JP2010067761A - Substrate-supporting jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate-supporting jig suppressing such a disadvantage that foreign matters of a substrate are transferred to a supporting layer and the resultant foreign matters of the supporting layer attach to another substrate to cause a contamination, and capable of being easily inspected even when circuit patterns or the like are formed on both surfaces of the substrate. <P>SOLUTION: This substrate-supporting jig includes: a hollow supporting plate 1; a flexible supporting layer 4 supporting in an attachable and detachable manner, the periphery of a semiconductor wafer W coating the surface of the supporting plate 1 to cover a cavity 2 of the supporting plate 1; a plurality of supporting projections 5 formed in an alignment in a hollow 3 on the surface of the supporting plate 1 and supporting the supporting layer 4; and an exhaust hole 6 perforated in the supporting plate 1 and communicating with the hollow 3 coated with the supporting layer 4. Only the periphery of the semiconductor wafer W is adhered-supported by the supporting layer 4 to reduce the contacting area of the semiconductor wafer W, so that even when the substrate-supporting jig is repeatedly used, it can be reduced that foreign matters of the semiconductor wafer W are transferred to the supporting layer 4 and remain. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate holding jig used when inspecting a substrate made of a semiconductor wafer or the like.

Conventionally, when probing or visually inspecting a thin, fragile semiconductor wafer with a circuit pattern formed on the surface, the entire back surface of the semiconductor wafer is in close contact with the adhesive tape of the frame of the substrate holding jig, although not shown. The substrate holding jig is set on the stage of the inspection device in a state where the rigidity is secured by holding and the handling becomes easy, and the semiconductor wafer is probe-inspected from the surface side and the appearance is inspected (patent) References 1, 2, and 3).
JP 09-260480 A JP 2003-152056 A JP 2005-123296 A

  The conventional substrate holding jig is configured as described above and holds the entire back surface of the semiconductor wafer in close contact with the adhesive tape without any gaps. Therefore, with repeated use, foreign matter on the semiconductor wafer is transferred to the adhesive tape, and this adhesive tape There is a problem that foreign matter on the tape adheres to a newly inspected semiconductor wafer and causes contamination. In addition, when circuit patterns are formed on the front and back surfaces of a semiconductor wafer and circuit continuity inspection is required, it is necessary to contact a probe of a semiconductor inspection apparatus (hereinafter referred to as a prober) on both sides of the semiconductor wafer. However, there is a problem that the probe can be brought into contact only with the surface of the semiconductor wafer, which hinders the inspection.

  In addition, if the semiconductor wafer is processed thinly, the semiconductor wafer tends to warp in a bow shape, but it is difficult to maintain the posture with this warped semiconductor wafer, so there is a risk of hindering the inspection during probe inspection and visual inspection. is there. In particular, when visual inspection is performed on a warped semiconductor wafer, the focus of the inspection location cannot be accurately adjusted, leading to a decrease in inspection reliability and throughput.

  The present invention has been made in view of the above, and the foreign matter on the substrate is transferred to the holding layer, and the foreign matter on the holding layer is prevented from adhering to another substrate to cause contamination. Circuit patterns and the like are formed on both sides of the substrate. An object of the present invention is to provide a substrate holding jig that can be easily inspected even if formed.

In the present invention, in order to solve the above problems, the holding layer is to hold the substrate,
A hollow support plate, a flexible holding layer that covers the surface of the support plate and covers the hollow of the support plate so as to be detachable, and a recessed hole on the surface of the support plate. It is characterized by comprising a support protrusion for supporting the layer and an exhaust hole provided in the support plate and communicating with (connected to) a recessed hole covered with the holding layer.
A reinforcing layer can be detachably attached to the back surface of the support plate.

  Here, the substrate in the claims includes at least various sizes of semiconductor wafers, photomasks, glass substrates, solar battery cells, and the like. When this substrate is a semiconductor wafer, circuit patterns may be formed not only on the surface of the semiconductor wafer but also on the front and back surfaces of the semiconductor wafer. Further, the support plate may be any shape such as a ring shape, a frame shape, and a polygonal shape as long as it is hollow. The hollow of the support plate may be circular, but can be appropriately changed according to the shape of the substrate.

  According to the present invention, the holding layer of the substrate holding jig holds the peripheral portion of the substrate, and most of the facing surface facing the holding layer of the substrate is exposed from the hollow of the support plate, so that the holding layer has Since most of the substrate is not contacted, the contact area of the substrate with the holding layer can be reduced. Thereby, even if the substrate holding jig is repeatedly used, it is possible to reduce the transfer of foreign substances on the substrate to the holding layer.

