JP2009545157A5 - - Google Patents

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Publication number
JP2009545157A5
JP2009545157A5 JP2009521714A JP2009521714A JP2009545157A5 JP 2009545157 A5 JP2009545157 A5 JP 2009545157A5 JP 2009521714 A JP2009521714 A JP 2009521714A JP 2009521714 A JP2009521714 A JP 2009521714A JP 2009545157 A5 JP2009545157 A5 JP 2009545157A5
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JP
Japan
Prior art keywords
target
contact surface
heat
following characteristics
phase transition
Prior art date
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Application number
JP2009521714A
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English (en)
Japanese (ja)
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JP2009545157A (ja
JP5384339B2 (ja
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Publication date
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Priority claimed from PCT/NL2007/000181 external-priority patent/WO2008013443A2/en
Publication of JP2009545157A publication Critical patent/JP2009545157A/ja
Publication of JP2009545157A5 publication Critical patent/JP2009545157A5/ja
Application granted granted Critical
Publication of JP5384339B2 publication Critical patent/JP5384339B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009521714A 2006-07-28 2007-07-13 リソグラフィ・システム、熱放散の方法、及びフレーム Active JP5384339B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US83386506P 2006-07-28 2006-07-28
NL1032251 2006-07-28
NL1032251 2006-07-28
US60/833,865 2006-07-28
PCT/NL2007/000181 WO2008013443A2 (en) 2006-07-28 2007-07-13 Lithography system, method of heat dissipation and frame

Publications (3)

Publication Number Publication Date
JP2009545157A JP2009545157A (ja) 2009-12-17
JP2009545157A5 true JP2009545157A5 (https=) 2010-09-02
JP5384339B2 JP5384339B2 (ja) 2014-01-08

Family

ID=38582337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009521714A Active JP5384339B2 (ja) 2006-07-28 2007-07-13 リソグラフィ・システム、熱放散の方法、及びフレーム

Country Status (6)

Country Link
EP (1) EP2054771B1 (https=)
JP (1) JP5384339B2 (https=)
KR (1) KR101486407B1 (https=)
CN (1) CN101495922B (https=)
TW (2) TW200813656A (https=)
WO (1) WO2008013443A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8325321B2 (en) * 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP5529865B2 (ja) 2008-08-08 2014-06-25 エーエスエムエル ネザーランズ ビー．ブイ． 温度安定化システム、リソグラフィ投影装置、および温度制御方法
CN102414781B (zh) * 2009-02-22 2015-07-15 迈普尔平版印刷Ip有限公司 基板支撑结构、箝制准备单元及微影系统
KR101586984B1 (ko) 2009-02-22 2016-01-20 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 머신을 위한 준비 유닛
WO2011101450A1 (en) 2010-02-19 2011-08-25 Mapper Lithography Ip B.V. Substrate support structure, clamp preparation unit, and lithography system
EP2612542B1 (en) 2010-08-30 2017-01-25 Philips Lighting Holding B.V. Management of power-over-ethernet installation
TWI757314B (zh) * 2016-07-28 2022-03-11 荷蘭商Ａｓｍｌ荷蘭公司 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法
CN110879511B (zh) * 2019-11-28 2021-05-28 昆山龙腾光电股份有限公司 薄膜的定点去除装置、显示基板及其制作方法
NL2024445B1 (en) * 2019-12-12 2021-09-01 Delmic Ip B V Method and manipulation device for handling samples

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0076079A3 (en) * 1981-09-25 1983-08-10 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Improvements in or relating to heat pipes
JPS59117128A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd 温度制御装置を備えたウエハ搭載台
US4911232A (en) * 1988-07-21 1990-03-27 Triangle Research And Development Corporation Method of using a PCM slurry to enhance heat transfer in liquids
JP2731950B2 (ja) * 1989-07-13 1998-03-25 キヤノン株式会社 露光方法
JP2975089B2 (ja) * 1990-11-01 1999-11-10 キヤノン株式会社 露光装置
DE69118315T2 (de) * 1990-11-01 1996-08-14 Canon Kk Waferhaltebefestigung für Belichtungsgerät
JP3398456B2 (ja) * 1994-02-14 2003-04-21 大日本スクリーン製造株式会社 基板冷却装置
JPH1092738A (ja) * 1996-09-18 1998-04-10 Canon Inc 基板保持装置およびこれを用いた露光装置
JP2000252352A (ja) * 1999-03-03 2000-09-14 Nikon Corp 基板保持装置及びそれを有する荷電粒子線露光装置
KR100351049B1 (ko) * 1999-07-26 2002-09-09 삼성전자 주식회사 웨이퍼 가열 방법 및 이를 적용한 장치
JP2001189374A (ja) * 1999-12-28 2001-07-10 Nikon Corp 基板処理装置及び荷電粒子線露光装置
JP2001189258A (ja) * 1999-12-28 2001-07-10 Nikon Corp 露光装置
US6686598B1 (en) * 2000-09-01 2004-02-03 Varian Semiconductor Equipment Associates, Inc. Wafer clamping apparatus and method
JP2003068600A (ja) 2001-08-22 2003-03-07 Canon Inc 露光装置、および基板チャックの冷却方法
JP4366098B2 (ja) * 2003-03-04 2009-11-18 キヤノン株式会社 投影露光装置および方法ならびにデバイス製造方法
DE602004008009T2 (de) * 2003-11-05 2008-04-30 Asml Netherlands B.V. Lithographischer Apparat
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050128449A1 (en) * 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
JP4680935B2 (ja) * 2004-01-08 2011-05-11 ジクスト、ベルンハルト 冷凍材料の冷却保持用輸送容器
US8749762B2 (en) * 2004-05-11 2014-06-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006138558A (ja) * 2004-11-12 2006-06-01 Saito Research Institute Inc 調理器
JP4835976B2 (ja) * 2006-01-31 2011-12-14 株式会社ニコン 保持装置及び露光装置
JP5529865B2 (ja) * 2008-08-08 2014-06-25 エーエスエムエル ネザーランズ ビー．ブイ． 温度安定化システム、リソグラフィ投影装置、および温度制御方法

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