JP2007134391A - Holding tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding tool excellent in durability which can hold a bonded article with a sufficient holding force and can remove the article easily. <P>SOLUTION: The holding tool 1 comprises a substrate 10 having a circumferential wall portion 20, at least one protrusion 30 formed in an internal space 22 surrounded by the circumferential wall portion 20, and a vent 40 communicating with a gap between the circumferential wall portion 20 and the protrusion 30, and an adhesive sheet 50 bonded or applied tightly onto the substrate 10 and having a weak-adhesive portion or a nonadhesive portion on an upper surface located above the protrusion 30 wherein the protrusion 30 is equipped with a top having a curved surface portion or a beveled portion 33. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a holding jig. More specifically, the present invention relates to a holding jig that can hold an object to be bonded with a sufficient holding force and can be easily removed, and has excellent durability.

  Conventionally, in the production of electronic components such as silicon wafers, flexible printed boards, glass plates for large screen display devices, ceramic capacitors, coil filters, etc., the thin plates are easily damaged, Since electronic parts and the like are difficult to fix in place and easily fall over, generally, these thin plate-like objects or electronic parts are fixed to a holding jig or the like, for example, a polishing process, a pattern forming process, a dicing process, etc. A manufacturing process or conveyance between manufacturing processes is performed.

  These thin plate-like objects or electronic parts are held in a state fixed to a holding jig during the manufacturing process and / or during the transfer between the manufacturing processes, and after the manufacturing process is completed and / or transferred. Later, it is removed from the holding jig. Accordingly, the holding jig for holding the thin plate-like object or electronic component can securely hold the thin plate-like object or electronic component or the like, and can easily remove the thin plate-like object or electronic component or the like when necessary. Characteristics are required.

  As such a holding jig, for example, in a holding device that applies electrostatic force, a substrate holding chuck that holds a substrate by vacuum suction, a wall that forms a negative pressure when vacuum sucking the substrate, A plurality of auxiliary supports that suppress deformation of the substrate during vacuum suction, and at least the auxiliary supports out of the wall and the auxiliary supports are formed to protrude on the surface of the glass substrate. Chuck (refer to Patent Document 1), holding a small component, characterized in that at least a surface portion is formed of a rubber elastic material having adhesiveness, and the small component can be held tightly on the elastic material surface by the adhesive force. A jig (see Patent Document 2) and the like can be mentioned.

  However, the holding device to which the electrostatic force is applied has a problem that it is very expensive and large in size, requires a high voltage, and charges remain on a thin plate or electronic component removed from the holding device. .

  Further, since the substrate holding chuck is for fixing the substrate by vacuum suction, it is necessary to always maintain the suction state during the manufacturing process and / or transporting, and the structure and manufacturing method of the holder itself are complicated. It was expensive. Even if the substrate holding chuck needs to be used in a vacuum chamber, the substrate holding chuck cannot be vacuumed due to the relationship with the pressure in the vacuum chamber.

  On the other hand, since the holding jig has adhesiveness on the entire surface of the elastic member, even if the adhesive force is weak, the entire surface of the small component is in close contact with the surface of the elastic member. The contact area with the surface of the elastic member is large, and it may be difficult to remove these small parts from the elastic member when necessary. For this reason, it is necessary to remove the small component with a large force over the adhesive force, and there is a problem that the small component is deformed or damaged such as cracking or chipping.

  By the way, even in the holding jig, it is required to have a durability that can securely hold a thin plate-like object or an electronic component over a long period of time or many times, and can be easily removed when necessary. Needless to say.

  However, since the substrate holding chuck described in Patent Document 1 fixes the substrate by vacuum suction, there is a problem that if the wall body is damaged, the substrate cannot be reliably held and durability is lowered. there were.

  Further, when an electronic component such as a ceramic capacitor is held on the holding jig described in Patent Document 2, the electronic component or the like is removed by rubbing the surface of the elastic member with a spatula-like member. At this time, if the surface of the elastic member is rubbed more than necessary and the surface of the elastic member is cut, there is a problem that the adhesive force of the elastic member is lowered and the durability of the holding jig is inferior.

JP 2000-286329 A Japanese Examined Patent Publication No. 7-93247

  An object of the present invention is to solve the above problems, and to provide a holding jig that can hold an object to be adhered with a sufficient holding force and can be easily removed, and has excellent durability. is there.

As means for solving the above problems,
The first aspect includes a peripheral wall portion, at least one convex body formed in an internal space surrounded by the peripheral wall portion, and a vent hole communicating with a gap portion between the peripheral wall portion and the convex body. A base, and an adhesive sheet that is adhesively fixed or tightly fixed on the base and has a weak adhesive portion or a non-adhesive portion on an upper surface located on the convex body, and the convex body is a curved surface portion or a chamfer. It is a holding jig characterized by comprising a top portion having a portion,
Claim 2 is the holding jig according to claim 1, wherein the top portion has a top surface.
A third aspect of the present invention is the component holding jig according to the first or second aspect, wherein the convex body is formed with an enlarged diameter portion that gradually increases in outer diameter at the bottom thereof.
Claim 4 is the holding jig according to any one of claims 1 to 3, wherein at least part of the surface of the convex body is roughened.
Claim 5 is the holding jig according to any one of claims 1 to 4, wherein the gap portion has a roughened bottom surface.
Claim 6 is the holding jig according to any one of claims 1 to 5, wherein the adhesive sheet is formed of silicone rubber or fluorine-based rubber.
According to a seventh aspect of the present invention, the holding jig is located on the gap portion by sucking a gas in a closed space formed by closing the gap portion with the adhesive sheet from the outside through the vent hole. The pressure-sensitive adhesive sheet is elastically deformed toward the substrate side, and an object to be bonded that is adhesively held on the pressure-sensitive adhesive sheet can be removed. This is a holding jig.