  According to the present invention, there is an effect that foreign matter on the substrate is transferred to the holding layer, and the foreign matter on the holding layer can be prevented from adhering to another substrate and causing contamination. Further, even when circuit patterns or the like are formed on both surfaces of the substrate, there is an effect that the substrate can be easily inspected by utilizing the hollow of the support plate.

  Further, if the reinforcing layer is detachably attached to the back surface of the support plate, the mechanical strength of the support plate can be improved, and deformation or damage of the support plate can be prevented.

  Hereinafter, a preferred embodiment of a substrate holding jig according to the present invention will be described with reference to the drawings. The substrate holding jig in this embodiment has a hollow 2 in a semiconductor wafer W as shown in FIGS. The supporting plate 1 to be covered, the flexible holding layer 4 that covers the surface of the supporting plate 1 to hold the peripheral edge of the semiconductor wafer W, and the holding layer 4 formed in the recessed hole 3 of the supporting plate 1 A plurality of supporting protrusions 5 to be supported and an exhaust hole 6 communicating with the recessed hole 3 of the supporting plate 1 covered with the holding layer 4 are provided.

  The semiconductor wafer W is made of, for example, a thinly sliced 6-inch or 8-inch silicon wafer, and a circuit pattern is formed on at least the front or back surface of the wafer, and is used for probe inspection or appearance inspection.

  The support plate 1 is formed to have a diameter larger than that of the semiconductor wafer W using a predetermined material, and is formed into a rigid flat ring-shaped flat plate, and the flat circular hollow 2 defines the periphery of the semiconductor wafer W. Most of the back surface of the semiconductor wafer W is covered and is exposed to most of the surface. Examples of the predetermined material of the support plate 1 include polycarbonate, polypropylene, polyethylene, acrylic resin, vinyl chloride resin, aluminum alloy, magnesium alloy, glass, and stainless steel.

  A flat ring-shaped recess hole 3 is shallowly recessed in most of the support plate surface except for the inner and outer peripheral edges. In addition, when the orientation flat or notch for alignment is formed on the semiconductor wafer W, the hollow 2 of the support plate 1 is formed according to the shape of the orientation flat or notch.

  The holding layer 4 is formed into a planar ring shape larger than the semiconductor wafer W using a predetermined material, and is adhered to the inner and outer peripheral edge portions of the surface of the support plate 1 so as to cover the recessed holes 3. The opposite peripheral edge of W, in other words, the rear peripheral edge is detachably attached without gaps. The hollow ring-shaped holding layer 4 can be elastically deformed by using, for example, a silicone, urethane, olefin, or fluorine elastomer that has excellent heat resistance, weather resistance, water resistance, peelability, stability over time, and the like. Formed into a thin film.

  The plurality of support protrusions 5 are arranged on the bottom surface of the recessed hole 3 at a predetermined interval, and each support protrusion 5 is formed in a columnar shape or a truncated cone shape having the same height as the surface of the support plate 1. The surface of each support protrusion 5 is bonded to the back surface of the flat holding layer 4. The plurality of support protrusions 5 are integrally formed on the bottom surface of the recessed hole 3 by a molding method, a sandblast method, an etching method, or the like, for example.

  The exhaust hole 6 is formed as a round hole in the thickness direction of the support plate 1, communicates with the space of the recessed hole 3 covered with the holding layer 4, and is detachably connected to an exhaust device 7 including a vacuum pump or the like. As the exhaust device 7 is driven, the air in the recessed hole 3 covered with the holding layer 4 (see the arrow in FIG. 1) is exhausted to the outside so that the holding layer 4 follows the plurality of support protrusions 5 to be uneven. Functions to deform. Then, due to the deformation of the holding layer 4, air flows between the rear surface peripheral edge of the semiconductor wafer W and the holding layer 4, and the semiconductor wafer W can be peeled from the holding layer 4.

  In the above, when the semiconductor wafer W is probe-inspected or externally inspected, most of the semiconductor wafer W except for the back-surface periphery is held by pressing the back-surface periphery of the semiconductor wafer W onto the holding layer 4 of the substrate holding jig. If the substrate holding jig is set on the stage of the inspection apparatus while being exposed from the hollow 2 of the support plate 1 and the rigidity of the semiconductor wafer W is secured, the semiconductor wafer W can be inspected by a probe or the appearance can be inspected. .

