JP2009532230A - 微細構造化ツール及びレーザーアブレーションを用いたその製法 - Google Patents

微細構造化ツール及びレーザーアブレーションを用いたその製法 Download PDF

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Publication number
JP2009532230A
JP2009532230A JP2009503233A JP2009503233A JP2009532230A JP 2009532230 A JP2009532230 A JP 2009532230A JP 2009503233 A JP2009503233 A JP 2009503233A JP 2009503233 A JP2009503233 A JP 2009503233A JP 2009532230 A JP2009532230 A JP 2009532230A
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JP
Japan
Prior art keywords
microstructured
layer
tool
laser
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009503233A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009532230A5 (enExample
Inventor
アール． フレミング，パトリック
イー． ハンパル，ポール
アール．ジェイ． コリガン，トーマス
アール． ウィリアムズ，トッド
ジー． ニガトゥ，タデッセ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009532230A publication Critical patent/JP2009532230A/ja
Publication of JP2009532230A5 publication Critical patent/JP2009532230A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/009—Manufacturing the stamps or the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/036—Hot embossing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2009503233A 2006-03-31 2007-03-28 微細構造化ツール及びレーザーアブレーションを用いたその製法 Withdrawn JP2009532230A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/278,278 US20070235902A1 (en) 2006-03-31 2006-03-31 Microstructured tool and method of making same using laser ablation
PCT/US2007/065330 WO2007115028A2 (en) 2006-03-31 2007-03-28 Microstructured tool and method of making same using laser ablation

Publications (2)

Publication Number Publication Date
JP2009532230A true JP2009532230A (ja) 2009-09-10
JP2009532230A5 JP2009532230A5 (enExample) 2010-05-13

Family

ID=38564182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009503233A Withdrawn JP2009532230A (ja) 2006-03-31 2007-03-28 微細構造化ツール及びレーザーアブレーションを用いたその製法

Country Status (7)

Country Link
US (1) US20070235902A1 (enExample)
EP (1) EP2010451A2 (enExample)
JP (1) JP2009532230A (enExample)
KR (1) KR20080109783A (enExample)
CN (1) CN101410324A (enExample)
TW (1) TW200745738A (enExample)
WO (1) WO2007115028A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014520003A (ja) * 2011-05-31 2014-08-21 スリーエム イノベイティブ プロパティズ カンパニー 非連続的なトポグラフィーを有する微細構造化ツールを作成するための方法、及びこれにより製造される物品
JP2021120730A (ja) * 2020-01-31 2021-08-19 ニチコン株式会社 熱可塑性樹脂のアブレーション加工方法

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FR2902530A1 (fr) * 2006-06-19 2007-12-21 St Microelectronics Rousset Procede de fabrication de lentilles, notamment pour imageur comprenant un diaphragme
US8835079B2 (en) * 2007-06-08 2014-09-16 GM Global Technology Operations LLC Fuel cell separator plate surface treatment by laser ablation
US8012329B2 (en) 2008-05-09 2011-09-06 3M Innovative Properties Company Dimensional control in electroforms
EP2623632A3 (en) * 2008-06-30 2017-01-18 3M Innovative Properties Company Method of forming a microstructure
JP4900349B2 (ja) * 2008-09-08 2012-03-21 ソニー株式会社 金型製造方法、機能性フィルムの製造方法及び機能性フィルム
US20100128351A1 (en) * 2008-11-21 2010-05-27 3M Innovative Properties Company Curved sided cone structures for controlling gain and viewing angle in an optical film
US20100129617A1 (en) * 2008-11-21 2010-05-27 Corrigan Thomas R Laser ablation tooling via sparse patterned masks
US20110070398A1 (en) * 2009-09-18 2011-03-24 3M Innovative Properties Company Laser ablation tooling via distributed patterned masks
US8460754B2 (en) * 2009-12-21 2013-06-11 3M Innovative Properties Company Needle coating and in-line curing of a coated workpiece
EP2428307B1 (de) * 2010-09-10 2016-03-16 ACSYS Lasertechnik GmbH Verfahren zur Erzeugung von rauen Oberflächenstrukturen
CN102452239A (zh) * 2010-10-22 2012-05-16 韩国科学技术院 图案转印方法和图案转印装置以及利用该方法制造的产品
US8299708B2 (en) 2010-10-25 2012-10-30 Hewlett-Packard Development Company, L.P. Pixel structures
TW201729654A (zh) * 2011-11-28 2017-08-16 綠點高新科技股份有限公司 導電線路的製備方法
GB2507744A (en) * 2012-11-07 2014-05-14 Universitaetsklinikum Freiburg Matrix for generating and cultivating uniform cell aggregations
JP6318171B2 (ja) * 2012-12-20 2018-04-25 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ微細加工によりイメージを形成する方法
EP3057739B1 (en) * 2013-10-18 2020-12-09 3M Innovative Properties Company Coated abrasive article and method of making the same
US20170014111A1 (en) * 2015-07-17 2017-01-19 Hoowaki, Llc Microstructured Surface
JP6497301B2 (ja) * 2015-11-17 2019-04-10 株式会社デンソー 樹脂成形体の製造方法
CN108941805B (zh) * 2018-08-09 2020-02-21 广东工业大学 一种不锈钢电化学极化制备表面微结构的方法
CN115283939A (zh) * 2021-08-05 2022-11-04 浙江师范大学 一种表面织构化锅盖制备方法
CN118905449A (zh) * 2024-07-19 2024-11-08 华中科技大学 一种功能线路原位直写方法及其功能元器件
US20260061665A1 (en) * 2024-09-04 2026-03-05 Southwest Research Institute Mold Master Fabrication for Injection Molding Using Physical Vapor Deposition, Electroforming, and Die-Sink Discharge Machining

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014520003A (ja) * 2011-05-31 2014-08-21 スリーエム イノベイティブ プロパティズ カンパニー 非連続的なトポグラフィーを有する微細構造化ツールを作成するための方法、及びこれにより製造される物品
US9415539B2 (en) 2011-05-31 2016-08-16 3M Innovative Properties Company Method for making microstructured tools having discontinuous topographies, and articles produced therefrom
US11292159B2 (en) 2011-05-31 2022-04-05 3M Innovative Properties Company Method for making microstructured tools having discontinuous topographies, and articles produced therefrom
JP2021120730A (ja) * 2020-01-31 2021-08-19 ニチコン株式会社 熱可塑性樹脂のアブレーション加工方法

Also Published As

Publication number Publication date
CN101410324A (zh) 2009-04-15
WO2007115028A2 (en) 2007-10-11
WO2007115028A3 (en) 2007-12-13
TW200745738A (en) 2007-12-16
US20070235902A1 (en) 2007-10-11
KR20080109783A (ko) 2008-12-17
EP2010451A2 (en) 2009-01-07

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