JP2010065305A5 - - Google Patents
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- Publication number
- JP2010065305A5 JP2010065305A5 JP2008235013A JP2008235013A JP2010065305A5 JP 2010065305 A5 JP2010065305 A5 JP 2010065305A5 JP 2008235013 A JP2008235013 A JP 2008235013A JP 2008235013 A JP2008235013 A JP 2008235013A JP 2010065305 A5 JP2010065305 A5 JP 2010065305A5
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- substrate
- film
- dummy
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 67
- 239000002184 metal Substances 0.000 claims 27
- 238000010438 heat treatment Methods 0.000 claims 24
- 238000004544 sputter deposition Methods 0.000 claims 20
- 238000000151 deposition Methods 0.000 claims 9
- 238000003860 storage Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000009751 slip forming Methods 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008235013A JP5195196B2 (ja) | 2008-09-12 | 2008-09-12 | スパッタリング装置及び半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008235013A JP5195196B2 (ja) | 2008-09-12 | 2008-09-12 | スパッタリング装置及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010065305A JP2010065305A (ja) | 2010-03-25 |
| JP2010065305A5 true JP2010065305A5 (cg-RX-API-DMAC10.html) | 2011-10-20 |
| JP5195196B2 JP5195196B2 (ja) | 2013-05-08 |
Family
ID=42191136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008235013A Expired - Fee Related JP5195196B2 (ja) | 2008-09-12 | 2008-09-12 | スパッタリング装置及び半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5195196B2 (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6149568B2 (ja) * | 2013-07-19 | 2017-06-21 | 三菱電機株式会社 | 半導体装置の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3869499B2 (ja) * | 1996-07-22 | 2007-01-17 | 大日本スクリーン製造株式会社 | 基板処理方法 |
| JP3737570B2 (ja) * | 1996-07-30 | 2006-01-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JPH10189719A (ja) * | 1996-12-27 | 1998-07-21 | Sony Corp | 半導体装置の製造方法 |
| JP4473410B2 (ja) * | 2000-05-24 | 2010-06-02 | キヤノンアネルバ株式会社 | スパッタリング装置及び成膜方法 |
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2008
- 2008-09-12 JP JP2008235013A patent/JP5195196B2/ja not_active Expired - Fee Related