  At this time, when the semiconductor wafer W is warped in a bowed shape, the semiconductor wafer W is flattened while being gradually pressed from the end with a roller or the like, and the rear peripheral edge of the semiconductor wafer W can be held in close contact with the holding layer 4. It ’s fine.

  When the inspection is completed and the semiconductor wafer W is removed from the substrate holding jig, the flat holding layer 4 is formed on the plurality of support protrusions 5 by driving the exhaust device 7 connected to the exhaust holes 6 of the support plate 1. It follows and deforms into irregularities, air flows between the semiconductor wafer W and the holding layer 4, and the semiconductor wafer W can be peeled from the holding layer 4.

  According to the above configuration, only the peripheral edge portion of the semiconductor wafer W is held in close contact with the holding layer 4 without gaps, and the contact area of the semiconductor wafer W is reduced by making the other portions non-contact. However, it is possible to greatly reduce the foreign matter on the semiconductor wafer W from being transferred to the holding layer 4 and remaining. Therefore, it is possible to prevent the foreign matter of the holding layer 4 from adhering to the semiconductor wafer W to be inspected next time and causing contamination.

  Further, since the hollow 2 of the support plate 1 exposes most of the back surface of the semiconductor wafer W so that it can be viewed, the appearance inspection of the semiconductor wafer W is facilitated, and for example, circuit patterns are formed on the front and back surfaces of the semiconductor wafer W. Even in the case where they are respectively formed, the probe can be easily brought into contact with not only the front surface of the semiconductor wafer W but also the back surface of the semiconductor wafer W through the hollow 2. Therefore, both surfaces of the semiconductor wafer W can be inspected at the same time, and the circuit continuity inspection can be significantly smoothed, speeded up, and facilitated.

  In addition, since the support plate 1 and the holding layer 4 having high rigidity can be appropriately adhered to each other and used for the inspection process while correcting the warp of the semiconductor wafer W, even if the semiconductor wafer W is thin and easily warped, At this time, the semiconductor wafer W does not warp in a bowed shape, and smooth and easy probe inspection and appearance inspection can be greatly expected. In particular, when visual inspection is performed on the semiconductor wafer W, the focus of the inspection portion can be accurately adjusted, so that the reliability of the inspection and the amount of processing are not reduced. Furthermore, since the semiconductor wafer W is held in close contact with the adhesive holding layer 4 instead of the adhesive tape, the adhesive paste of the adhesive tape does not adhere to the semiconductor wafer W.

Next, FIG. 3 shows a second embodiment of the present invention. In this case, a flat circular reinforcing layer 10 covering the hollow 2 is detachably attached to the back surface of the thin support plate 1. I have to.
The reinforcing layer 10 is made of various rigid plates, for example, and is formed into a flat circular shape or a ring shape as necessary. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and since the reinforcing layer 10 is adhered to the support plate 1, the support plate is used when the conduction inspection of the front and back surfaces of the semiconductor wafer W is not required. It is clear that the rigidity can be improved when 1 is thin and easy to bend.

  Next, FIG. 4 shows a third embodiment of the present invention. In this case, the support plate 1 is formed in a flat frame shape and its hollow 2 is rectangular, and the inner and outer peripheral edges of the surface of the support plate 1 are shown. The flexible holding layer 4 that holds the peripheral edge of the flat rectangular glass substrate G is covered on the part. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as the above embodiment can be expected, and also when holding the glass substrate G that is not contaminated instead of the semiconductor wafer W, the substrate holding jig can be used. It is clear that the application can be expanded.

It is a section explanatory view showing typically an embodiment of a substrate holding jig concerning the present invention. It is a plane explanatory view showing typically an embodiment of a substrate holding jig concerning the present invention. It is a section explanatory view showing typically a 2nd embodiment of a substrate holding jig concerning the present invention. It is a plane explanatory view showing a 3rd embodiment of a substrate holding jig concerning the present invention typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support plate 2 Hollow 3 Recess hole 4 Holding layer 5 Support protrusion 6 Exhaust hole 10 Reinforcing layer G Glass substrate (board | substrate)
W Semiconductor wafer (substrate)

Claims (2)

  A substrate holding jig for holding a substrate on a holding layer, which is a flexible support for detachably holding a hollow support plate and a peripheral portion of the substrate that covers the surface of the support plate and covers the hollow of the support plate A holding layer, a support projection formed in a recessed hole on the surface of the support plate to support the holding layer, and an exhaust hole provided in the support plate and communicating with the recessed hole covered by the holding layer. A substrate holding jig.   The substrate holding jig according to claim 1, wherein a reinforcing layer is detachably attached to the back surface of the support plate.

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