  According to the holding jig according to the present invention, the object to be adhered is held with sufficient adhesive force by the weak adhesive part and the strong adhesive part of the adhesive sheet during the manufacturing process and / or during the transportation, and the manufacture. After the completion of the process and / or after conveyance between manufacturing processes, the strong adhesive part of the adhesive sheet is peeled off from the adherend by elastically deforming the strong adhesive part of the adhesive sheet. In this state, the adhesive sheet in contact with the object to be adhered is a weakly adhesive part or a non-adhesive part, so that the object to be adhered can be removed with only a slight force or by tilting the holding jig. it can. Therefore, when the adherend is removed from the adhesive sheet, it is possible to reliably prevent the adherend from being deformed or damaged.

  In addition, according to the holding jig according to the present invention, the adhesive sheet is repeatedly elastically deformed many times in the manufacturing process and / or conveyance of the adherend, and the sticking object is repeatedly held and removed. In addition, since the convex body of the substrate has a top portion having a curved surface portion or a chamfered portion, it is possible to prevent the adhesive sheet from being cracked, pinholes, etc., or damaged. Therefore, even if the physical properties of the adhesive sheet are not changed, the object to be adhered can be securely held for a long time or many times, and easily removed, and the durability of the adhesive sheet and the holding jig can be improved. Can be improved.

  The holding jig 1 which is one Example of this invention is demonstrated with reference to FIGS.

  The holding jig 1 is used when manufacturing and transporting an object to be bonded, and includes a base 10 and an adhesive sheet 50 as shown in FIG.

  Examples of the adherend to be held by the holding jig 1 include various parts, various semi-finished products, various finished products, etc., but are easily damaged or damaged such as thin plate-like products, electronic components, etc. It is advantageous that it is difficult. Examples of the thin plate-like material include a silicon wafer, a flexible printed board, and a glass plate for a large screen display device. Examples of the electronic component include a ceramic capacitor and a coil filter. A thin disc-shaped silicon wafer 80 is held by the holding jig 1 shown in FIG.

  As shown in FIGS. 1 and 2, the base body 10 includes a peripheral wall portion 20, four convex bodies 30 formed in an internal space 22 surrounded by the peripheral wall portion 20, the peripheral wall portion 20 and the convex portions. And a ventilation hole 40 communicating with the gap 23 (see FIG. 2) of the shaped body 30.

  The base 10 is formed in a substantially square plate shape and has a desired size corresponding to the size, number, etc. of the silicon wafer 80 to be held. The substrate 10 is made of a material having a strength that does not deform even under reduced pressure or vacuum. Examples of such a material include metals such as carbon steel, stainless steel, aluminum alloy, and nickel alloy, and porous ceramics. And a porous material such as resin, glass, or a composite thereof. The base 10 is made of stainless steel or aluminum alloy from the viewpoint of workability and operability.

  The thickness of the substrate 10 (excluding the peripheral wall portion described later) may be determined as appropriate depending on the intended use. However, in the case of simply transporting the adherend, it may be about 50 μm or more. When used, the thickness may be about several mm or more.

  As shown in FIGS. 1 and 2, the peripheral wall portion 20 is formed in a convex shape as a frame on the peripheral portion of the base body 10 so as to surround the surface of the base body 10. Therefore, an inner space 22 having an open upper surface is formed by the surface of the peripheral wall portion 20 and the base 10. The peripheral wall portion 20 has a top surface 21 that supports an adhesive sheet 50 to be described later and that is adhesively fixed or closely fixed.

  The peripheral wall part 20 should just be formed so that the adhesive sheet 50 mentioned later may be supported, it may be adhesively fixed or closely fixed, and the said interior space 22 may be obstruct | occluded airtightly with the adhesive sheet 50. FIG. As shown in FIGS. 1, 2, 5, and 6, in the holding jig 1 according to one embodiment of the present invention, the peripheral wall portion 20 has a cross-sectional area from a predetermined position toward the top surface 21. The wall surface on the inner space 22 side of the peripheral wall portion 20 is formed so as to gradually become smaller and gradually increase from a position below the predetermined position toward the lower side. When the peripheral wall portion 20 is formed in this way, even if the adhesive sheet described later is repeatedly elastically deformed many times, it is more sure that the adhesive sheet will be cracked, pinholes, etc., or damaged. Can be prevented. The height of the peripheral wall portion 20 is substantially the same as the height of the convex body 30 described later.

  As shown in FIG. 1 and FIG. 2, the convex body 30 is separated from the peripheral wall portion 20 in the internal space 22 surrounded by the peripheral wall portion 20 and is provided with a substantially uniform interval. A total of four are formed each. The convex body 30 cooperates with the peripheral wall portion 20 to support an adhesive sheet 50 to be described later, and is adhesively fixed or closely fixed.

