JP2010097993A - プラズマ処理方法 - Google Patents

プラズマ処理方法 Download PDF

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Publication number
JP2010097993A
JP2010097993A JP2008265261A JP2008265261A JP2010097993A JP 2010097993 A JP2010097993 A JP 2010097993A JP 2008265261 A JP2008265261 A JP 2008265261A JP 2008265261 A JP2008265261 A JP 2008265261A JP 2010097993 A JP2010097993 A JP 2010097993A
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Japan
Prior art keywords
plasma
gas
processing
wafer
substrate
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JP2008265261A
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Japanese (ja)
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JP2010097993A5 (enExample
Inventor
Masatsuya Hamano
勝艶 浜野
Masanori Nakayama
雅則 中山
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
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Priority to JP2008265261A priority Critical patent/JP2010097993A/ja
Publication of JP2010097993A publication Critical patent/JP2010097993A/ja
Publication of JP2010097993A5 publication Critical patent/JP2010097993A5/ja
Pending legal-status Critical Current

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  • Drying Of Semiconductors (AREA)
JP2008265261A 2008-10-14 2008-10-14 プラズマ処理方法 Pending JP2010097993A (ja)

Priority Applications (1)

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JP2008265261A JP2010097993A (ja) 2008-10-14 2008-10-14 プラズマ処理方法

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JP2008265261A JP2010097993A (ja) 2008-10-14 2008-10-14 プラズマ処理方法

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JP2010097993A true JP2010097993A (ja) 2010-04-30
JP2010097993A5 JP2010097993A5 (enExample) 2011-11-17

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JP2008265261A Pending JP2010097993A (ja) 2008-10-14 2008-10-14 プラズマ処理方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019053925A1 (ja) * 2017-09-12 2019-03-21 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置及びプログラム
KR20220036860A (ko) * 2020-09-16 2022-03-23 도쿄엘렉트론가부시키가이샤 플라스마 퍼지 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005074016A1 (ja) * 2004-01-28 2005-08-11 Tokyo Electron Limited 基板処理装置の処理室清浄化方法、基板処理装置、および基板処理方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005074016A1 (ja) * 2004-01-28 2005-08-11 Tokyo Electron Limited 基板処理装置の処理室清浄化方法、基板処理装置、および基板処理方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019053925A1 (ja) * 2017-09-12 2019-03-21 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置及びプログラム
KR20220036860A (ko) * 2020-09-16 2022-03-23 도쿄엘렉트론가부시키가이샤 플라스마 퍼지 방법
JP2022049557A (ja) * 2020-09-16 2022-03-29 東京エレクトロン株式会社 プラズマパージ方法
JP7479257B2 (ja) 2020-09-16 2024-05-08 東京エレクトロン株式会社 プラズマパージ方法
KR102865661B1 (ko) * 2020-09-16 2025-09-29 도쿄엘렉트론가부시키가이샤 플라스마 퍼지 방법

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