JP2010021505A - 接続方法、基板 - Google Patents
接続方法、基板 Download PDFInfo
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- JP2010021505A JP2010021505A JP2008214553A JP2008214553A JP2010021505A JP 2010021505 A JP2010021505 A JP 2010021505A JP 2008214553 A JP2008214553 A JP 2008214553A JP 2008214553 A JP2008214553 A JP 2008214553A JP 2010021505 A JP2010021505 A JP 2010021505A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/026—Coplanar striplines [CPS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0248—Skew reduction or using delay lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
Abstract
【解決手段】この接続方式で接続された基板1と表面実装部品2の接続部は、図4に示されるように、線路形状のまま引き出される形で構成される。この接続方式の特徴は、表面実装部品2の誘電体端2Aを斜めに形成することで、その斜面に沿って誘電体上に配線された金属の伝送線路を徐々に基板1に近づけながら、基板1と表面実装部品2を接続することにある。マイクロストリップラインのライン幅は、その電気的特性と幾何学的形状から求まる特性インピーダンスにより調整される。図4の例においては、基板1に近づくほど、ライン幅が狭くなっている。本発明は、基板に電子部品の表面実装する際に適用することができる。
【選択図】図4
Description
図12を参照して説明したように、接続線路の構造は、分布定数回路として扱うことができ、インピーダンスの調整ができるものであれば、マイクロストリップライン、ストリップライン、コープレーナーライン、平行線などでも良い。
1.配線間のインピーダンス不整合による信号劣化を改善できる。特にRF回路などの高速な信号を扱う基板と部品の間での接続などに有効である。
2.マイクロストリップラインやコープレーナーラインなどの単純な線路構造で実現でき、余分な回路・コネクタ等を必要としない。
3.フィルタやアンテナなどの表面実装部品だけでなく、信号線間に誘導容量が存在するような部品全般(多層基板内配線、半導体パッケージなど)に応用できる。
上記1.を補足するため、伝送信号の劣化を電磁界シミュレーションにより解析した結果について説明する。
S21=log10(出力信号/入力信号)[dB] ・・・ (3)
次に、基板側の線路との接続部付近の電子部品側の線路の形状について説明する。
以上においては、電子部品の誘電体層が1層である場合について説明したが、誘電体層が多層である場合であっても、同様にして電子部品上の線路と基板上の線路とを接続させることが可能である。
Claims (8)
- 信号が流れる高さの異なる2点間を、各位置の幅がその位置における誘電体の厚さに応じて調整された、誘電体上の線路によって接続する
接続方法。 - 高い方の1点は基板に実装される電子部品の線路上の1点であり、低い方の1点は前記基板の線路上の1点である
請求項1に記載の接続方法。 - 誘電体によって構成される前記電子部品の端部に、前記基板の線路との接続部に近づくにつれて誘電体の厚さが薄くなる面を形成し、前記高さの異なる2点間を、前記面に沿って配設した線路によって接続する
請求項2に記載の接続方法。 - 誘電体によって構成される前記電子部品の端部に、前記基板の線路との接続部に近づくにつれて誘電体の厚さが薄くなる段を形成し、前記高さの異なる2点間を、前記段に沿って配設した線路によって接続する
請求項2に記載の接続方法。 - 信号が流れる高さの異なる2点間が、各位置の幅がその位置における誘電体の厚さに応じて調整された、誘電体上の線路によって接続された
基板。 - 高い方の1点は前記基板に実装される電子部品の線路上の1点であり、低い方の1点は前記基板の線路上の1点である
請求項5に記載の基板。 - 誘電体によって構成される前記電子部品の端部に、前記基板の線路との接続部に近づくにつれて誘電体の厚さが薄くなる面を形成し、前記高さの異なる2点間を、前記面に沿って配設した線路によって接続する
請求項6に記載の基板。 - 誘電体によって構成される前記電子部品の端部に、前記基板の線路との接続部に近づくにつれて誘電体の厚さが薄くなる段を形成し、前記高さの異なる2点間を、前記段に沿って配設した線路によって接続する
請求項6に記載の基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008214553A JP4656212B2 (ja) | 2008-06-13 | 2008-08-22 | 接続方法 |
US12/474,531 US20090309679A1 (en) | 2008-06-13 | 2009-05-29 | Connection method and substrate |
KR1020090052226A KR20090129957A (ko) | 2008-06-13 | 2009-06-12 | 접속 방법 및 기판 |
US13/431,698 US8334730B2 (en) | 2008-06-13 | 2012-03-27 | Connection method and substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008156048 | 2008-06-13 | ||
JP2008214553A JP4656212B2 (ja) | 2008-06-13 | 2008-08-22 | 接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010021505A true JP2010021505A (ja) | 2010-01-28 |
JP4656212B2 JP4656212B2 (ja) | 2011-03-23 |
Family
ID=41414200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008214553A Expired - Fee Related JP4656212B2 (ja) | 2008-06-13 | 2008-08-22 | 接続方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20090309679A1 (ja) |
JP (1) | JP4656212B2 (ja) |
