JP2009523633A - 耐インク性カバーコートを有するフレキシブル回路 - Google Patents

耐インク性カバーコートを有するフレキシブル回路 Download PDF

Info

Publication number
JP2009523633A
JP2009523633A JP2008551391A JP2008551391A JP2009523633A JP 2009523633 A JP2009523633 A JP 2009523633A JP 2008551391 A JP2008551391 A JP 2008551391A JP 2008551391 A JP2008551391 A JP 2008551391A JP 2009523633 A JP2009523633 A JP 2009523633A
Authority
JP
Japan
Prior art keywords
circuit
film
block copolymer
circuit article
carrier film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008551391A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009523633A5 (cg-RX-API-DMAC7.html
Inventor
ロナルド・エル・イムケン
タック・ジー・チュオン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority claimed from PCT/US2007/001339 external-priority patent/WO2007084619A1/en
Publication of JP2009523633A publication Critical patent/JP2009523633A/ja
Publication of JP2009523633A5 publication Critical patent/JP2009523633A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14024Assembling head parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14072Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1607Production of print heads with piezoelectric elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14491Electrical connection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/03Specific materials used
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Ink Jet (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2008551391A 2006-01-19 2007-01-19 耐インク性カバーコートを有するフレキシブル回路 Pending JP2009523633A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/334,892 US20070165075A1 (en) 2006-01-19 2006-01-19 Flexible circuits having ink-resistant covercoats
US11/624,638 US7871150B2 (en) 2006-01-19 2007-01-18 Flexible circuits having ink-resistant covercoats
PCT/US2007/001339 WO2007084619A1 (en) 2006-01-19 2007-01-19 Flexible circuits having ink-resistant covercoats

Publications (2)

Publication Number Publication Date
JP2009523633A true JP2009523633A (ja) 2009-06-25
JP2009523633A5 JP2009523633A5 (cg-RX-API-DMAC7.html) 2010-04-02

Family

ID=38262774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008551391A Pending JP2009523633A (ja) 2006-01-19 2007-01-19 耐インク性カバーコートを有するフレキシブル回路

Country Status (4)

Country Link
US (2) US20070165075A1 (cg-RX-API-DMAC7.html)
JP (1) JP2009523633A (cg-RX-API-DMAC7.html)
KR (1) KR20080093996A (cg-RX-API-DMAC7.html)
CN (1) CN101370661B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022535936A (ja) * 2019-07-17 2022-08-10 ザ プロクター アンド ギャンブル カンパニー シリコーン感圧接着剤を備えるマイクロ流体カートリッジ

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101834023B1 (ko) 2010-05-20 2018-03-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 회로 커버필름 부착성 향상
CN102451798A (zh) * 2010-10-14 2012-05-16 研能科技股份有限公司 单孔喷嘴装置
US8794743B2 (en) * 2011-11-30 2014-08-05 Xerox Corporation Multi-film adhesive design for interfacial bonding printhead structures
US8529022B2 (en) * 2011-12-07 2013-09-10 Xerox Corporation Reduction of arc-tracking in chip on flexible circuit substrates
US20140370724A1 (en) * 2012-04-18 2014-12-18 Hewlett-Packard Development Company, L.P. Flexible circuit cable with floating contact
US8740357B1 (en) 2013-02-05 2014-06-03 Xerox Corporation Method and structure for sealing fine fluid features in a printing device
WO2015145439A1 (en) 2014-03-25 2015-10-01 Stratasys Ltd. Method and system for fabricating cross-layer pattern
WO2016151586A1 (en) * 2015-03-25 2016-09-29 Stratasys Ltd. Method and system for in situ sintering of conductive ink

