JP2010064206A - Double-sided polishing device - Google Patents
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Abstract
Description
本発明は、ウエーハ等のワークの両面研磨装置に関する。 The present invention relates to a double-side polishing apparatus for a workpiece such as a wafer.
ワークの両面研磨装置は種々知られている。
特開平２−２９２１６７号公報（特許文献１）には、両面ラップ盤が開示されている。
この両面ラップ盤は、被加工物を上下の定盤で挟持し、その各定盤を回転させて被加工物の両面を同時にラッピングする両面ラップ盤において、上下各定盤は、一部分が相互に重なるように偏心状に保持され、その相互に重なる部分に、被加工物が保持され且つ回転駆動機構によって回転する薄板状キャリアが配置され、上下各定盤の重ならない部分に、それぞれの定盤の加工面を修正するそれぞれの修正リングが具備されてなる両面ラップ盤に構成されている。
Various types of double-side polishing apparatuses for workpieces are known.
Japanese Patent Laid-Open No. 2-292167 (Patent Document 1) discloses a double-sided lapping machine.
This double-sided lapping machine is a double-sided lapping machine in which a workpiece is sandwiched between upper and lower surface plates, and each surface plate is rotated to wrap both sides of the workpiece at the same time. Thin plate carriers that are held eccentrically so as to overlap each other and in which the workpieces are held and rotated by a rotation drive mechanism are arranged, and each surface plate is placed on a portion where the upper and lower surface plates do not overlap each other. The double-sided lapping machine is provided with respective correction rings for correcting the machining surface.
また、上記両面ラップ盤は、上下の定盤およびキャリアが同一方向に、かつ同一回転数（同一角速度）で回転されるようになっている。これにより、キャリアに保持されるワークの表裏面における定盤との間の相対摩擦距離が等しくなり、加工精度に優れるという利点がある。 In the double-sided lapping machine, the upper and lower surface plates and the carrier are rotated in the same direction and at the same rotation speed (same angular velocity). Thereby, the relative friction distance between the surface plate on the front and back surfaces of the work held by the carrier becomes equal, and there is an advantage that the processing accuracy is excellent.
しかしながら、上記の両面ラップ盤には次のような課題がある。
すなわち、この両面ラップ盤では、上下の定盤を一部が重なるようにずらして配置し、この重なった部分に１つのキャリアしか配置できないため、装置が大型化するにもかかわらず少ない枚数のワークしか処理できず、研磨効率がよくないという課題がある。
However, the above double-sided lapping machine has the following problems.
That is, in this double-sided lapping machine, the upper and lower surface plates are arranged so as to partially overlap each other, and only one carrier can be arranged on this overlapping part. However, there is a problem that the polishing efficiency is not good.
また、下定盤は、基台に適宜なベアリング機構を介して堅固に支持できるが、上定盤は下定盤に対して一部で重なった状態に配置されているので、上定盤には傾倒モーメントが作用する。上記従来の両面ラップ盤では、この上定盤にかかる傾倒モーメントを、上定盤の下面側に２つの修正リングを当接させて受け止める構成を採用している。この修正リングで上定盤の傾倒モーメントを受け止めるのは機構的に極めて厄介であり、上定盤の傾倒を完全には防げず、研磨精度に悪影響を与えるという課題がある。 In addition, the lower surface plate can be firmly supported on the base via an appropriate bearing mechanism, but the upper surface plate is arranged so as to partially overlap the lower surface plate. Moment acts. The conventional double-sided lapping machine employs a configuration in which the tilting moment applied to the upper surface plate is received by bringing the two correction rings into contact with the lower surface side of the upper surface plate. It is very troublesome mechanically to receive the tilting moment of the upper surface plate with this correction ring, and there is a problem that the tilting of the upper surface plate cannot be completely prevented and the polishing accuracy is adversely affected.
