JP2008516821A5 - - Google Patents

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Publication number
JP2008516821A5
JP2008516821A5 JP2007538092A JP2007538092A JP2008516821A5 JP 2008516821 A5 JP2008516821 A5 JP 2008516821A5 JP 2007538092 A JP2007538092 A JP 2007538092A JP 2007538092 A JP2007538092 A JP 2007538092A JP 2008516821 A5 JP2008516821 A5 JP 2008516821A5
Authority
JP
Japan
Prior art keywords
transfer
layer
radiation
substrate
assist layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007538092A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008516821A (ja
JP4943339B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2005/038009 external-priority patent/WO2006045083A1/en
Publication of JP2008516821A publication Critical patent/JP2008516821A/ja
Publication of JP2008516821A5 publication Critical patent/JP2008516821A5/ja
Application granted granted Critical
Publication of JP4943339B2 publication Critical patent/JP4943339B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007538092A 2004-10-20 2005-10-20 放射線誘発熱転写用のドナー要素 Expired - Fee Related JP4943339B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62045004P 2004-10-20 2004-10-20
US60/620,450 2004-10-20
PCT/US2005/038009 WO2006045083A1 (en) 2004-10-20 2005-10-20 Donor element for radiation-induced thermal transfer

Publications (3)

Publication Number Publication Date
JP2008516821A JP2008516821A (ja) 2008-05-22
JP2008516821A5 true JP2008516821A5 (https=) 2008-12-04
JP4943339B2 JP4943339B2 (ja) 2012-05-30

Family

ID=35810233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007538092A Expired - Fee Related JP4943339B2 (ja) 2004-10-20 2005-10-20 放射線誘発熱転写用のドナー要素

Country Status (8)

Country Link
US (1) US20090047597A1 (https=)
EP (1) EP1802471B1 (https=)
JP (1) JP4943339B2 (https=)
KR (1) KR20070067726A (https=)
CN (1) CN101044030B (https=)
DE (1) DE602005025147D1 (https=)
TW (1) TW200630240A (https=)
WO (1) WO2006045083A1 (https=)

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CN101437691B (zh) * 2006-04-20 2011-10-05 E.I.内穆尔杜邦公司 用于热转移的含有基于马来酸酐的聚合物的供体元件
US7582403B2 (en) 2006-07-17 2009-09-01 E. I. Du Pont De Nemours And Company Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
US7927454B2 (en) * 2007-07-17 2011-04-19 Samsung Mobile Display Co., Ltd. Method of patterning a substrate
US8120731B2 (en) * 2007-09-11 2012-02-21 Toppan Printing Co., Ltd. Color filter
US20110151153A1 (en) 2009-12-23 2011-06-23 E.I. Du Pont De Nemours And Company Polymeric conductive donor
CN102336082B (zh) * 2010-07-19 2014-03-12 元太科技工业股份有限公司 转印结构及制造转印结构的方法
KR20140088007A (ko) * 2012-12-31 2014-07-09 제일모직주식회사 열전사필름, 이의 제조 방법 및 이를 사용하여 제조된 유기전계발광소자
CN105611805B (zh) * 2016-01-25 2019-04-09 电子科技大学 一种用于高发热量电子元器件的散热装置及其制备方法
EP3414629B1 (en) * 2016-07-06 2020-03-25 HP Indigo B.V. Release layer
US9997399B2 (en) * 2016-08-16 2018-06-12 Mikro Mesa Technology Co., Ltd. Method for transferring semiconductor structure
EP3514822B1 (en) * 2016-09-16 2023-04-26 Toray Industries, Inc. Method for manufacturing field effect transistor and method for manufacturing wireless communication device
JP7503494B2 (ja) * 2017-11-17 2024-06-20 アイメリーズ ユーエスエー，インコーポレーテッド ヒートシールコーティング
IL297544A (en) * 2021-10-22 2023-05-01 Wuhan Dr Laser Tech Corp Ltd Sheets and methods for transferring a pattern with a release layer and/or paste mixtures
CN116080256B (zh) * 2021-11-08 2026-04-07 武汉帝尔激光科技股份有限公司 一种转印基板及一种转印方法

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US4695288A (en) * 1986-10-07 1987-09-22 Eastman Kodak Company Subbing layer for dye-donor element used in thermal dye transfer
US4737486A (en) * 1986-11-10 1988-04-12 Eastman Kodak Company Inorganic polymer subbing layer for dye-donor element used in thermal dye transfer
US5593940A (en) * 1989-07-07 1997-01-14 Dai Nippon Insatsu Kabushiki Kaisha Thermal transfer sheet
JPH03182394A (ja) * 1989-12-12 1991-08-08 Unitika Ltd 感熱転写インクリボン用フィルムとその製造方法
US5223328A (en) * 1990-12-21 1993-06-29 Diafoil Hoechst Co., Ltd. Thermal ink transfer printing material
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JP3243650B2 (ja) * 1992-04-14 2002-01-07 コニカ株式会社 ヒートモード熱転写記録材料
US5387496A (en) * 1993-07-30 1995-02-07 Eastman Kodak Company Interlayer for laser ablative imaging
GB9407803D0 (en) 1994-04-20 1994-06-15 Ici Plc Polymeric film
US5521035A (en) 1994-07-11 1996-05-28 Minnesota Mining And Manufacturing Company Methods for preparing color filter elements using laser induced transfer of colorants with associated liquid crystal display device
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US6190757B1 (en) * 1995-02-09 2001-02-20 3M Innovative Properties Company Compositions and thermal mass transfer donor elements for use in producing signage articles
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US6485684B1 (en) * 2000-02-07 2002-11-26 Steris Inc. Fluid connection system for endoscope reprocessing with controlled leakage
US6242152B1 (en) 2000-05-03 2001-06-05 3M Innovative Properties Thermal transfer of crosslinked materials from a donor to a receptor
US6358664B1 (en) 2000-09-15 2002-03-19 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
US6958202B2 (en) * 2000-12-15 2005-10-25 E.I. Du Pont De Nemours And Company Donor element for adjusting the focus of an imaging laser
JP2002248874A (ja) * 2001-02-27 2002-09-03 Konica Corp レーザー熱転写用インクシート及びその製造方法並びに画像記録方法
WO2003006736A1 (en) * 2001-07-13 2003-01-23 Foto-Wear, Inc. Sublimation dye thermal transfer paper and transfer method
US6699597B2 (en) * 2001-08-16 2004-03-02 3M Innovative Properties Company Method and materials for patterning of an amorphous, non-polymeric, organic matrix with electrically active material disposed therein
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