  As shown in FIG. 1 to FIG. 3, FIG. 5 and FIG. 6, the convex body 30 has a body portion 31 formed on a substantially square prism at a predetermined height, and gradually cut off at the bottom of the body portion 31. The diameter-enlarged portion 36 having a truncated cone shape or a prismatic shape having a large area, the four chamfered portions 33 continuously reduced from the side surface of the body portion 31, and these chamfered portions 33, and these And a top portion 32 having a flat top surface 34 continuous from the chamfered portion 33. In other words, the convex body 30 is formed on the body portion 31 formed in a substantially square prism, the diameter-enlarged portion 36 formed in a substantially square quadrangular pyramid shape formed in the bottom portion thereof, and the upper portion thereof. And a top 32 formed in a substantially square quadrangular pyramid shape. Furthermore, the convex body 30 is formed of the body portion 31, the enlarged diameter portion 36, and the top portion 32, and on each side thereof, the enlarged diameter portion 36 formed in a flange shape at the lower portion thereof, and the upper portion thereof. There are two ridge angles having an obtuse angle from the top surface 34 of the top portion 32 to the body portion 31. When the chamfered portion 33 is formed on the convex body 30, even if the adhesive sheet 50 described later is repeatedly elastically deformed many times, the adhesive sheet 50 is cracked, pinholes, etc., or damaged. This can be prevented, and the durability of the adhesive sheet 50 and the holding jig 1 can be improved. Further, when the diameter-expanded portion 36 is further formed on the convex body 30, the bottom of the closed space 45 described later has a gentle shape, and the convex portion 30 and the gap portion are depressed into the closed space 45. The bending angle with respect to the pressure-sensitive adhesive sheet in close contact with 23 is increased, and the durability of the pressure-sensitive adhesive sheet and the holding jig is further improved.

  All of the four convex bodies 30 are formed at a height substantially equal to the height of the peripheral wall portion 20. When the peripheral wall portion 20 and each convex body 30 are formed at substantially the same height as described above, the adhesive sheet 50 can be reliably supported on the base 10 and can be adhesively fixed or closely fixed, The inside of the closed space 45 formed by closing the gap portion 23 between the peripheral wall portion 20 and the convex body 30 with the adhesive sheet 50 can be reliably decompressed or evacuated.

  The size of the convex body 30 may be any size as long as the pressure-sensitive adhesive sheet 50 can be securely fixed or firmly fixed, and can support the pressure-sensitive adhesive sheet 50 holding the silicon wafer 80. It is determined according to the number of convex bodies 30 formed in the internal space 22, the silicon wafer 80, and the like. The convex body 30 is formed of the same material as the base body 10.

  One of the vent holes 40 communicates with the peripheral wall portion 20 and the gap portion 23 of the convex body 30, and the other is connected to an external suction device such as a vacuum pump (not shown). . The ventilation hole 40 sucks the gas existing in the closed space 45 by the suction device, makes the closed space 45 in a reduced pressure state or a vacuum state, and closes the adhesive sheet 50 located above the closed space 45 in the closed space. 45 is elastically deformed.

  As shown in FIG. 2, the vent hole 40 includes three vent pipe portions 41 </ b> A, 41 </ b> B, and 41 </ b> C and openings 42 </ b> A, 42 </ b> B, and 42 </ b> C that connect the vent pipe portions 41 </ b> A to 41 </ b> C and the gap portion 23. Has been. The opening 43 of the opening 42 is formed in the gap 23 (on the surface of the substrate 10) so as to surround the convex body 30 on the extension of each diagonal line of the convex body 30. Accordingly, a total of nine openings 43 are formed in the substrate 10.

  The hole diameters of the vent pipe portions 41 </ b> A to 41 </ b> C are preferably increased within a range where both high suction efficiency and strength of the base body 10 can be achieved. The opening 43 of the opening 42 may have an opening diameter that can achieve high suction efficiency without sucking the elastically deformed adhesive sheet 50 into the opening 42. It can be set to about 3 mm. The vent pipe 40 is preferably composed of an opening portion 42 having an opening diameter of about 0.2 to 3 mm and a vent pipe portion 41 having a larger hole diameter than the opening portion 42.

  The ventilation pipe part 41 and the opening part 42 should just have cross-sectional shapes, such as circular, an ellipse, a polygon, and a slit shape, and it is good to be circular or an ellipse from a viewpoint of manufacturability.

  If the said base | substrate 10, the said surrounding wall part 20, and the said convex-shaped body 30 can be formed in a desired shape with the said material, those manufacturing methods will not be specifically limited, For example, vacuum forming, injection molding, gold | metal | money It is formed by mold forming, cutting, electric discharge machining or the like. The base body 10 is preferably formed integrally with the peripheral wall portion 20, the convex body 30, and the vent hole 40, but each may be manufactured separately. That is, the base 10 may be formed by separately manufacturing the peripheral wall portion 20 and the convex body 30 and bonding and fixing them onto the surface of the base 10. For example, the peripheral wall portion 20 may be formed as a frame having an opening capable of accommodating the base body 10, and the base body 10 may be housed in the opening, and a member formed on the prism may be fixed to the peripheral edge portion of the base body 10. Then, it may be formed.