さらには、研磨装置として、ポリシング装置の場合には、研磨面に研磨布が貼付されるが、研磨布を介して修正リングにより上定盤の傾倒モーメントを受け止める場合には、研磨布に過大な摩擦力が作用し、研磨布の摩耗が著しく、したがって、特許文献１の構成は両面ラップ盤に採用できるとしても、ポリシング装置には採用できないという課題もある。
そこで、本発明は上記課題を解消すべくなされ、その目的とするところは、研磨効率を向上でき、また上定盤の傾倒を防止して精度のよい研磨を行える両面研磨装置を提供するにある。
Further, in the case of a polishing apparatus as a polishing apparatus, a polishing cloth is affixed to the polishing surface. However, when the tilting moment of the upper surface plate is received by the correction ring via the polishing cloth, the polishing cloth is excessively large. The frictional force acts and the abrasion of the polishing cloth is remarkable. Therefore, even if the configuration of Patent Document 1 can be adopted for a double-sided lapping machine, there is a problem that it cannot be adopted for a polishing apparatus.
Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a double-side polishing apparatus that can improve polishing efficiency and prevent the tilting of the upper surface plate and perform accurate polishing. .
本発明に係る両面研磨装置は、上面が研磨面とされた下定盤と、該下定盤の上方に上下動自在に支持され、下面が研磨面とされた上定盤と、該下定盤と上定盤との間に配置され、ワークを保持可能な透孔を有するキャリアと、前記上下定盤を軸線を中心として回転駆動する駆動装置と、前記キャリアを回転駆動するキャリア駆動装置とを具備し、上下定盤を回転させ、かつキャリアを回転させることにより、キャリアに保持されて上下定盤間に挟まれたワークの両面を研磨する両面研磨装置において、前記下定盤は、隣接する２つの下定盤を含み、該下定盤の中央部に中央ギアが配置されると共に、該下定盤の外側に外側ギアが配置されて前記キャリア駆動装置が構成され、前記キャリアは、該外側ギアと前記中央ギアとの間に噛合されて各下定盤上で回転する２つのキャリアを含み、前記上定盤は、前記隣接する２つの下定盤の上方に位置して該２つの下定盤に跨って配置され、下定盤上の前記２つのキャリアに保持されたワークを挟む１つの上定盤を含むことを特徴とする。 The double-side polishing apparatus according to the present invention includes a lower surface plate having an upper surface as a polishing surface, an upper surface plate supported above and below the lower surface plate, and having a lower surface as a polishing surface, and the lower surface plate and the upper surface plate. A carrier that is disposed between the surface plate and has a through hole capable of holding a workpiece; a driving device that rotationally drives the upper and lower surface plates around an axis; and a carrier driving device that rotationally drives the carrier. In the double-side polishing apparatus that polishes both surfaces of the work held between the upper and lower surface plates by rotating the upper and lower surface plates and rotating the carrier, the lower surface plate has two adjacent lower surface plates. And a center gear is disposed at the center of the lower surface plate, and an outer gear is disposed outside the lower surface plate to constitute the carrier driving device. The carrier includes the outer gear and the central gear. Meshed between each Including two carriers that rotate on a surface plate, the upper surface plate being positioned above the two adjacent lower surface plates and straddling the two lower surface plates, and the two carriers on the lower surface plate It includes one upper surface plate that sandwiches the workpiece held on the surface.
前記下定盤、上定盤およびキャリアが同方向に同一角速度で回転されることを特徴とする。
前記下定盤を、３つ以上同一円周上に位置して配置することができる。
あるいは、前記下定盤を、３つの下定盤が正三角形の頂点に位置するよう配置し、上定盤を、該３つの下定盤に共通に跨って配置するようにすることができる。
前記中央ギアは、前記下定盤の中心に配置された中心ギアであることを特徴とすることができる。
また、前記外側ギアは、隣接する下定盤に共用される共通ギアとすることができる。
The lower surface plate, the upper surface plate, and the carrier are rotated in the same direction at the same angular velocity.
