JP2009528685A - 一体的に成形された一体成形発光ダイオードライトワイヤ - Google Patents

一体的に成形された一体成形発光ダイオードライトワイヤ Download PDF

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Publication number
JP2009528685A
JP2009528685A JP2008556729A JP2008556729A JP2009528685A JP 2009528685 A JP2009528685 A JP 2009528685A JP 2008556729 A JP2008556729 A JP 2008556729A JP 2008556729 A JP2008556729 A JP 2008556729A JP 2009528685 A JP2009528685 A JP 2009528685A
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Japan
Prior art keywords
led
light wire
led light
integrally formed
bus
Prior art date
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Pending
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JP2008556729A
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English (en)
Japanese (ja)
Inventor
ポール・ロ
テディ・ユング・マン・ロ
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Publication of JP2009528685A publication Critical patent/JP2009528685A/ja
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30Driver circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/04Provision of filling media
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Luminescent Compositions (AREA)
JP2008556729A 2006-09-12 2007-09-12 一体的に成形された一体成形発光ダイオードライトワイヤ Pending JP2009528685A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84418406P 2006-09-12 2006-09-12
PCT/EP2007/007948 WO2008031580A1 (en) 2006-09-12 2007-09-12 Integrally formed single piece light emitting diode light wire

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011245422A Division JP5430635B2 (ja) 2006-09-12 2011-11-09 一体成形ledライトワイヤ

Publications (1)

Publication Number Publication Date
JP2009528685A true JP2009528685A (ja) 2009-08-06

Family

ID=38645763

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008556729A Pending JP2009528685A (ja) 2006-09-12 2007-09-12 一体的に成形された一体成形発光ダイオードライトワイヤ
JP2011245422A Expired - Fee Related JP5430635B2 (ja) 2006-09-12 2011-11-09 一体成形ledライトワイヤ
JP2013096787A Expired - Fee Related JP5599912B2 (ja) 2006-09-12 2013-05-02 一体成形ledライトワイヤ

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2011245422A Expired - Fee Related JP5430635B2 (ja) 2006-09-12 2011-11-09 一体成形ledライトワイヤ
JP2013096787A Expired - Fee Related JP5599912B2 (ja) 2006-09-12 2013-05-02 一体成形ledライトワイヤ

Country Status (12)

Country Link
US (2) US7988332B2 (enExample)
EP (1) EP2061991B1 (enExample)
JP (3) JP2009528685A (enExample)
KR (1) KR101070066B1 (enExample)
CN (1) CN101360947B (enExample)
AT (1) ATE503149T1 (enExample)
AU (1) AU2007296902B2 (enExample)
CA (2) CA2656198C (enExample)
DE (1) DE602007013419D1 (enExample)
ES (1) ES2362804T3 (enExample)
PL (1) PL2061991T3 (enExample)
WO (1) WO2008031580A1 (enExample)

Cited By (10)

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JP2013026237A (ja) * 2011-07-14 2013-02-04 Sharp Corp 発光素子の生産装置およびその生産方法、発光モジュールの生産装置およびその生産方法、発光モジュール、光源装置、液晶表示装置
JP2013510448A (ja) * 2010-02-09 2013-03-21 ホエジョウ・ライト・エンジン・リミテッド 一体形成された発光ダイオード光ワイヤおよびその使用法
JP2014075427A (ja) * 2012-10-03 2014-04-24 Sharp Corp 導電フレームおよび光源基板の製造方法
US8789971B2 (en) 2006-09-12 2014-07-29 Huizhou Light Engine Ltd Integrally formed single piece light emitting diode light wire
US8807796B2 (en) 2006-09-12 2014-08-19 Huizhou Light Engine Ltd. Integrally formed light emitting diode light wire and uses thereof
US9130138B2 (en) 2012-07-31 2015-09-08 Nichia Corporation Light-emitting device manufacturing method
US9190587B2 (en) 2012-08-31 2015-11-17 Nichia Corporation Light-emitting device and method of manufacturing the same
WO2016063473A1 (ja) * 2014-10-20 2016-04-28 日清紡ホールディングス株式会社 Ledアレイ及びその製造方法
JP2019171528A (ja) * 2018-03-29 2019-10-10 ファナック株式会社 ロボットシステム
JP2021000724A (ja) * 2020-09-24 2021-01-07 ファナック株式会社 ロボットシステム

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US8052303B2 (en) * 2006-09-12 2011-11-08 Huizhou Light Engine Ltd. Integrally formed single piece light emitting diode light wire and uses thereof
WO2010004461A2 (en) * 2008-07-08 2010-01-14 Koninklijke Philips Electronics, N.V. Methods and apparatus for determining relative positions of led lighting units
US9129832B2 (en) * 2008-08-26 2015-09-08 Dingguo Pan LED multi-chip bonding die and light strip using the same
US20100097791A1 (en) * 2008-10-18 2010-04-22 Chang Kai-Nan Light emitting diode (led) strip light
JP5303251B2 (ja) 2008-12-08 2013-10-02 株式会社小糸製作所 給電部材および車両用灯具
CN101813263B (zh) * 2009-02-20 2012-02-01 深圳市科利尔照明科技有限公司 一种制作灯带的方法及灯带
US8145327B2 (en) * 2009-03-13 2012-03-27 Susan Banks Method and apparatus for implementing a consumer-configurable modular electrical system
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US8187022B2 (en) 2009-05-01 2012-05-29 Huizhou Light Engine Ltd. Lighting connector devices and uses thereof
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KR101283867B1 (ko) * 2010-05-14 2013-07-08 엘지이노텍 주식회사 발광소자 어레이, 백라이트 장치 및 조명 장치
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