JP5430635B2 - 一体成形ledライトワイヤ - Google Patents
一体成形ledライトワイヤ Download PDFInfo
- Publication number
- JP5430635B2 JP5430635B2 JP2011245422A JP2011245422A JP5430635B2 JP 5430635 B2 JP5430635 B2 JP 5430635B2 JP 2011245422 A JP2011245422 A JP 2011245422A JP 2011245422 A JP2011245422 A JP 2011245422A JP 5430635 B2 JP5430635 B2 JP 5430635B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- led light
- light wire
- leds
- integrally formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004020 conductor Substances 0.000 claims abstract description 27
- 239000008393 encapsulating agent Substances 0.000 claims description 37
- 238000000149 argon plasma sintering Methods 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 7
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
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- 238000005286 illumination Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
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- -1 but not limited to Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
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- 239000013536 elastomeric material Substances 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000006424 Flood reaction Methods 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
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- 239000003990 capacitor Substances 0.000 description 1
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- 238000002788 crimping Methods 0.000 description 1
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- 239000002019 doping agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
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- 239000012120 mounting media Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
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- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Description
202 LED
205 電源
Claims (9)
- 導電性素材から成形され、電源から電力を分配するように適合される第1バス構成要素と、
導電性素材から成形され、前記電源から電力を分配するように適合される第2バス構成要素と、
導電性素材から成形され、制御信号を分配するように適合される第3バス構成要素と、
複数の発光ダイオード(LED)モジュールであって、前記複数のLEDモジュールの各々が、マイクロコントローラ及び、並列接続させた逆方向の2個のLED2組を直列接続し、前記2組の2個のLEDが各々異なる色のLEDからなり、各LEDモジュールが、第1、第2、及び第3電気的接点を具備し、前記第1、第2、及び第3電気的接点が、前記第1及び第2バス構成要素から電力を引き込むとともに、前記第3バス構成要素から制御信号を受信するように、前記第1、第2、及び第3バス構成要素上に搭載及び電気的に連結されたものと、
前記第1、第2及び第3バス構成要素と、それぞれの前記マイクロコントローラを含む前記複数のLEDモジュールを完全かつ連続的にカプセル化する封入剤と、を具備し、
前記2組の2個のLEDは、3つの端子を有する
ことを特徴とする一体成形LEDライトワイヤ。 - 前記封入剤は、光散乱粒子をさらに具備することを特徴とする請求項1に記載の一体成形LEDライトワイヤ。
- 各々の前記LEDモジュール及び前記第1及び第2バス構成要素の1つの間の接続は、はんだ、溶接、及び導電性エポキシを具備するグループから選択されることを特徴とする請求項1に記載の一体成形LEDライトワイヤ。
- 前記LEDモジュール及び他の前記第1及び第2バス構成要素の間の接続は、はんだ、溶接、ワイヤボンディング、及び導電性エポキシを具備するグループから選択されることを特徴とする請求項3に記載の一体成形LEDライトワイヤ。
- 前記2組の2個のLEDは、赤色、青色、緑色、及び白色であることを特徴とする請求項1に記載の一体成形LEDライトワイヤ。
- 前記LEDモジュールは各々、前記受信された制御信号を出力する第4接点をさらに具備することを特徴とする請求項1に記載の一体成形LEDライトワイヤ。
- 各LEDモジュールは前記LEDモジュールを管理するために用いられる唯一のアドレスを具備することを特徴とする請求項1に記載の一体成形LEDライトワイヤ。
- 前記アドレスは静的であることを特徴とする請求項7に記載の一体成形LEDライトワイヤ。
- 前記アドレスは動的であることを特徴とする請求項7に記載の一体成形LEDライトワイヤ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84418406P | 2006-09-12 | 2006-09-12 | |
US60/844,184 | 2006-09-12 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008556729A Division JP2009528685A (ja) | 2006-09-12 | 2007-09-12 | 一体的に成形された一体成形発光ダイオードライトワイヤ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013096787A Division JP5599912B2 (ja) | 2006-09-12 | 2013-05-02 | 一体成形ledライトワイヤ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012039154A JP2012039154A (ja) | 2012-02-23 |
JP5430635B2 true JP5430635B2 (ja) | 2014-03-05 |
Family
ID=38645763
