JP2010102693A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP2010102693A JP2010102693A JP2009197151A JP2009197151A JP2010102693A JP 2010102693 A JP2010102693 A JP 2010102693A JP 2009197151 A JP2009197151 A JP 2009197151A JP 2009197151 A JP2009197151 A JP 2009197151A JP 2010102693 A JP2010102693 A JP 2010102693A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/218—Means to regulate or vary operation of device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/218—Means to regulate or vary operation of device
- Y10T137/2202—By movable element
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/218—Means to regulate or vary operation of device
- Y10T137/2202—By movable element
- Y10T137/2213—Electrically-actuated element [e.g., electro-mechanical transducer]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/218—Means to regulate or vary operation of device
- Y10T137/2202—By movable element
- Y10T137/2218—Means [e.g., valve] in control input
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87917—Flow path with serial valves and/or closures
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing And Monitoring For Control Systems (AREA)
- Measuring Volume Flow (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Pipeline Systems (AREA)
Abstract
【解決手段】ガス配管路1に設けられたバルブ2,3,36,38の開閉要求状態及び開閉状態を検出する状態検出部44と、前記バルブの開閉要求状態により予測される前記ガス配管路を流れるガスの予測状態と、前記バルブを開いて前記ガス配管路を流れるガスの状態とを状態毎に識別表示する表示部44とを具備する。
【選択図】図2
Description
又、本発明は以下の実施の態様を含む。
2 ガス供給用電磁バルブ
3 インターロック用電磁バルブ
4 レギュレータ
5 流量制御器
6 基板処理装置
33 制御装置
34 処理室
35 排気系
36 ハンドバルブ
38 置換用電磁バルブ
43 流量制御部
44 表示部付操作部
45〜49 配管要素
51〜54 配管要素
Claims (3)
- ガス配管路に設けられたバルブの開閉要求状態及び開閉状態を検出する状態検出部と、前記バルブの開閉要求状態により予測される前記ガス配管路を流れるガスの予測状態と、前記バルブを開いて前記ガス配管路を流れるガスの状態とを状態毎に識別表示する表示部とを具備することを特徴とする基板処理装置。
- 前記ガス配管路内のガスを検知するガス検知部を更に具備し、前記表示部は前記ガス検知部が検知した前記配管路のガスの流れを表示する請求項1の基板処理装置。
- 前記ガス配管路を流れるガスの流量を検出する流量検出部を更に具備し、前記表示部は前記流量検出部が検出したガスの流量に応じた表示をする請求項1の基板処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009197151A JP5465954B2 (ja) | 2008-09-29 | 2009-08-27 | 基板処理装置及び判断プログラムを格納する記憶媒体及び基板処理装置の表示方法 |
US12/568,175 US8459202B2 (en) | 2008-09-29 | 2009-09-28 | Substrate processing apparatus |
KR1020090091814A KR20100036204A (ko) | 2008-09-29 | 2009-09-28 | 기판 처리 장치 |
KR1020120063032A KR101407931B1 (ko) | 2008-09-29 | 2012-06-13 | 기판 처리 장치 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008250863 | 2008-09-29 | ||
JP2008250863 | 2008-09-29 | ||
JP2009197151A JP5465954B2 (ja) | 2008-09-29 | 2009-08-27 | 基板処理装置及び判断プログラムを格納する記憶媒体及び基板処理装置の表示方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010102693A true JP2010102693A (ja) | 2010-05-06 |
JP2010102693A5 JP2010102693A5 (ja) | 2012-09-27 |
JP5465954B2 JP5465954B2 (ja) | 2014-04-09 |
Family
ID=42056122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009197151A Active JP5465954B2 (ja) | 2008-09-29 | 2009-08-27 | 基板処理装置及び判断プログラムを格納する記憶媒体及び基板処理装置の表示方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8459202B2 (ja) |
JP (1) | JP5465954B2 (ja) |
KR (2) | KR20100036204A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013168131A (ja) * | 2012-01-16 | 2013-08-29 | Tokyo Electron Ltd | 処理装置及びバルブ動作確認方法 |
KR20140103067A (ko) | 2013-02-15 | 2014-08-25 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치, 시뮬레이션 장치, 기록매체 및 시뮬레이션 방법 |