  An adhesive sheet 50 is supported on the peripheral wall portion 20 and the convex body 30 of the base body 10 and is adhesively fixed or closely fixed. As a result, the gap 23 is closed to form a closed space 45. The adhesive sheet 50 holds the silicon wafer 80 and easily releases the silicon wafer 80 and the like when the closed space 45 is in a reduced pressure state or a vacuum state. The adhesive sheet 50 is an elastic sheet having an adhesive surface so as to hold the silicon wafer 80 and elastically deform into the closed space 45.

The entire bottom surface of the adhesive sheet 50 is adhesive, and the adhesive sheet 50 is adhesively fixed or closely fixed to the top surface 21 of the peripheral wall portion 20 and the top surface 34 of the convex body 30 by this bottom surface. The On the other hand, as shown in FIG. 4, the upper surface of the pressure-sensitive adhesive sheet 50 is located on the convex body 30 when the pressure-sensitive adhesive sheet 50 is adhesively fixed or tightly fixed on the substrate 10, and the convex shape It has a weak adhesive part or non-adhesive part 51 having approximately the same size as the top surface 34 of the body 30 and a strong adhesive part 52 other than the weak adhesive part or non-adhesive part 51. Here, the adhesive strength of the strong adhesive portion 52 of the adhesive sheet 50 is preferably 1 to 50 g / mm ² , and the weak adhesive portion 51 has an adhesive strength weaker than the adhesive strength of the strong adhesive portion 52. If you do.

The adhesive strength in the strong adhesive portion 52 is obtained as follows. First, a suction fixing device (for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd.) or a vacuum suction chuck plate for horizontally fixing the adhesive sheet, and a cylinder with a diameter of 10 mm at the tip of the measurement unit. A load measuring device provided with a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) with a contact made of stainless steel (SUS304) made is prepared. An adhesive sheet is fixed on this test stand, and the measurement environment is set to 21 ± 1 ° C. and humidity 50 ± 5%. Next, the contact attached to the load measuring device is lowered until it comes into contact with the measurement site of the adhesive sheet at a speed of 20 mm / min, and then the contact is measured at a predetermined load on the measurement site. Press vertically for 3 seconds against the part. Here, the predetermined load is set to 25 g / mm ² . Next, the contact is pulled away from the site to be measured at a speed of 180 mm / min, and the pulling load measured by the digital force gauge at this time is read. This operation is performed at a plurality of locations of the measurement site, the plurality of separation loads obtained are arithmetically averaged, and the average value obtained is used as the adhesive force of the rubber elastic member. This measurement method may be performed manually, but may be performed automatically using, for example, a device such as a test stand (for example, trade name: VERTICAl MODEL MOTORIZED STAND series, manufactured by Imada Co., Ltd.). .

  The pressure-sensitive adhesive sheet 50 has a thickness of about 0.05 to 2 mm and preferably has a center line average roughness Ra (JIS B0601-1982) of 0.8 μm or less. If the thickness of the pressure-sensitive adhesive sheet 50 is less than 0.05 mm, the mechanical strength of the pressure-sensitive adhesive sheet 50 itself may be reduced, and the durability of the pressure-sensitive adhesive sheet 50 itself may not be sufficient. Further, elastic deformation is unlikely to occur, and even if the closed space 45 is depressurized or evacuated, the adhesive sheet 50 does not sufficiently sink into the closed space 45 and the silicon wafer 80 cannot be easily removed. is there. When the center line average roughness Ra of the adhesive sheet 50 is within the above range, the adhesive force of the adhesive sheet 50 is uniform and strong.

  The pressure-sensitive adhesive sheet 50 can be formed of various elastomers such as silicone rubber, fluorine rubber, urethane elastomer, natural rubber, styrene-butadiene copolymer elastomer, etc., but silicone rubber having excellent strength and weather resistance, fluorine System rubber is preferred. Among these, the rubber hardness (JIS K6253 [durometer E]) is particularly preferably about 5 to 60. If the rubber hardness of the adhesive sheet 50 is less than 5, the adhesive strength is strong and the silicon wafer 80 may not be easily removed. On the other hand, if it exceeds 60, the adhesive strength is weak and the silicon wafer 80 is sufficiently removed. May not be able to be held with a strong adhesive force.

  As said silicone rubber, the silicone rubber composition containing crosslinking agents, such as organopolysiloxane, a silica type filler, and a peroxide, is mentioned, for example. Examples of the fluorine-based rubber include a fluorine-based rubber containing a vinylidene fluoride / hexafluoropropylene copolymer, a filler such as carbon, a crosslinking aid such as trial isocyanate, and a crosslinking agent such as peroxide. A composition.

  The adhesive sheet 50 is formed into a sheet shape by a known method using the material. In order to make a part of the upper surface of the adhesive sheet 50 a weak adhesive part or a non-adhesive part 51, for example, a masking member having a desired pattern is placed on the upper surface of the adhesive sheet 50 with a release film interposed therebetween. And then irradiate the masking member with ultraviolet rays. The weak adhesive part or the non-adhesive part 51 adjusted to a desired adhesive force can be formed by the irradiation amount of ultraviolet rays.

