JP2009524260A - エピタキシャル成長したソース・ドレインに選択的に堆積させたキャッピング層の構造および製造方法 - Google Patents
エピタキシャル成長したソース・ドレインに選択的に堆積させたキャッピング層の構造および製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title description 5
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims abstract description 86
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims abstract description 85
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 52
- 239000010703 silicon Substances 0.000 claims abstract description 52
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 47
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 30
- 239000000956 alloy Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 26
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 23
- FCFLBEDHHQQLCN-UHFFFAOYSA-N [Ge].[Si].[Ni] Chemical compound [Ge].[Si].[Ni] FCFLBEDHHQQLCN-UHFFFAOYSA-N 0.000 claims abstract description 13
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 claims abstract description 12
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052796 boron Inorganic materials 0.000 claims abstract description 9
- 238000011065 in-situ storage Methods 0.000 claims abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 50
- 238000000151 deposition Methods 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910052732 germanium Inorganic materials 0.000 claims description 19
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 19
- 239000002019 doping agent Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 9
- 230000008021 deposition Effects 0.000 description 11
- 125000006850 spacer group Chemical group 0.000 description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 238000000407 epitaxy Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 239000003870 refractory metal Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000000038 ultrahigh vacuum chemical vapour deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- QUZPNFFHZPRKJD-UHFFFAOYSA-N germane Chemical compound [GeH4] QUZPNFFHZPRKJD-UHFFFAOYSA-N 0.000 description 1
- 229910052986 germanium hydride Inorganic materials 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007725 thermal activation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/665—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using self aligned silicidation, i.e. salicide
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823814—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
-
- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66628—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation recessing the gate by forming single crystalline semiconductor material at the source or drain location
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66636—Lateral single gate silicon transistors with source or drain recessed by etching or first recessed by etching and then refilled
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7848—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being located in the source/drain region, e.g. SiGe source and drain
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- H01—ELECTRIC ELEMENTS
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
- H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
Abstract
【選択図】図12
Description
Claims (20)
- 基板の表面にゲート電極を形成することと、
前記基板のソース領域およびドレイン領域を等方性エッチングすることと、
前記ソース領域および前記ドレイン領域内にシリコンゲルマニウム合金を堆積することと、
前記シリコンゲルマニウム合金上に、前記シリコンゲルマニウム合金のゲルマニウム濃度より低いゲルマニウム濃度を有する材料の犠牲層を堆積することと、
前記犠牲層に金属を堆積することと、
前記シリコンゲルマニウム合金上に第1のシリサイド層を形成することと、
前記第1のシリサイド層上に第2のシリサイド層を形成することと、
を含む方法。 - 前記シリコンゲルマニウム合金を、その場でホウ素によりドーピングすることをさらに含む、請求項1に記載の方法。
- 前記シリコンゲルマニウム合金は、前記基板の前記表面により定められる平面より上にある上面を有する、請求項1に記載の方法。
- 前記シリコンゲルマニウム合金は、およそ5%乃至50%のゲルマニウム成分を有する、請求項1に記載の方法。
- 前記シリコンゲルマニウム合金は、およそ200乃至1000オングストロームの厚さを有する、請求項1に記載の方法。
- 前記犠牲層は、シリコンを含む、請求項1に記載の方法。
- 前記シリコンは、およそ200乃至400オングストロームの厚さを有する、請求項6に記載の方法。
- 前記犠牲層は、ゲルマニウム成分が30%までのシリコンゲルマニウムを含む、請求項1に記載の方法。
- 前記金属は、ニッケルを含む、請求項1に記載の方法。
- 前記ニッケルは、およそ200乃至400オングストロームの厚さを有する、請求項9に記載の方法。
- 前記第1のシリサイド層は、ニッケルシリコンゲルマニウムシリサイドを含む、請求項9に記載の方法。
- 前記ニッケルシリコンゲルマニウムシリサイドは、およそ200乃至400オングストロームの厚さを有する、請求項11に記載の方法。
- 前記第2のシリサイド層は、ニッケルシリコンシリサイドを含む、請求項9に記載の方法。
- 前記ニッケルシリコンシリサイドは、およそ200乃至400オングストロームの厚さを有する、請求項13に記載の方法。
- 基板の表面にゲート電極を形成することと、