Three or more lower surface plates can be arranged on the same circumference.
Alternatively, the lower surface plate can be arranged such that the three lower surface plates are positioned at the apexes of an equilateral triangle, and the upper surface plate can be disposed across the three lower surface plates in common.
The central gear may be a central gear arranged at the center of the lower surface plate.
The outer gear may be a common gear shared by adjacent lower surface plates.
また、前記下定盤および上定盤の研磨面に研磨布が貼付され、該研磨布の表面を整えるドレッサーが、前記下定盤と上定盤とが重ならない位置に配置されていることを特徴とする。
また、前記下定盤上にスラリーを供給するスラリー供給源を有することを特徴とする。
Further, a polishing cloth is affixed to the polishing surfaces of the lower surface plate and the upper surface plate, and a dresser for adjusting the surface of the polishing cloth is disposed at a position where the lower surface plate and the upper surface plate do not overlap. To do.
Moreover, it has a slurry supply source which supplies a slurry on the said lower surface plate, It is characterized by the above-mentioned.
本実施の形態では、上記のように、上定盤を２つもしくは３つの下定盤で受け止めているので、上定盤の傾きを防止でき、精度のよい研磨が行える。また、１つの上定盤と、２つもしくは３つの下定盤の重なった位置にそれぞれキャリアを配置でき、生産性を向上させることができる。また、上定盤を修正リングで受け止める構成としていないので、研磨パッドに対する負荷を軽減でき、したがって、ラップ盤のみならず、ポリシング装置にも適用できる。
さらには下定盤、上定盤およびキャリアを同一方向に同一角速度（回転数）で回転させるようにすると、キャリアに保持されているワークＷの表裏面における上下定盤との間の相対摩擦距離が等しくなり、精度のよい研磨が行える。
In the present embodiment, as described above, since the upper surface plate is received by two or three lower surface plates, the upper surface plate can be prevented from being tilted, and accurate polishing can be performed. In addition, carriers can be arranged at positions where one upper surface plate and two or three lower surface plates overlap each other, and productivity can be improved. In addition, since the upper surface plate is not configured to be received by the correction ring, the load on the polishing pad can be reduced, and therefore, it can be applied not only to a lapping machine but also to a polishing apparatus.
Furthermore, when the lower surface plate, the upper surface plate, and the carrier are rotated in the same direction at the same angular velocity (number of rotations), the relative friction distance between the upper and lower surface plates on the front and back surfaces of the workpiece W held by the carrier is increased. It becomes equal and can perform polishing with high accuracy.
以下本発明の好適な実施の形態を添付図面に基づいて詳細に説明する。
図１は両面研磨装置１０の概略的な平面図、図２はそのA-A線断面図である。
両面研磨装置１０は、上面が研磨面１２ａとされた下定盤１２と、下定盤１２の上方に位置して、支持基台（図示せず）にシリンダ機構（図示せず）等の公知の上下動機構を介して上下動自在に支持され、下面が研磨面１４ａとされた上定盤１４と、下定盤１２と上定盤１４との間に配置され、ワークＷを保持可能な透孔を有するキャリア１６と、上下定盤１２、１４を軸線を中心として回転駆動する公知の駆動装置（図示せず）と、キャリア１６を回転駆動するキャリア駆動装置とを具備する。
Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a schematic plan view of a double-side polishing apparatus 10, and FIG.
The double-side polishing apparatus 10 includes a lower surface plate 12 whose upper surface is a polishing surface 12a, and a known upper and lower surface such as a cylinder mechanism (not illustrated) on a support base (not illustrated). The upper surface plate 14 is supported between the lower surface plate 12 and the upper surface plate 14 and is supported between the lower surface plate 12 and the upper surface plate 14. The carrier 16 includes a known driving device (not shown) that rotationally drives the upper and lower surface plates 12 and 14 about the axis, and a carrier driving device that rotationally drives the carrier 16.