CN108871511A (zh) * | 2018-06-29 | 2018-11-23 | 南京罕华流体技术有限公司 | 一种联动型工业流量精确计量方法 |
WO2019053869A1 (ja) * | 2017-09-15 | 2019-03-21 | 株式会社Kokusai Electric | 基板処理装置 |
JPWO2021192207A1 (ja) * | 2020-03-27 | 2021-09-30 | ||
WO2024204586A1 (ja) * | 2023-03-30 | 2024-10-03 | 大阪瓦斯株式会社 | 設備操作支援システム |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5465954B2 (ja) * | 2008-09-29 | 2014-04-09 | 株式会社日立国際電気 | 基板処理装置及び判断プログラムを格納する記憶媒体及び基板処理装置の表示方法 |
US10108205B2 (en) | 2013-06-28 | 2018-10-23 | Applied Materials, Inc. | Method and system for controlling a flow ratio controller using feed-forward adjustment |
US10114389B2 (en) | 2013-06-28 | 2018-10-30 | Applied Materials, Inc. | Method and system for controlling a flow ratio controller using feedback |
WO2017058261A1 (en) * | 2015-10-02 | 2017-04-06 | Halliburton Energy Services Inc. | Setting valve configurations in a manifold system |
JP6869765B2 (ja) * | 2017-03-23 | 2021-05-12 | 株式会社日立ハイテク | プラズマ処理装置及びプラズマ処理方法 |
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JPH06187581A (ja) * | 1992-12-16 | 1994-07-08 | Hitachi Ltd | 配管内状態表示方法および装置 |
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JP5465954B2 (ja) * | 2008-09-29 | 2014-04-09 | 株式会社日立国際電気 | 基板処理装置及び判断プログラムを格納する記憶媒体及び基板処理装置の表示方法 |
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2009
- 2009-08-27 JP JP2009197151A patent/JP5465954B2/ja active Active
- 2009-09-28 US US12/568,175 patent/US8459202B2/en active Active
- 2009-09-28 KR KR1020090091814A patent/KR20100036204A/ko active Application Filing
-
2012
- 2012-06-13 KR KR1020120063032A patent/KR101407931B1/ko active IP Right Grant
Patent Citations (7)
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JPS6437690A (en) * | 1987-08-04 | 1989-02-08 | Nippon Atomic Ind Group Co | Plant monitor |
JPH06187581A (ja) * | 1992-12-16 | 1994-07-08 | Hitachi Ltd | 配管内状態表示方法および装置 |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013168131A (ja) * | 2012-01-16 | 2013-08-29 | Tokyo Electron Ltd | 処理装置及びバルブ動作確認方法 |
KR20140103067A (ko) | 2013-02-15 | 2014-08-25 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치, 시뮬레이션 장치, 기록매체 및 시뮬레이션 방법 |
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WO2019053869A1 (ja) * | 2017-09-15 | 2019-03-21 | 株式会社Kokusai Electric | 基板処理装置 |
CN108871511A (zh) * | 2018-06-29 | 2018-11-23 | 南京罕华流体技术有限公司 | 一种联动型工业流量精确计量方法 |
JPWO2021192207A1 (ja) * | 2020-03-27 | 2021-09-30 | ||
WO2021192207A1 (ja) * | 2020-03-27 | 2021-09-30 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置及びプログラム |
KR20220144852A (ko) | 2020-03-27 | 2022-10-27 | 가부시키가이샤 코쿠사이 엘렉트릭 | 반도체 장치의 제조 방법, 기판 처리 장치 및 프로그램 |
TWI798638B (zh) * | 2020-03-27 | 2023-04-11 | 日商國際電氣股份有限公司 | 半導體裝置的製造方法、基板處理裝置及程式 |
JP7288551B2 (ja) | 2020-03-27 | 2023-06-07 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置及びプログラム |
WO2024204586A1 (ja) * | 2023-03-30 | 2024-10-03 | 大阪瓦斯株式会社 | 設備操作支援システム |
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KR20120083256A (ko) | 2012-07-25 |
KR20100036204A (ko) | 2010-04-07 |
US8459202B2 (en) | 2013-06-11 |
JP5465954B2 (ja) | 2014-04-09 |
KR101407931B1 (ko) | 2014-06-17 |
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