JP2010093675A5 - - Google Patents
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- Publication number
- JP2010093675A5 JP2010093675A5 JP2008263570A JP2008263570A JP2010093675A5 JP 2010093675 A5 JP2010093675 A5 JP 2010093675A5 JP 2008263570 A JP2008263570 A JP 2008263570A JP 2008263570 A JP2008263570 A JP 2008263570A JP 2010093675 A5 JP2010093675 A5 JP 2010093675A5
- Authority
- JP
- Japan
- Prior art keywords
- base
- opening
- bonding layer
- substrate
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 10
- 239000010453 quartz Substances 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 238000000605 extraction Methods 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims 2
- 229910000927 Ge alloy Inorganic materials 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008263570A JP5262548B2 (ja) | 2008-10-10 | 2008-10-10 | 振動子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008263570A JP5262548B2 (ja) | 2008-10-10 | 2008-10-10 | 振動子 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010093675A JP2010093675A (ja) | 2010-04-22 |
JP2010093675A5 true JP2010093675A5 (enrdf_load_stackoverflow) | 2011-11-10 |
JP5262548B2 JP5262548B2 (ja) | 2013-08-14 |
Family
ID=42255943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008263570A Expired - Fee Related JP5262548B2 (ja) | 2008-10-10 | 2008-10-10 | 振動子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5262548B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5134045B2 (ja) | 2010-06-23 | 2013-01-30 | 日本電波工業株式会社 | 圧電デバイス及びその製造方法 |
JP5854123B2 (ja) * | 2012-03-02 | 2016-02-09 | 富士通株式会社 | 水晶振動子及びその製造方法 |
CN109155620B (zh) | 2016-06-29 | 2022-05-03 | 株式会社大真空 | 压电振动器件及压电振动器件的制造方法 |
JP2018019417A (ja) * | 2017-09-25 | 2018-02-01 | 株式会社大真空 | 圧電振動デバイス |
JP7627202B2 (ja) | 2021-03-17 | 2025-02-05 | 日本電波工業株式会社 | 圧電デバイス用のベースおよび圧電デバイス |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0865093A (ja) * | 1994-08-26 | 1996-03-08 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
JP2001267875A (ja) * | 2000-03-22 | 2001-09-28 | Seiko Epson Corp | 水晶振動子及びその製造方法 |
JP4576693B2 (ja) * | 2000-10-04 | 2010-11-10 | エプソントヨコム株式会社 | 圧電振動子 |
JP2004208236A (ja) * | 2002-12-26 | 2004-07-22 | Seiko Epson Corp | 圧電デバイスとその製造方法ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器 |
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2008
- 2008-10-10 JP JP2008263570A patent/JP5262548B2/ja not_active Expired - Fee Related