JP2010003722A5 - - Google Patents

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Publication number
JP2010003722A5
JP2010003722A5 JP2008158774A JP2008158774A JP2010003722A5 JP 2010003722 A5 JP2010003722 A5 JP 2010003722A5 JP 2008158774 A JP2008158774 A JP 2008158774A JP 2008158774 A JP2008158774 A JP 2008158774A JP 2010003722 A5 JP2010003722 A5 JP 2010003722A5
Authority
JP
Japan
Prior art keywords
insulating substrate
plating
plating wiring
wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008158774A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010003722A (ja
JP5359045B2 (ja
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Publication date
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Priority to JP2008158774A priority Critical patent/JP5359045B2/ja
Priority claimed from JP2008158774A external-priority patent/JP5359045B2/ja
Publication of JP2010003722A publication Critical patent/JP2010003722A/ja
Publication of JP2010003722A5 publication Critical patent/JP2010003722A5/ja
Application granted granted Critical
Publication of JP5359045B2 publication Critical patent/JP5359045B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008158774A 2008-06-18 2008-06-18 半導体装置およびその製造方法 Active JP5359045B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008158774A JP5359045B2 (ja) 2008-06-18 2008-06-18 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008158774A JP5359045B2 (ja) 2008-06-18 2008-06-18 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2010003722A JP2010003722A (ja) 2010-01-07
JP2010003722A5 true JP2010003722A5 (enExample) 2011-07-28
JP5359045B2 JP5359045B2 (ja) 2013-12-04

Family

ID=41585228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008158774A Active JP5359045B2 (ja) 2008-06-18 2008-06-18 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP5359045B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5537385B2 (ja) * 2010-11-04 2014-07-02 スタンレー電気株式会社 サイドビュー型半導体発光装置およびその製造方法
US9755105B2 (en) 2015-01-30 2017-09-05 Nichia Corporation Method for producing light emitting device
JP6176302B2 (ja) * 2015-01-30 2017-08-09 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3475757B2 (ja) * 1997-12-01 2003-12-08 松下電器産業株式会社 面実装型光電変換装置作製用基板
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP5073946B2 (ja) * 2005-12-27 2012-11-14 新光電気工業株式会社 半導体装置および半導体装置の製造方法
JP2007235003A (ja) * 2006-03-03 2007-09-13 Ngk Spark Plug Co Ltd 発光素子収納用パッケージ
JP5103805B2 (ja) * 2006-06-27 2012-12-19 日亜化学工業株式会社 発光装置及びその製造方法

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