  In addition to this method, (1) a weakly adhesive portion or a non-adhesive portion 51 is formed on a portion where the weakly-adhesive portion or the non-adhesive portion 51 is formed. A method of coating the material, (2) a method of increasing the surface roughness of the portion forming the weakly adhesive portion or the non-adhesive portion 51, and (3) a weak adhesive sheet or non-adhesive as a whole instead of the adhesive sheet 50 A method of forming a strong adhesive portion 52 by coating a pressure sensitive adhesive material on the upper surface of the sheet may be used.

  The holding jig 1 includes the base body 10 and the adhesive sheet 50, and gas in a closed space 45 formed by closing the gap portion 23 with the adhesive sheet 50 is passed through the vent hole 40. The silicon wafer 80 held on the adhesive sheet 50 can be removed by sucking from the outside and elastically deforming the adhesive sheet 50 located on the gap 23 toward the base 10 side. Yes.

  The operation of the holding jig 1 will be described. As an initial state of the holding jig 1, as shown in FIG. 1 and FIG. 5, the adhesive sheet 50 is adhesively fixed or tightly fixed on the base body 10 to form a closed space 45. The silicon wafer 80 is placed on the adhesive sheet 50. As described above, on the upper surface of the adhesive sheet 50, the portion located on the convex body 30 is a weak adhesive portion or a non-adhesive portion 51, and the other portion is a strong adhesive portion 52. Accordingly, in this initial state, the strong adhesion portion 52 of the adhesive sheet 50 is in close contact with the bottom surface of the silicon wafer 80, and thus the silicon wafer 80 is held by the adhesive sheet 50. Therefore, in this initial state, the silicon wafer 80 is held by the holding jig 1 with a sufficient adhesive force, and the silicon wafer 80 can be carried out or carried together with the holding jig 1.

  In this initial state, only the silicon wafer 80 is placed on the adhesive sheet 50 and is held by the holding jig 1 with sufficient adhesive force. Therefore, the silicon wafer 80 can be held with a simple configuration and a small size and low energy.

  When the silicon wafer 80 is removed from the holding jig 1 after the manufacturing process of the silicon wafer 80 is finished or transferred, as shown in FIG. 6, a suction device or the like installed outside the holding jig 1 ( (Not shown) is connected to the vent hole 40, the gas in the closed space 45 is sucked, and the inside of the closed space 45 is depressurized or vacuumed. Then, the adhesive sheet 50 having elasticity is elastically deformed and depressed in the closed space 45 as shown in FIG. Since the bottom surface of the adhesive sheet 50 has adhesiveness, the adhesive sheet 50 depressed in the closed space 45 adheres to the bottom surfaces of the peripheral wall portion 20, the convex body 30 and the gap portion 23. Even if the suction by the suction device is stopped, this state may be maintained. In this suction state, as shown in FIG. 6, the strong adhesion portion 52 on the upper surface of the adhesive sheet 50 is separated from the bottom surface of the silicon wafer 80. As a result, the silicon wafer 80 is only positioned on the weakly or non-adhesive portion 51 of the adhesive sheet 50 and is no longer tightly fixed. Therefore, the silicon wafer 80 can be removed with a slight force or by simply tilting the holding jig 1, and it is ensured that the silicon wafer 80 is deformed or damaged when the silicon wafer 80 is removed. Can be prevented.

  By repeating the initial state and the suction state in this way, the silicon wafer 80 can be easily held and removed. In the manufacturing process and / or conveyance of the silicon wafer 80, the initial state and the suction state are repeated, the adhesive sheet 50 is repeatedly elastically deformed many times, and the silicon wafer 80 is held and removed. As described above, the peripheral wall portion 20 of the base body 10 has a cross-sectional area that gradually decreases from the predetermined position toward the top surface 21, and gradually increases from a position below the predetermined position toward the lower side. As described above, the convex body 30 of the base 10 has a cross-sectional area that decreases from the body portion 31, the enlarged diameter portion 36, and the body portion 31 toward the tip. The adhesive sheet 50 includes the four chamfered portions 33 continuous from the side surface of the body portion 31 and the top portion 32 having the flat top surface 34 continuous from the chamfered portions 33. Crack or a pin hole or the like occurs, or may be prevented from being damaged. Therefore, without changing the physical properties of the adhesive sheet 50, the silicon wafer 80 can be reliably held for a long time or many times, and can be easily removed when necessary. The tool 1 has high durability.

  While the holding jig 1 according to the present invention has been described above, the present invention is not limited to the holding jig 1 and can be appropriately changed in design within the scope of the present invention.

  For example, although the base 10 is formed in a substantially square plate-like body, it may be formed in an arbitrary shape according to the shape of the adherend, the manufacturing process, workability, and the like. For example, plate-like bodies, such as a polygon, such as a rectangle, a pentagon, and a hexagon, a circle, an ellipse, an indeterminate form, or the shape which combined these, are mentioned.

  The substrate 10 is made of stainless steel or aluminum alloy, but may be made of a porous material such as porous ceramic. In this case, it is not necessary to form the vent hole 40 in particular, but it is necessary to seal the side and bottom surfaces of the base 10 so that the closed space 45 is airtight.

