JP2010001543A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010001543A5 JP2010001543A5 JP2008162725A JP2008162725A JP2010001543A5 JP 2010001543 A5 JP2010001543 A5 JP 2010001543A5 JP 2008162725 A JP2008162725 A JP 2008162725A JP 2008162725 A JP2008162725 A JP 2008162725A JP 2010001543 A5 JP2010001543 A5 JP 2010001543A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copper film
- copper
- layer
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229920006122 polyamide resin Polymers 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008162725A JP2010001543A (ja) | 2008-06-23 | 2008-06-23 | 銅膜形成方法及び配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008162725A JP2010001543A (ja) | 2008-06-23 | 2008-06-23 | 銅膜形成方法及び配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010001543A JP2010001543A (ja) | 2010-01-07 |
| JP2010001543A5 true JP2010001543A5 (enExample) | 2011-05-12 |
Family
ID=41583485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008162725A Pending JP2010001543A (ja) | 2008-06-23 | 2008-06-23 | 銅膜形成方法及び配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010001543A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5721254B2 (ja) * | 2010-09-17 | 2015-05-20 | 国立大学法人大阪大学 | 誘電体基材表面の触媒フリー金属化方法及び金属膜付き誘電体基材 |
| US20180315680A1 (en) * | 2015-11-11 | 2018-11-01 | Nhk Spring Co., Ltd. | Laminate and method of manufacturing laminate |
| CN109479375B (zh) * | 2016-12-02 | 2022-05-06 | 株式会社爱发科 | 布线基板的加工方法 |
| KR101842447B1 (ko) * | 2017-04-06 | 2018-05-14 | 주식회사 피엔에스테크놀로지 | 저온경화형 폴리이미드 전구체 조성물 |
| EP4276880B1 (fr) * | 2022-05-10 | 2025-02-19 | Rubattel et Weyermann S.A. | Procédé de modification de l état de surface d'une pièce par bombardement ionique |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006057059A (ja) * | 2004-08-23 | 2006-03-02 | Fuji Photo Film Co Ltd | 表面導電性材料の製造方法 |
| JP2007150221A (ja) * | 2005-10-27 | 2007-06-14 | Fujitsu Ltd | 多層回路基板およびその製造方法 |
| JP4825578B2 (ja) * | 2006-05-15 | 2011-11-30 | 新光電気工業株式会社 | 無電解めっき方法 |
-
2008
- 2008-06-23 JP JP2008162725A patent/JP2010001543A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PL2161316T3 (pl) | Kompozycja powłoki przeciwporostowej, sposób wytwarzania tej kompozycji, cienka powłoka przeciwporostowa utworzona przez tę kompozycję, element powlekany zawierający na powierzchni tę cienką powłokę oraz sposób obróbki przeciwporostowej dzięki wytworzeniu cienkiej powłoki | |
| JP2010001543A5 (enExample) | ||
| WO2008126426A1 (ja) | 導電性物質吸着性樹脂フイルム、導電性物質吸着性樹脂フイルムの製造方法、それを用いた金属層付き樹脂フイルム、及び、金属層付き樹脂フイルムの製造方法 | |
| TWI314845B (en) | Conductive metal plated polyimide substrate and process for manufacturing the same | |
| CN103118806A (zh) | 处理金属表面的方法和由此形成的器件 | |
| EA201390169A1 (ru) | Способ получения материала, содержащего основу, снабженную покрытием | |
| EP2562294A3 (en) | Plating bath and method | |
| CN1545570A (zh) | 表面处理铜箔 | |
| JP2010505978A5 (enExample) | ||
| EP2586893A3 (en) | Copper plating bath and method | |
| WO2008133082A1 (ja) | 片面が平滑性のポリイミドフィルム | |
| ATE557324T1 (de) | Verfahren zur herstellung mehrschichtiger metallteile mithilfe der uv-liga-technik | |
| EP1693484A3 (en) | Plating Method | |
| MY162585A (en) | Steel sheet for containers and manufacturing method for same | |
| WO2009125143A3 (fr) | Procede de formation d'une couche d'amorcage de depot d'un metal sur un substrat | |
| JP2011527106A5 (enExample) | ||
| WO2008070528A3 (en) | Precision printing electroplating through plating mask on a solar cell substrate | |
| WO2008111163A1 (ja) | 金属ガラス部品の表面処理方法と該方法で表面処理された金属ガラス部品 | |
| EP2442367A3 (en) | Improved method for forming metal contacts | |
| JP2012046781A5 (enExample) | ||
| WO2007140477A3 (en) | Polyimide insulative layers in multi-layered printed electronic features | |
| WO2016051277A3 (ja) | 積層体の製造方法 | |
| TW200700221A (en) | Copper clad laminated sheet and its manufacturing method | |
| JP2008179127A (ja) | 銅箔積層構造体及び銅箔の表面処理方法 | |
| JP2016117901A (ja) | 無機材料または樹脂材料の表面処理液、表面処理方法およびその利用 |