JP2010062270A - 基板への接着テープ貼付装置 - Google Patents

基板への接着テープ貼付装置 Download PDF

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Publication number
JP2010062270A
JP2010062270A JP2008225301A JP2008225301A JP2010062270A JP 2010062270 A JP2010062270 A JP 2010062270A JP 2008225301 A JP2008225301 A JP 2008225301A JP 2008225301 A JP2008225301 A JP 2008225301A JP 2010062270 A JP2010062270 A JP 2010062270A
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JP
Japan
Prior art keywords
sticking
adhesive tape
roller
substrate
sticking roller
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2008225301A
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English (en)
Japanese (ja)
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JP2010062270A5 (enrdf_load_stackoverflow
Inventor
Shigeki Tanigawa
隆樹 谷川
Takayuki Nishitani
隆幸 西谷
Hirohito Kurihara
弘匡 栗原
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Takatori Corp
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Takatori Corp
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Publication date
Application filed by Takatori Corp filed Critical Takatori Corp
Priority to JP2008225301A priority Critical patent/JP2010062270A/ja
Publication of JP2010062270A publication Critical patent/JP2010062270A/ja
Publication of JP2010062270A5 publication Critical patent/JP2010062270A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008225301A 2008-09-02 2008-09-02 基板への接着テープ貼付装置 Pending JP2010062270A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008225301A JP2010062270A (ja) 2008-09-02 2008-09-02 基板への接着テープ貼付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008225301A JP2010062270A (ja) 2008-09-02 2008-09-02 基板への接着テープ貼付装置

Publications (2)

Publication Number Publication Date
JP2010062270A true JP2010062270A (ja) 2010-03-18
JP2010062270A5 JP2010062270A5 (enrdf_load_stackoverflow) 2011-10-06

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ID=42188773

Family Applications (1)

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JP2008225301A Pending JP2010062270A (ja) 2008-09-02 2008-09-02 基板への接着テープ貼付装置

Country Status (1)

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JP (1) JP2010062270A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102305228A (zh) * 2011-07-29 2012-01-04 深圳创维－Rgb电子有限公司 一种透明胶自动粘贴装置
JP2013038214A (ja) * 2011-08-08 2013-02-21 Renesas Electronics Corp 半導体装置の製造方法
JP2013138144A (ja) * 2011-12-28 2013-07-11 Lintec Corp シート貼付装置、およびシート貼付方法
KR20150136196A (ko) * 2014-05-26 2015-12-07 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법방법
US20190259642A1 (en) * 2016-04-26 2019-08-22 Samsung Electronics Co., Ltd. Process system and operation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520246U (enrdf_load_stackoverflow) * 1978-07-24 1980-02-08
JPH0588582A (ja) * 1991-09-26 1993-04-09 Matsushita Electric Ind Co Ltd 画像定着方法
JPH1062953A (ja) * 1996-08-14 1998-03-06 Mitsubishi Paper Mills Ltd 感光材料処理装置
JP2005310879A (ja) * 2004-04-19 2005-11-04 Lintec Corp 貼付テーブル
JP2006339607A (ja) * 2005-06-06 2006-12-14 Lintec Corp 転写装置とその方法、剥離装置とその方法、貼付装置とその方法
JP2008053432A (ja) * 2006-08-24 2008-03-06 Disco Abrasive Syst Ltd ウエーハ加工装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520246U (enrdf_load_stackoverflow) * 1978-07-24 1980-02-08
JPH0588582A (ja) * 1991-09-26 1993-04-09 Matsushita Electric Ind Co Ltd 画像定着方法
JPH1062953A (ja) * 1996-08-14 1998-03-06 Mitsubishi Paper Mills Ltd 感光材料処理装置
JP2005310879A (ja) * 2004-04-19 2005-11-04 Lintec Corp 貼付テーブル
JP2006339607A (ja) * 2005-06-06 2006-12-14 Lintec Corp 転写装置とその方法、剥離装置とその方法、貼付装置とその方法
JP2008053432A (ja) * 2006-08-24 2008-03-06 Disco Abrasive Syst Ltd ウエーハ加工装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102305228A (zh) * 2011-07-29 2012-01-04 深圳创维－Rgb电子有限公司 一种透明胶自动粘贴装置
JP2013038214A (ja) * 2011-08-08 2013-02-21 Renesas Electronics Corp 半導体装置の製造方法
JP2013138144A (ja) * 2011-12-28 2013-07-11 Lintec Corp シート貼付装置、およびシート貼付方法
KR20150136196A (ko) * 2014-05-26 2015-12-07 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법방법
US9881827B2 (en) 2014-05-26 2018-01-30 Samsung Electronics Co., Ltd. Substrate treating apparatus and substrate treating method
KR102264528B1 (ko) 2014-05-26 2021-06-16 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법방법
US20190259642A1 (en) * 2016-04-26 2019-08-22 Samsung Electronics Co., Ltd. Process system and operation method thereof
US11121011B2 (en) * 2016-04-26 2021-09-14 Samsung Electronics Co., Ltd. Process system and operation method thereof

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