そして上下定盤１２、１４を回転させ、かつキャリア１６を回転させることにより、キャリア１６に保持されて上下定盤１２、１４間に挟まれたワークＷの両面を研磨するものである。
両面研磨装置１０は、ラップ盤であってもポリシング装置であってもよい。ポリシング装置の場合には、上下定盤１２、１４の研磨面にポリウレタン等からなる研磨布（図示せず）が貼付される。
また、図示しないが、下定盤１２の研磨面にスラリー（研磨液）を供給する公知のスラリー供給源が設けられる。
Then, by rotating the upper and lower surface plates 12 and 14 and rotating the carrier 16, both surfaces of the workpiece W held by the carrier 16 and sandwiched between the upper and lower surface plates 12 and 14 are polished.
The double-side polishing apparatus 10 may be a lapping machine or a polishing apparatus. In the case of a polishing apparatus, a polishing cloth (not shown) made of polyurethane or the like is attached to the polishing surfaces of the upper and lower surface plates 12 and 14.
Although not shown, a known slurry supply source for supplying slurry (polishing liquid) to the polishing surface of the lower surface plate 12 is provided.
本実施の形態では、下定盤１２は、２つの下定盤１２、１２が隣接して配置されている。２つの下定盤１２、１２の間には共通ギア１８が配置され、また各下定盤１２、１２の中心に中心ギア２０、２０が配置されている。２２は中心ギア２０、共通ギア１８の駆動軸である。
キャリア１６の外周にはリングギアが設けられている。そして、共通ギア１８と各中心ギア２０、２０との間に噛合されて各下定盤上１２で回転（自転）する２つのキャリア１６、１６を有する。
中心ギア２０、２０、共通ギア１８等でキャリア駆動機構を構成する。なお、中心ギア２０、共通ギア１８は多数のピンが周方向に立設されたピンギアに構成されているが、通常のギアであってもよい。
In the present embodiment, the lower surface plate 12 has two lower surface plates 12, 12 arranged adjacent to each other. A common gear 18 is disposed between the two lower surface plates 12 and 12, and central gears 20 and 20 are disposed at the centers of the lower surface plates 12 and 12. Reference numeral 22 denotes a drive shaft for the central gear 20 and the common gear 18.
A ring gear is provided on the outer periphery of the carrier 16. And it has the two carriers 16 and 16 which mesh | engage between the common gear 18 and each center gear 20 and 20 and rotate (autorotate) on each lower surface plate 12.
The center gears 20, 20 and the common gear 18 constitute a carrier drive mechanism. The center gear 20 and the common gear 18 are configured as pin gears in which a large number of pins are erected in the circumferential direction, but may be ordinary gears.
上定盤１４は１つ設けられ、隣接する２つの下定盤１２、１２の上方に位置して、該２つの下定盤１２、１２に跨るようにして（重なって）配置され、下定盤１２、１２上の２つのキャリア１６、１６に保持されたワークＷを下定盤１２、１２との間で挟むようになっている。 One upper surface plate 14 is provided, and is positioned above two adjacent lower surface plates 12, 12 so as to straddle (overlap) the two lower surface plates 12, 12, and the lower surface plate 12, The workpiece W held by the two carriers 16 and 16 on the top 12 is sandwiched between the lower surface plates 12 and 12.
本実施の形態の両面研磨装置１０は上記のように構成されている。
ワークＷの研磨の際は、上定盤１４が上昇され、キャリア１６の透孔内にワークＷが収納され、次いで上定盤１４が下降され、上下定盤１２、１４の研磨面でワークＷを挟み込む。
そして、スラリー供給源からスラリーを下定盤１２の研磨面１２ａ上に供給しつつ、上下定盤１２、１４、キャリア１６を回転させてワークＷの研磨を行う。
その際、下定盤１２、上定盤１４およびキャリア１６を同一方向に同一角速度（回転数）で回転させるようにすると、キャリア１６に保持されているワークＷの表裏面における定盤１２、１４との間の相対摩擦距離が等しくなり、精度のよい研磨が行える。
The double-side polishing apparatus 10 of the present embodiment is configured as described above.
