JP2009540577A5 - - Google Patents

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Publication number
JP2009540577A5
JP2009540577A5 JP2009514411A JP2009514411A JP2009540577A5 JP 2009540577 A5 JP2009540577 A5 JP 2009540577A5 JP 2009514411 A JP2009514411 A JP 2009514411A JP 2009514411 A JP2009514411 A JP 2009514411A JP 2009540577 A5 JP2009540577 A5 JP 2009540577A5
Authority
JP
Japan
Prior art keywords
layer
surface energy
composition
test substrate
rsa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009514411A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009540577A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/013583 external-priority patent/WO2007146170A2/en
Publication of JP2009540577A publication Critical patent/JP2009540577A/ja
Publication of JP2009540577A5 publication Critical patent/JP2009540577A5/ja
Pending legal-status Critical Current

Links

JP2009514411A 2006-06-08 2007-06-08 非接触印刷のための平面状試験基体 Pending JP2009540577A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81198806P 2006-06-08 2006-06-08
PCT/US2007/013583 WO2007146170A2 (en) 2006-06-08 2007-06-08 Planar test substrate for non-contact printing

Publications (2)

Publication Number Publication Date
JP2009540577A JP2009540577A (ja) 2009-11-19
JP2009540577A5 true JP2009540577A5 (https=) 2010-07-22

Family

ID=38832424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009514411A Pending JP2009540577A (ja) 2006-06-08 2007-06-08 非接触印刷のための平面状試験基体

Country Status (5)

Country Link
US (1) US7838195B2 (https=)
EP (1) EP2024179A2 (https=)
JP (1) JP2009540577A (https=)
TW (1) TW200807176A (https=)
WO (1) WO2007146170A2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017003820A1 (en) * 2015-06-30 2017-01-05 3M Innovative Properties Company Patterned overcoat layer

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4003312A (en) 1974-12-16 1977-01-18 Xerox Corporation Preparing waterless lithographic printing masters by ink jet printing
US4430403A (en) * 1982-03-26 1984-02-07 Am International, Inc. Method of preparing a lithographic printing master
JPS62271741A (ja) 1986-05-21 1987-11-26 Matsushita Electric Ind Co Ltd 印刷方法
US4911003A (en) 1988-04-22 1990-03-27 Hewlett-Packard Company Method and apparatus for measuring the print quality of print media receiving ink jet inks
DE3911934C2 (de) 1989-04-12 1995-08-24 Krause Biagosch Gmbh Offsetdruckform und Verfahren zur Herstellung dieser Druckform
GB9516723D0 (en) 1995-08-15 1995-10-18 Horsell Plc Water-less lithographic plates
DE69841945D1 (de) * 1997-08-08 2010-11-25 Dainippon Printing Co Ltd Struktur zur Musterbildung, Verfahren zur Musterbildung und deren Anwendung
US6231988B1 (en) 1997-09-18 2001-05-15 Fuji Photo Film Co., Ltd. Lithographic printing plate precursor and method of preparing lithographic printing plate using the same
JP3767768B2 (ja) 1997-12-12 2006-04-19 富士写真フイルム株式会社 ネガ型水なし平版印刷原版
GB9806478D0 (en) * 1998-03-27 1998-05-27 Horsell Graphic Ind Ltd Pattern formation
US6734029B2 (en) * 2000-06-30 2004-05-11 Seiko Epson Corporation Method for forming conductive film pattern, and electro-optical device and electronic apparatus
KR100877708B1 (ko) * 2001-03-29 2009-01-07 다이니폰 인사츠 가부시키가이샤 패턴 형성체의 제조 방법 및 그것에 사용하는 포토마스크
JP4672233B2 (ja) * 2001-11-06 2011-04-20 大日本印刷株式会社 導電性パターン形成体の製造方法
JP2003309344A (ja) * 2002-04-18 2003-10-31 Dainippon Printing Co Ltd 導電性パターン基材の製造方法
JP4165692B2 (ja) * 2002-08-05 2008-10-15 大日本印刷株式会社 エレクトロルミネッセント素子の製造方法
JP4289852B2 (ja) * 2002-09-18 2009-07-01 大日本印刷株式会社 エレクトロルミネッセント素子の製造方法
US7175876B2 (en) * 2003-06-27 2007-02-13 3M Innovative Properties Company Patterned coating method employing polymeric coatings
JP2005223167A (ja) * 2004-02-06 2005-08-18 Shinko Electric Ind Co Ltd 親水性処理方法及び配線パターンの形成方法
JP4695360B2 (ja) * 2004-08-05 2011-06-08 株式会社リコー 電子素子の製造方法

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