前記基板のソース領域およびドレイン領域を等方性エッチングすることと、
前記ソース領域および前記ドレイン領域内にシリコンゲルマニウム合金を堆積することと、
前記シリコンゲルマニウム合金を、その場でホウ素によりドーピングすることと、
前記シリコンゲルマニウム合金上にシリコンを堆積することと、
前記シリコン上にニッケルを堆積することと、
前記シリコンゲルマニウム合金上にニッケルシリコンシリサイド層を形成することと、
前記ニッケルシリコンシリサイド層上にニッケルシリコンゲルマニウムシリサイド層を形成することと、
を含む方法。 - 前記シリコンゲルマニウム合金は、前記基板の前記表面により定められる平面より上にある上面を有する、請求項15に記載の方法。
- 第1の導電型を有する第1のドーパント不純物を含むチャネル領域を有するシリコンの基板と、
前記チャネル領域上のゲート誘電層と、
前記ゲート誘電層上の導電ゲート電極と、
前記チャネル領域の両側にあり、シリコンゲルマニウム合金からなるソースおよびドレイン領域と、
前記シリコンゲルマニウム合金上に形成されるニッケルシリコンシリサイド層と、
前記ニッケルシリコンシリサイド層上に形成されるニッケルシリコンゲルマニウムシリサイド層と、
を備えるトランジスタ。 - 前記シリコンゲルマニウム合金は、その場でホウ素によりドーピングされる、請求項17に記載のトランジスタ。
- 前記シリコンゲルマニウム合金は、前記基板の前記表面により定められる平面より上にある上面を有する、請求項17に記載のトランジスタ。
- 前記シリコンゲルマニウム合金は、およそ5%乃至50%のゲルマニウム成分を有する、請求項17に記載のトランジスタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/391,928 US20070238236A1 (en) | 2006-03-28 | 2006-03-28 | Structure and fabrication method of a selectively deposited capping layer on an epitaxially grown source drain |
PCT/US2007/064295 WO2007112228A1 (en) | 2006-03-28 | 2007-03-19 | Structure and fabrication method of a selectively deposited capping layer on an epitaxially grown source drain |
Publications (1)
Publication Number | Publication Date |
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JP2009524260A true JP2009524260A (ja) | 2009-06-25 |
Family
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JP2008551579A Pending JP2009524260A (ja) | 2006-03-28 | 2007-03-19 | エピタキシャル成長したソース・ドレインに選択的に堆積させたキャッピング層の構造および製造方法 |
Country Status (6)
Country | Link |
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US (1) | US20070238236A1 (ja) |
JP (1) | JP2009524260A (ja) |
CN (1) | CN101410960B (ja) |
DE (1) | DE112007000760B4 (ja) |
TW (1) | TWI387010B (ja) |
WO (1) | WO2007112228A1 (ja) |
Cited By (1)
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---|---|---|---|---|
US8258576B2 (en) | 2006-10-26 | 2012-09-04 | Fujitsu Semiconductor Limited | Method of manufacturing a semiconductor device including epitaxially growing semiconductor epitaxial layers on a surface of semiconductor substrate |
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---|---|---|---|---|
US6949482B2 (en) | 2003-12-08 | 2005-09-27 | Intel Corporation | Method for improving transistor performance through reducing the salicide interface resistance |
US8124473B2 (en) * | 2007-04-12 | 2012-02-28 | Advanced Micro Devices, Inc. | Strain enhanced semiconductor devices and methods for their fabrication |
US20100006961A1 (en) * | 2008-07-09 | 2010-01-14 | Analog Devices, Inc. | Recessed Germanium (Ge) Diode |
KR101561059B1 (ko) * | 2008-11-20 | 2015-10-16 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
US8598003B2 (en) * | 2009-12-21 | 2013-12-03 | Intel Corporation | Semiconductor device having doped epitaxial region and its methods of fabrication |
US8901537B2 (en) | 2010-12-21 | 2014-12-02 | Intel Corporation | Transistors with high concentration of boron doped germanium |
US9484432B2 (en) * | 2010-12-21 | 2016-11-01 | Intel Corporation | Contact resistance reduction employing germanium overlayer pre-contact metalization |
FR2989517B1 (fr) * | 2012-04-12 | 2015-01-16 | Commissariat Energie Atomique | Reprise de contact sur substrat semi-conducteur heterogene |
CN103632977B (zh) * | 2012-08-29 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及形成方法 |
FR3002688A1 (fr) * | 2013-02-27 | 2014-08-29 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif microelectronique |
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- 2007-03-19 CN CN2007800107810A patent/CN101410960B/zh active Active
- 2007-03-19 JP JP2008551579A patent/JP2009524260A/ja active Pending
- 2007-03-19 DE DE112007000760T patent/DE112007000760B4/de active Active
- 2007-03-22 TW TW096109919A patent/TWI387010B/zh active
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Also Published As
Publication number | Publication date |
---|---|
DE112007000760B4 (de) | 2010-12-02 |
WO2007112228A1 (en) | 2007-10-04 |
TW200746316A (en) | 2007-12-16 |
US20070238236A1 (en) | 2007-10-11 |
DE112007000760T5 (de) | 2009-01-29 |
CN101410960B (zh) | 2010-09-08 |
CN101410960A (zh) | 2009-04-15 |
TWI387010B (zh) | 2013-02-21 |
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