  In order to improve the durability of the adhesive sheet and the holding jig to a higher level, the peripheral wall portion 20 has a cross-sectional area at a predetermined position as shown in FIGS. 1, 2, 5, and 6. The wall surface of the peripheral wall portion 20 on the side of the internal space 22 is formed so as to gradually decrease from the position toward the top surface 21 and gradually increase downward from the position below the predetermined position. In order to improve the durability of the adhesive sheet and the holding jig, the peripheral wall portion 20 does not necessarily have to be formed in this manner, and has a substantially identical cross-sectional area from the bottom to the top surface 21. May be.

  As shown in FIGS. 1, 3, 5, and 6, the convex body 30 has an upper portion that decreases in cross-sectional area from the body portion 31 toward the tip, and is continuous from the side surface of the body portion 31. 4 and the top 32 having a flat top surface 34 continuous from the chamfers 33. However, the configuration of the top 32 is not limited to this. For example, FIG. As shown in a), the upper part of the convex body has a predetermined cross-sectional area that decreases from the upper part of the body part 31A formed in a cylinder to a predetermined height toward the tip, and continues from the peripheral side surface of the body part 31A. The curved surface portion 35 having a curvature R and a top portion 32A having a top surface 34 may be formed, and although not shown, a cross-sectional area from the body portion 31 of the body portion 31 of the prism to the tip. Decreases, and has a predetermined curvature R continuous from the side surface of the body portion 31. As the top 32A having a curved surface portion 35, it may be formed. Thus, when the upper part of the convex body is formed as a top part having the curved surface part 35 having a predetermined curvature R, since the top part 32 does not have a ridge angle, the ridge angle has an influence on the adhesive sheet. As a result, the durability of the adhesive sheet and the holding jig is further improved. If the predetermined curvature R is too small, the adhesive sheet is likely to be damaged. Therefore, the curvature R should be large, for example, about 0.1 mm or more.

  The convex body 30 has a top surface 34 as shown in FIGS. 1, 3, 5, and 6, but has a top surface as shown in FIG. 7B. It does not have to be. The convex body 30B includes a substantially hemispherical top portion 32B formed on a body portion 31B formed in a cylindrical shape up to a predetermined height. As described above, when the convex body has the substantially hemispherical top portion 32B, the adhesive sheet can be uniformly supported by the entire top portion 32B, so that the durability of the adhesive sheet and the holding jig is further increased. improves. The top portion 32B may have a shape that does not have a corner portion such as a substantially semi-elliptical shape or a substantially semi-egg shape other than a substantially hemispherical shape.

  As shown in FIGS. 1 and 2, the convex body 30 is formed in a substantially square prism. The shape of the convex body supports the adhesive sheet and can be adhesively fixed or closely fixed. The shape may be any shape, and for example, it may be formed into a prismatic shape such as a rectangular, pentagonal, hexagonal or other polygonal prism, a cylinder, an elliptical column, an indeterminate shape, or a combination of these. Further, the convex body may be a columnar body 30C formed in a tubular shape, as shown in FIG. Similar to the convex body 30, the convex body 30C has a body portion formed in a hollow center in a substantially square prism, the enlarged diameter portion 36, the top surface 34, and surfaces formed on both sides thereof. And a top portion having a take-up portion 33.

  The convex body 30 is formed in a substantially square prism as shown in FIGS. 1 and 2, but the shape of the convex body is like a convex body 30D shown in FIG. 8B. In addition, the four corners of the prism may be formed in a curved shape having an arbitrary curvature R ′.

  As shown in FIGS. 1 to 3, 5, and 6, the convex body 30 has a truncated cone-shaped or prismatic-shaped enlarged diameter portion 36 that gradually increases in cross-sectional area at the bottom of the body portion 31. Although formed, as shown in FIG. 9B, a conical or prismatic enlarged portion 36 formed with a curved surface having an arbitrary curvature R ″ is formed. It may be. Moreover, in order to improve the durability of the pressure-sensitive adhesive sheet and the holding jig to a higher level, the convex body 30 has the body portion 31 as shown in FIGS. 1 to 3, 5, and 6. A conical or prismatic enlarged portion 36 having a gradually increasing cross-sectional area is formed at the bottom, but in order to improve the durability of the adhesive sheet and the holding jig, FIG. Like the convex body 30 </ b> E shown, this enlarged diameter portion may not be formed.

  The convex body 30 may have at least a part of its surface roughened. When at least a part of the surface of the convex body is roughened, the adhesive sheet that sinks into the closed space 45 strongly adheres to the surface of the convex body when the closed space 45 is decompressed or vacuumed. When the decompression or vacuum of the closed space 45 is released, the adhesive sheet can quickly return to the initial state, and the durability of the adhesive sheet and the holding jig is further improved. As shown in FIG. 10, the convex body 30 </ b> G has a roughened entire side surface except for the top surface 34 of the surface. The roughening of the convex body can be performed by a sandblasting method, an ion milling method, a dry etching method, a wet dry etching method, mechanical processing such as ultrasonic processing or polishing.

  As shown in FIGS. 1, 2, 5, and 6, the vent hole 40 has independent vent pipe portions 41 </ b> A, 41 </ b> B, and 41 </ b> C. It may be a vent pipe part. The vent hole 40 is formed by the vent pipe portion 41 extending in the length direction of the base body 10 and the opening portion 42 extending in the thickness direction of the base body 10. An opening that penetrates in the direction may be provided, and the opening formed in the bottom surface of the substrate may be connected to a suction device or the like.