When polishing the workpiece W, the upper surface plate 14 is raised, the workpiece W is stored in the through hole of the carrier 16, and then the upper surface plate 14 is lowered, and the workpiece W is polished on the polishing surfaces of the upper and lower surface plates 12, 14. Is inserted.
Then, while supplying the slurry from the slurry supply source onto the polishing surface 12a of the lower surface plate 12, the upper and lower surface plates 12, 14 and the carrier 16 are rotated to polish the workpiece W.
At that time, if the lower surface plate 12, the upper surface plate 14 and the carrier 16 are rotated in the same direction at the same angular velocity (number of rotations), the surface plates 12 and 14 on the front and back surfaces of the workpiece W held by the carrier 16 The relative friction distances between the two are equal, and accurate polishing can be performed.
本実施の形態では、上記のように、上定盤１４を２つの下定盤１２、１２で受け止めているので、上定盤１４の傾きを防止でき、精度のよい研磨が行える。また、１つの上定盤１４と、２つの下定盤１２、１２の重なった位置に２つのキャリア１６、１６を配置でき、生産性を向上させることができる。
また、特文献１のものに比較し、上定盤を修正リングで受け止める構成としていないので、研磨パッドに対する負荷を軽減でき、したがって、ラップ盤のみならず、ポリシング装置にも適用できる。
In the present embodiment, as described above, the upper surface plate 14 is received by the two lower surface plates 12, 12, so that the inclination of the upper surface plate 14 can be prevented and accurate polishing can be performed. Moreover, the two carriers 16 and 16 can be arrange | positioned in the position where the one upper surface plate 14 and the two lower surface plates 12 and 12 overlap, and productivity can be improved.
Further, compared with the one in the patent document 1, since the upper surface plate is not configured to be received by the correction ring, the load on the polishing pad can be reduced. Therefore, it can be applied not only to the lapping machine but also to a polishing apparatus.
図３は、ドレッサー２４を設けた実施の形態を示す説明図である。
ドレッサー２４は、上下定盤１２、１４の研磨布の表面を整えるものであり、下定盤１２、１２と上定盤１４とが重ならない位置に配置されている。ドレッサー２４は、上下定盤１２、１４の研磨面に当接しつつ、シリンダ機構等の公知の機構により上下定盤１２、１４の径方向に移動可能に設けられて、当接する研磨布の表面を調整するようになっている。これにより、ワークＷの研磨工程中に、研磨布のドレッシングを並行して行うことができる。なお、ドレッサー２４で上定盤１４を支持しているわけではないので、ドレッサー２４は簡易な構成とすることができる。
FIG. 3 is an explanatory view showing an embodiment in which a dresser 24 is provided.
The dresser 24 adjusts the surface of the polishing cloth of the upper and lower surface plates 12 and 14, and is arranged at a position where the lower surface plates 12 and 12 and the upper surface plate 14 do not overlap. The dresser 24 is provided so as to be movable in the radial direction of the upper and lower surface plates 12 and 14 by a known mechanism such as a cylinder mechanism while being in contact with the polishing surfaces of the upper and lower surface plates 12 and 14. It comes to adjust. Thereby, during the polishing process of the workpiece W, dressing of the polishing cloth can be performed in parallel. In addition, since the upper surface plate 14 is not supported by the dresser 24, the dresser 24 can have a simple configuration.
