (zh) * | 2015-12-31 | 2016-06-15 | 上海爱声生物医疗科技有限公司 | 一种新型的超声换能器及其制作方法 |
KR102627726B1 (ko) * | 2016-05-10 | 2024-01-23 | 삼성메디슨 주식회사 | 초음파 프로브 |
JP6922303B2 (ja) * | 2017-03-22 | 2021-08-18 | セイコーエプソン株式会社 | 超音波デバイスユニット、超音波探触子、及び超音波装置 |
JP6922300B2 (ja) * | 2017-03-22 | 2021-08-18 | セイコーエプソン株式会社 | 超音波デバイスユニット、超音波探触子、及び超音波装置 |
JP7013661B2 (ja) * | 2017-03-22 | 2022-02-01 | セイコーエプソン株式会社 | 超音波デバイスユニット、超音波探触子、及び超音波装置 |
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JP2000357854A (ja) * | 1999-06-15 | 2000-12-26 | Mitsubishi Electric Corp | 電極接続用fpcおよび表示装置 |
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2008
- 2008-10-29 KR KR1020080106259A patent/KR101031010B1/ko active IP Right Grant
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2009
- 2009-09-17 EP EP09170533A patent/EP2182784A1/en not_active Withdrawn
- 2009-10-27 JP JP2009246603A patent/JP2010109371A/ja active Pending
- 2009-10-28 US US12/607,571 patent/US8228681B2/en active Active
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2012
- 2012-06-26 US US13/533,698 patent/US8913399B2/en active Active
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2014
- 2014-11-20 US US14/549,364 patent/US9462996B2/en active Active
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JP2001509901A (ja) * | 1997-11-07 | 2001-07-24 | トムソン−セーエスエフ | 音響プローブの製造方法 |
JP2000357854A (ja) * | 1999-06-15 | 2000-12-26 | Mitsubishi Electric Corp | 電極接続用fpcおよび表示装置 |
JP2005323630A (ja) * | 2004-05-12 | 2005-11-24 | Toshiba Corp | 超音波プローブ及び超音波診断装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101031010B1 (ko) | 2011-04-25 |
US20150080737A1 (en) | 2015-03-19 |
US8228681B2 (en) | 2012-07-24 |
EP2182784A1 (en) | 2010-05-05 |
US20100103637A1 (en) | 2010-04-29 |
KR20100047394A (ko) | 2010-05-10 |
US8913399B2 (en) | 2014-12-16 |
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US9462996B2 (en) | 2016-10-11 |
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