  As shown in FIGS. 2, 5, and 6, the opening 42 has a substantially uniform opening diameter in the thickness direction of the base 10, but the opening diameter of the opening 42 is the thickness of the base. You may form it so that a vertical cross section may become trapezoid shape by enlarging or reducing gradually in the direction.

  The gap portion 23 may have a roughened bottom surface. When the bottom surface of the gap portion 23 is roughened, the adhesive sheet that sinks into the closed space 45 is prevented from sticking firmly to the bottom surface of the gap portion 23 when the closed space 45 is decompressed or vacuumed. When the decompression or vacuum of the closed space 45 is released, the adhesive sheet can quickly return to the initial state, and the durability of the adhesive sheet and the holding jig is further improved. The roughening of the gap can be performed by sandblasting, ion milling, dry etching, wet dry etching, ultrasonic processing, mechanical processing such as polishing, or the like.

  As shown in FIGS. 1, 2, 5, and 6, the base body 10 is separated from the peripheral wall portion 20 in the internal space 22, with a substantially uniform interval, and two vertical and horizontal portions in total. Although the four convex bodies 30 are formed, the base body is not limited to this form. For example, it is sufficient that at least one convex body is formed in the internal space, a plurality of convex bodies may be formed, and the position at which the convex body is formed is not particularly limited and is held. It is determined according to the adherend.

  As another example of the substrate, for example, the substrate shown in FIGS. The base 10A shown in FIG. 11 is shown in FIG. 7B at a substantially central portion of the internal space 22 in that the peripheral wall portion 20 is formed so as to have substantially the same cross-sectional area from the bottom to the top surface 21. Unlike the base body 10, one convex body 30 </ b> B is formed, and two vent holes 40 </ b> A having a total of four openings 43 are formed so as to surround the convex body 30 </ b> B. Yes. The number of the convex bodies 30B formed is not limited to one.

  The base 10B shown in FIG. 12 is opposed to the peripheral wall 20A and 20B in the internal space 22 in that the peripheral wall 20 is formed so as to have substantially the same cross-sectional area from the bottom to the top surface 21. Three convex bodies 30H having a predetermined width extending toward the peripheral wall portions 20B and 20A are formed, and four vent holes 40A having a total of eight openings 43 are formed so as to sandwich the convex body 30H. In that it differs from the substrate 10. The number of the convex bodies 30H formed is not limited to three. In addition, although these convex-shaped bodies 30H are also provided with the top part which has a curved surface part or a chamfering part, it is not illustrated.

  The base body 10C shown in FIG. 13 has five convex bodies 30I each having a predetermined width, which are connected to the peripheral wall portions facing each other from the respective peripheral wall portions, in the inner space 22, and the convex bodies 30I have a lattice pattern. This is different from the base 10 in that an opening 43 is formed in each lattice. The number of the convex bodies 30I formed is not limited to five. In addition, although these convex-shaped bodies 30I are also provided with the top part which has a curved surface part or a chamfering part, it is not illustrated.

  The entire bottom surface of the adhesive sheet 50 has adhesiveness, but the bottom surface of the adhesive sheet only needs to have adhesiveness only in a portion that contacts the peripheral wall portion and the convex body.

  The silicon wafer 80 is held by one holding jig 1 as shown in FIGS. 1, 5, and 6, but the silicon wafer 80 may be held by a plurality of holding jigs. For example, a holding jig is arranged at the center of the adherend and at least one peripheral edge or end, and a large silicon wafer, a glass plate for a large screen display device, etc. are held by two or more holding jigs. Also good.

  The closed space 45 is in a hollow state, but a porous elastic member may be inserted therein. When such an elastic member is inserted in the closed space, it is possible to shorten the time required for the adhesive sheet elastically deformed by the restoring force of the porous elastic member to return when the pressure is reduced or the vacuum is released. Have. The elastic member needs to have a porous open-cell structure, but the degree of continuity of the holes is such that the elastic member sufficiently contracts when the closed space is depressurized or evacuated. Good. If this elastic member is too hard, it will be difficult to shrink upon suction, while if it is too soft, the adhesive sheet may not be supported. Moreover, this elastic member should just be in contact with the bottom face of an adhesive sheet, and these do not need to adhere.

Example 1
A base 10D shown in FIG. 2 was produced using stainless steel. However, in the base body 10D, a total of 324 convex bodies 30 shown in FIG. 3 were formed in 18 vertical and horizontal directions, and one opening 43 was formed at a substantially central portion of the surface of the base body 10D. The size of the manufactured substrate 10D was 100 mm in length, 100 mm in width, and 6 mm in thickness.

Subsequently, the sheet | seat shown by FIG. 4 was produced from the silicone rubber composition (the Shin-Etsu Chemical Co., Ltd. make, product name: KE1950 10A / B) using the metal plate metal mold | die. The size of this sheet was 100 mm in length, 100 mm in width, and 0.5 mm in thickness. Next, the masking member formed in a pattern matching the pattern of the convex body 30 of the manufactured base body 10D was placed on the sheet with a release film interposed therebetween, and ultraviolet rays were irradiated from above the masking member. The ultraviolet irradiation dose was 2000 mJ / cm ² and the irradiation time was 5 minutes. In this way, an adhesive sheet 50A was produced.