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008556729A Pending JP2009528685A (ja) | 2006-09-12 | 2007-09-12 | 一体的に成形された一体成形発光ダイオードライトワイヤ |
JP2011245422A Active JP5430635B2 (ja) | 2006-09-12 | 2011-11-09 | 一体成形ledライトワイヤ |
JP2013096787A Active JP5599912B2 (ja) | 2006-09-12 | 2013-05-02 | 一体成形ledライトワイヤ |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008556729A Pending JP2009528685A (ja) | 2006-09-12 | 2007-09-12 | 一体的に成形された一体成形発光ダイオードライトワイヤ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013096787A Active JP5599912B2 (ja) | 2006-09-12 | 2013-05-02 | 一体成形ledライトワイヤ |
Country Status (13)
Country | Link |
---|---|
US (2) | US7988332B2 (ja) |
EP (1) | EP2061991B1 (ja) |
JP (3) | JP2009528685A (ja) |
KR (1) | KR101070066B1 (ja) |
CN (1) | CN101360947B (ja) |
AT (1) | ATE503149T1 (ja) |
AU (1) | AU2007296902B2 (ja) |
CA (2) | CA2656198C (ja) |
DE (1) | DE602007013419D1 (ja) |
ES (1) | ES2362804T3 (ja) |
HK (1) | HK1127796A1 (ja) |
PL (1) | PL2061991T3 (ja) |
WO (1) | WO2008031580A1 (ja) |
Families Citing this family (78)
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DE102006031345A1 (de) * | 2006-07-06 | 2008-01-10 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Formflexibles Beleuchtungssystem |
US8567992B2 (en) * | 2006-09-12 | 2013-10-29 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
US8807796B2 (en) | 2006-09-12 | 2014-08-19 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
US8052303B2 (en) * | 2006-09-12 | 2011-11-08 | Huizhou Light Engine Ltd. | Integrally formed single piece light emitting diode light wire and uses thereof |
KR101070066B1 (ko) | 2006-09-12 | 2011-10-04 | 후이저우 라이트 엔진 리미티드 | 일체 형성의 싱글 피스 발광 다이오드 라이트 와이어 |
EP2305007B1 (en) * | 2008-07-08 | 2012-12-12 | Koninklijke Philips Electronics N.V. | Methods and apparatus for determining relative positions of led lighting units |
KR101324077B1 (ko) * | 2008-08-26 | 2013-10-31 | 딩구오 판 | 발광 다이오드 멀티 칩 실장 및 실장 탑재로 만들어진 스트립 라이트 |
US20100097791A1 (en) * | 2008-10-18 | 2010-04-22 | Chang Kai-Nan | Light emitting diode (led) strip light |
JP5303251B2 (ja) * | 2008-12-08 | 2013-10-02 | 株式会社小糸製作所 | 給電部材および車両用灯具 |
CN101813263B (zh) * | 2009-02-20 | 2012-02-01 | 深圳市科利尔照明科技有限公司 | 一种制作灯带的方法及灯带 |
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US8187021B2 (en) | 2009-05-01 | 2012-05-29 | Huizhou Light Engine Ltd. | Lighting connector devices and uses thereof |
US8187022B2 (en) | 2009-05-01 | 2012-05-29 | Huizhou Light Engine Ltd. | Lighting connector devices and uses thereof |
BRPI1011661A2 (pt) * | 2009-06-15 | 2016-03-22 | Sharp Kk | unidade de fonte de luz, dispositivo de iluminação, dispositivo de exibição, receptor de televisão, e método para fabricar folha de reflexão para unidade de fonte de luz |
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HK1127796A1 (en) | 2009-10-09 |
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AU2007296902A1 (en) | 2008-03-20 |
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AU2007296902B2 (en) | 2011-08-25 |
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US8789971B2 (en) | 2014-07-29 |
CA2751510C (en) | 2015-05-19 |
CA2656198A1 (en) | 2008-03-20 |
CN101360947A (zh) | 2009-02-04 |
US20080137332A1 (en) | 2008-06-12 |
JP2012039154A (ja) | 2012-02-23 |
JP2009528685A (ja) | 2009-08-06 |
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JP2013153224A (ja) | 2013-08-08 |
ES2362804T3 (es) | 2011-07-13 |
KR101070066B1 (ko) | 2011-10-04 |
CA2656198C (en) | 2012-02-14 |
JP5599912B2 (ja) | 2014-10-01 |
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US7988332B2 (en) | 2011-08-02 |
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