図４〜図６は他の実施の形態を示す説明図であり、３つ以上の下定盤１２を同一円周上に位置しするように配置し、各隣接する２つの下定盤１２に対して、上記と同様に１つの上定盤１４を両下定盤１２に跨るように配置している。そして、各下定盤１２と上定盤１４との重なる位置に１つづつキャリア１６を配置している。キャリア１６の駆動機構も上記と同様に中心ギア２０と共通ギア１８とで構成している。 4-6 is explanatory drawing which shows other embodiment, arrange | positions three or more lower surface plates 12 so that it may be located on the same periphery, and with respect to each two adjacent lower surface plates 12 In the same manner as described above, one upper surface plate 14 is arranged so as to straddle both lower surface plates 12. One carrier 16 is arranged at a position where each lower surface plate 12 and upper surface plate 14 overlap. The drive mechanism of the carrier 16 is also composed of the center gear 20 and the common gear 18 as described above.
図４に示す両面研磨装置１０では、３つの下定盤１２、３つの上定盤１４および６つのキャリア１６で構成され、図５に示す両面研磨装置１０では、４つの下定盤１２、４つの上定盤１４および８つのキャリア１６で構成され、図６に示す両面研磨装置１０では、５つの下定盤１２、５つの上定盤１４および１０個のキャリア１６で構成されている。もちろん、さらに多くの下定盤１２と上定盤１４とをリング状に配置して研磨装置に構成してもよい。このように、下定盤１２、上定盤１４をリング状に配置することで、より多くのキャリア１６を配置でき、空間効率を高められると共に、生産効率も向上できる。 The double-side polishing apparatus 10 shown in FIG. 4 includes three lower surface plates 12, three upper surface plates 14, and six carriers 16. The double-side polishing device 10 shown in FIG. The double-side polishing apparatus 10 shown in FIG. 6 is composed of five lower surface plates 12, five upper surface plates 14, and 10 carriers 16. Of course, a larger number of lower surface plates 12 and upper surface plates 14 may be arranged in a ring shape to constitute a polishing apparatus. Thus, by arranging the lower surface plate 12 and the upper surface plate 14 in a ring shape, more carriers 16 can be disposed, and space efficiency can be increased, and production efficiency can also be improved.
図７は、さらに他の実施の形態を示す平面図である。
本実施の形態に係る両面研磨装置１０は、下定盤１２を、正三角形の頂点に位置するように３つ配置し、上定盤１４を、該３つの下定盤１２に共通に跨るように配置している。すなわち、３つの下定盤１２、１つの上定盤１４および３つのキャリア１６から構成される両面研磨装置１０を提供できる。
FIG. 7 is a plan view showing still another embodiment.
In the double-side polishing apparatus 10 according to the present embodiment, three lower surface plates 12 are disposed so as to be located at the vertices of an equilateral triangle, and the upper surface plate 14 is disposed so as to straddle the three lower surface plates 12 in common. is doing. That is, it is possible to provide the double-side polishing apparatus 10 including three lower surface plates 12, one upper surface plate 14, and three carriers 16.
図８、図９はさらにまた他の実施の形態を示し、図８はその概略的な断面図、図９はその平面図である。
本実施の形態では、ギア２０を下定盤１２の中心からは若干ずれた位置に配置してある。請求項１等で、中央ギアとしているのは、ギア２０が完全に下定盤１２の中心に位置する場合と、中心からは若干ずれた位置に位置する場合の両者を含む概念で用いている。
また、外側ギア１８は、隣接する下定盤１２間で共用する共通ギアではなく、下定盤１２ごとにそれぞれ別個に設けている。
本実施の形態でも上記と同様の作用効果を生じることは明らかである。
8 and 9 show still another embodiment, FIG. 8 is a schematic sectional view thereof, and FIG. 9 is a plan view thereof.
In the present embodiment, the gear 20 is disposed at a position slightly deviated from the center of the lower surface plate 12. In the first aspect and the like, the central gear is used in a concept including both a case where the gear 20 is completely located at the center of the lower surface plate 12 and a case where the gear 20 is located slightly shifted from the center.
The outer gear 18 is not a common gear shared between the adjacent lower surface plates 12 but is provided separately for each lower surface plate 12.