KR (1) | KR20090129957A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013146904A1 (ja) * | 2012-03-28 | 2013-10-03 | 株式会社フジクラ | 配線基板 |
JP2015026915A (ja) * | 2013-07-24 | 2015-02-05 | 日本電気株式会社 | アンテナ及びアンテナの製造方法 |
US9204530B2 (en) | 2010-10-25 | 2015-12-01 | Panasonic Corporation | Electronic components assembly |
JP2016167529A (ja) * | 2015-03-10 | 2016-09-15 | 日本電信電話株式会社 | 高周波パッケージ |
JPWO2016031691A1 (ja) * | 2014-08-29 | 2017-04-27 | 株式会社村田製作所 | 多層回路基板の製造方法および多層回路基板 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9867294B2 (en) * | 2015-05-22 | 2018-01-09 | Ciena Corporation | Multi-width waveguides |
US20170085243A1 (en) * | 2015-09-21 | 2017-03-23 | Intel Corporation | Impedance matching interconnect |
US9974160B1 (en) * | 2016-12-28 | 2018-05-15 | Raytheon Company | Interconnection system for a multilayered radio frequency circuit and method of fabrication |
DE102017203252A1 (de) * | 2017-02-28 | 2018-08-30 | Continental Teves Ag & Co. Ohg | Mehrebenen-Schaltungsträger |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0615310U (ja) * | 1992-07-28 | 1994-02-25 | 株式会社東芝 | 高周波回路基板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5184095A (en) * | 1991-07-31 | 1993-02-02 | Hughes Aircraft Company | Constant impedance transition between transmission structures of different dimensions |
JP2708669B2 (ja) | 1992-07-01 | 1998-02-04 | 三菱電機株式会社 | 連続鋼板処理ラインの切断制御装置 |
JPH09289404A (ja) * | 1996-04-24 | 1997-11-04 | Honda Motor Co Ltd | リボンとボンディングワイヤとマイクロ波回路用パッケージ |
JP2000216510A (ja) | 1999-01-25 | 2000-08-04 | Nec Corp | プリント配線板及びその製造方法並びにプリント配線板におけるコネクタインダクタンス要因の波形歪み低減法 |
FI106414B (fi) * | 1999-02-02 | 2001-01-31 | Nokia Networks Oy | Laajakaistainen impedanssisovitin |
US6737931B2 (en) * | 2002-07-19 | 2004-05-18 | Agilent Technologies, Inc. | Device interconnects and methods of making the same |
-
2008
- 2008-08-22 JP JP2008214553A patent/JP4656212B2/ja not_active Expired - Fee Related
-
2009
- 2009-05-29 US US12/474,531 patent/US20090309679A1/en not_active Abandoned
- 2009-06-12 KR KR1020090052226A patent/KR20090129957A/ko not_active Application Discontinuation
-
2012
- 2012-03-27 US US13/431,698 patent/US8334730B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0615310U (ja) * | 1992-07-28 | 1994-02-25 | 株式会社東芝 | 高周波回路基板 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9204530B2 (en) | 2010-10-25 | 2015-12-01 | Panasonic Corporation | Electronic components assembly |
WO2013146904A1 (ja) * | 2012-03-28 | 2013-10-03 | 株式会社フジクラ | 配線基板 |
JPWO2013146904A1 (ja) * | 2012-03-28 | 2015-12-14 | 株式会社フジクラ | 配線基板 |
US9478839B2 (en) | 2012-03-28 | 2016-10-25 | Fujikura Ltd. | Wiring board |
JP2015026915A (ja) * | 2013-07-24 | 2015-02-05 | 日本電気株式会社 | アンテナ及びアンテナの製造方法 |
JPWO2016031691A1 (ja) * | 2014-08-29 | 2017-04-27 | 株式会社村田製作所 | 多層回路基板の製造方法および多層回路基板 |
JP2016167529A (ja) * | 2015-03-10 | 2016-09-15 | 日本電信電話株式会社 | 高周波パッケージ |
Also Published As
Publication number | Publication date |
---|---|
US20120182083A1 (en) | 2012-07-19 |
KR20090129957A (ko) | 2009-12-17 |
US8334730B2 (en) | 2012-12-18 |
US20090309679A1 (en) | 2009-12-17 |
JP4656212B2 (ja) | 2011-03-23 |
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