  The produced pressure-sensitive adhesive sheet 50A was placed on the base 10D, and was adhesively fixed or closely fixed to the base 10D to obtain a holding jig 1A.

  A silicon wafer having a diameter of 80 mm was placed on and adhered to the adhesive sheet 50A of the holding jig 1A. Next, a vacuum pump was connected to the vent hole of the base body 10D, the closed space was decompressed, and the adhesive sheet 50A was depressed into the closed space. In this way, the silicon wafer was removed from the holding jig 1A.

  This operation was repeated until the adhesive sheet 50A was damaged, and the durability of the holding jig 1A was evaluated by the number of repetitions when the adhesive sheet 50A was damaged. As a result, the adhesive sheet 50A was damaged when the above operation was repeated 30,000 times.

(Example 2)
A holding jig 1B was created in the same manner as in Example 1 except that the convex body 30A shown in FIG. 7A was formed instead of the convex body 30. The durability of the produced holding jig 1B was evaluated in the same manner as in Example 1. As a result, the adhesive sheet 50A was damaged when the above operation was repeated 35,000 times.
(Example 3)
A holding jig 1 </ b> C was created in the same manner as in Example 1 except that the convex body 30 </ b> G shown in FIG. 10 was formed instead of the convex body 30. The convex body 30G was formed by sandblasting, and its surface roughness Ra (JIS B0601-1982) was 2.0 μm. The durability of the produced holding jig 1C was evaluated in the same manner as in Example 1. As a result, the adhesive sheet 50A was damaged when the above operation was repeated 40,000 times.
Example 4
A holding jig 1E was created in the same manner as in Example 1 except that the convex body 30E shown in FIG. 9A was formed instead of the convex body 30. The durability of the produced holding jig 1E was evaluated in the same manner as in Example 1. As a result, the adhesive sheet 50A was damaged when the above operation was repeated 20,000 times.
(Comparative Example 1)
A holding jig 1D was created in the same manner as in Example 1 except that a rectangular columnar convex body having a constant cross-sectional area in a plane parallel to the base body 10D was formed instead of the convex body 30. The durability of the produced holding jig 1D was evaluated in the same manner as in Example 1. As a result, the adhesive sheet 50A was damaged when the above operation was repeated 12,000 times.

  As is clear from the above results, when the convex body has a top portion having a curved surface portion or a chamfered portion, durability of the adhesive sheet and the holding jig is improved.

FIG. 1 is a schematic perspective view showing an example of a holding jig. FIG. 2 is a schematic top view showing an example of the substrate. FIG. 3 is a schematic side view showing an example of a convex body. FIG. 4 is a schematic perspective view showing an example of an adhesive sheet. FIG. 5 is a schematic cross-sectional view taken along line AA in FIG. 1 showing an initial state of the holding jig. FIG. 6 is a schematic cross-sectional view along the line AA in FIG. 1 showing the suction state of the holding jig. FIG. 7 is a schematic partial side view showing a modification of the convex body. FIG. 8 is a schematic top view showing a modification of the convex body. FIG. 9 is a schematic partial side view showing a modification of the convex body. FIG. 10 is a schematic side view showing a modification of the convex body. FIG. 11 is a schematic top view showing another example of the substrate. FIG. 12 is a schematic top view showing another example of the substrate. FIG. 13 is a schematic top view showing another example of the substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Holding jig 10 Base | substrate 20 Peripheral wall parts 21 and 34 Top surface 22 Internal space 23 Gap part 30 Convex body 31 Body part 32 Top part 33 Chamfering part 35 Curved part 36 Expanded part 40 Vent hole 41 Vent pipe part 42 Opening part 43 Opening 45 Closed space 50 Adhesive sheet 51 Weak or non-adhesive part 52 Strong adhesive part 80 Silicon wafer

Claims (7)

A base having a peripheral wall, at least one convex body formed in an internal space surrounded by the peripheral wall, and a vent hole communicating with a gap between the peripheral wall and the convex body; and
An adhesive sheet that is adhesively fixed or tightly fixed on the base and has a weakly adhesive part or a non-adhesive part on the upper surface located on the convex body,
The said convex-shaped body is provided with the top part which has a curved surface part or a chamfering part, The holding jig characterized by the above-mentioned.   The holding jig according to claim 1, wherein the top portion has a top surface.   The component holding jig according to claim 1, wherein the convex body has a diameter-expanded portion that gradually increases in outer diameter at the bottom.   The holding jig according to claim 1, wherein at least part of the surface of the convex body is roughened.   The holding jig according to claim 1, wherein a bottom surface of the gap portion is roughened.   The holding jig according to any one of claims 1 to 5, wherein the adhesive sheet is formed of silicone rubber or fluorine rubber. The holding jig sucks the gas in a closed space formed by closing the gap portion with the adhesive sheet from the outside through the vent hole, and the adhesive sheet located on the gap portion is removed. The holding jig according to any one of claims 1 to 6, wherein the object to be adhered is detachable by being elastically deformed toward the substrate side and adhered to the adhesive sheet.

Images