Obviously, the present embodiment produces the same effects as described above.
１０ 両面研磨装置
１２ 下定盤
１２ａ 研磨面
１４ 上定盤
１４ａ 研磨面
１６ キャリア
１８ 共通ギア（外側ギア）
２０ 中心ギア（中央ギア）
２２ 駆動軸
２４ ドレッサー
DESCRIPTION OF SYMBOLS 10 Double-side polish apparatus 12 Lower surface plate 12a Polishing surface 14 Upper surface plate 14a Polishing surface 16 Carrier 18 Common gear (outer gear)
20 Center gear (central gear)
22 Drive shaft 24 Dresser
Claims (8)
前記下定盤は、隣接する２つの下定盤を含み、
該下定盤の中央部に中央ギアが配置されると共に、該下定盤の外側に外側ギアが配置されて前記キャリア駆動装置が構成され、
前記キャリアは、該外側ギアと前記中央ギアとの間に噛合されて各下定盤上で回転する２つのキャリアを含み、
前記上定盤は、前記隣接する２つの下定盤の上方に位置して該２つの下定盤に跨って配置され、下定盤上の前記２つのキャリアに保持されたワークを挟む１つの上定盤を含むことを特徴とする両面研磨装置。 A lower surface plate whose upper surface is a polishing surface, and an upper surface plate whose lower surface is a polishing surface, which is supported above and below the lower surface plate so as to freely move up and down, and is disposed between the lower surface plate and the upper surface plate, A carrier having a through-hole capable of holding a workpiece; a driving device that rotationally drives the upper and lower surface plates around an axis; and a carrier driving device that rotationally drives the carrier; In a double-side polishing apparatus that polishes both sides of a work held by a carrier and sandwiched between upper and lower surface plates by rotating the carrier,
The lower surface plate includes two adjacent lower surface plates,
A center gear is arranged at the center of the lower surface plate, and an outer gear is arranged outside the lower surface plate to constitute the carrier driving device,
The carrier includes two carriers that mesh between the outer gear and the central gear and rotate on each lower surface plate,
The upper surface plate is positioned above the two adjacent lower surface plates and is disposed across the two lower surface plates, and one upper surface plate that sandwiches the work held by the two carriers on the lower surface plate A double-side polishing apparatus comprising:
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019136784A (en) * | 2018-02-06 | 2019-08-22 | トヨタ自動車株式会社 | Both-side grinding device |
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| JP2004025384A (en) * | 2002-06-27 | 2004-01-29 | Koyo Mach Ind Co Ltd | End face grinding method, device and work holder |
| JP2006043815A (en) * | 2004-08-04 | 2006-02-16 | Fujikoshi Mach Corp | Polishing apparatus |
| JP2008012623A (en) * | 2006-07-05 | 2008-01-24 | Speedfam Co Ltd | Surface polishing device |
| JP2008149386A (en) * | 2006-12-14 | 2008-07-03 | Epson Toyocom Corp | Method for polishing wafer |
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|---|---|---|---|---|
| JPS61241060A (en) * | 1985-04-17 | 1986-10-27 | Supiide Fuamu Kk | Automatic plane grinding device |
| JPH08316179A (en) * | 1995-05-23 | 1996-11-29 | Sony Corp | Flattening method and apparatus in semiconductor process |
| JP2004025384A (en) * | 2002-06-27 | 2004-01-29 | Koyo Mach Ind Co Ltd | End face grinding method, device and work holder |
| JP2006043815A (en) * | 2004-08-04 | 2006-02-16 | Fujikoshi Mach Corp | Polishing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2019136784A (en) * | 2018-02-06 | 2019-08-22 | トヨタ自動車株式会社 | Both-side grinding device |
| JP7067094B2 (en) | 2018-02-06 | 2022-05-16 | トヨタ自動車株式会社 | Truing method for double-sided grinding equipment and double-sided grinding equipment |
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