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252328A (ja) * 1999-03-01 2000-09-14 Texas Instr Inc <Ti> 集積回路パッケージ用の2つの面をもつフレキシブル回路および製造方法
JP2001311009A (ja) * 2000-04-28 2001-11-09 Daicel Chem Ind Ltd 熱融着性熱可塑性弾性体組成物及び複層成形体
JP2001316594A (ja) * 2000-05-10 2001-11-16 Daicel Chem Ind Ltd 耐久性に優れた熱可塑性弾性体組成物
JP2002504032A (ja) * 1997-06-06 2002-02-05 ミネソタ マイニング アンド マニュファクチャリング カンパニー インクジェットプリンタペンの結合システムおよびそれを提供するための方法
JP2002344130A (ja) * 2001-05-15 2002-11-29 Canon Inc フレキシブル配線基板の接着方法、フレキシブル配線基板、該フレキシブル配線基板を用いたインクジェットヘッドユニット、およびインクジェット記録装置
JP2003306651A (ja) * 2002-04-15 2003-10-31 Hitachi Chem Co Ltd 多層接着フィルム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874974A (en) 1992-04-02 1999-02-23 Hewlett-Packard Company Reliable high performance drop generator for an inkjet printhead
US5751323A (en) 1994-10-04 1998-05-12 Hewlett-Packard Company Adhesiveless printhead attachment for ink-jet pen
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
US6489042B2 (en) * 1998-12-23 2002-12-03 3M Innovative Properties Company Photoimageable dielectric material for circuit protection
JP4662598B2 (ja) 1999-09-06 2011-03-30 積水化学工業株式会社 反応性ホットメルト接着剤組成物
US6320137B1 (en) * 2000-04-11 2001-11-20 3M Innovative Properties Company Flexible circuit with coverplate layer and overlapping protective layer
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
TW508310B (en) 2001-09-25 2002-11-01 Acer Comm & Amp Multimedia Inc Ink cartridge and method of using flexible circuit board color to represent ink color in the ink cartridge
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US7629537B2 (en) * 2004-07-09 2009-12-08 Finisar Corporation Single layer flex circuit
TW200718300A (en) 2005-08-29 2007-05-01 Innovex Inc Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002504032A (ja) * 1997-06-06 2002-02-05 ミネソタ マイニング アンド マニュファクチャリング カンパニー インクジェットプリンタペンの結合システムおよびそれを提供するための方法
JP2000252328A (ja) * 1999-03-01 2000-09-14 Texas Instr Inc <Ti> 集積回路パッケージ用の2つの面をもつフレキシブル回路および製造方法
JP2001311009A (ja) * 2000-04-28 2001-11-09 Daicel Chem Ind Ltd 熱融着性熱可塑性弾性体組成物及び複層成形体
JP2001316594A (ja) * 2000-05-10 2001-11-16 Daicel Chem Ind Ltd 耐久性に優れた熱可塑性弾性体組成物
JP2002344130A (ja) * 2001-05-15 2002-11-29 Canon Inc フレキシブル配線基板の接着方法、フレキシブル配線基板、該フレキシブル配線基板を用いたインクジェットヘッドユニット、およびインクジェット記録装置
JP2003306651A (ja) * 2002-04-15 2003-10-31 Hitachi Chem Co Ltd 多層接着フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022535936A (ja) * 2019-07-17 2022-08-10 ザ プロクター アンド ギャンブル カンパニー シリコーン感圧接着剤を備えるマイクロ流体カートリッジ

Also Published As

Publication number Publication date
US7871150B2 (en) 2011-01-18
CN101370661A (zh) 2009-02-18
US20070165075A1 (en) 2007-07-19
KR20080093996A (ko) 2008-10-22
CN101370661B (zh) 2011-04-13
US20070165076A1 (en) 2007-07-19

Similar Documents

Publication Publication Date Title
JP2009523633A (ja) 耐インク性カバーコートを有するフレキシブル回路
JP4911795B2 (ja) 積層体の製造方法
JP5433416B2 (ja) 回路材料、回路および多層回路積層板
WO1997030475A1 (fr) Feuille adhesive pour substrat de connexions de semi-conducteurs, bande adhesive utilisee pour le soudage sur bande, bande adhesive pour microcablage, substrat de connexions de semi-conducteurs et dispositif semi-conducteur
US20080254392A1 (en) Flexible circuit with cover layer
US20080081125A1 (en) Method for manufacturing cover lay of printed circuit board
WO2011074418A1 (ja) 多孔質層を有する積層体、及びそれを用いた機能性積層体
KR20200116052A (ko) 수지 조성물
TW201807750A (zh) 支持基板、附設支持基板之疊層體及搭載半導體元件用之封裝基板的製造方法
KR20060048623A (ko) 전자 부품 및 도체 트랙을 결합시키기 위한 열 활성가능한접착 테이프
JP2009007424A (ja) 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム
JP2014028326A (ja) 多孔質層を有する積層体及びその製造方法
JP2003071937A (ja) 積層体及びその製造方法、並びに多層回路基板
JP4863690B2 (ja) 半導体装置製造用接着シート及び半導体装置並びにその製造方法
CN113825316B (zh) 层叠体的制造方法和带树脂层的金属箔
JP4538398B2 (ja) 半導体装置製造用接着シート及び半導体装置の製造方法
WO2007084619A1 (en) Flexible circuits having ink-resistant covercoats
JP5750009B2 (ja) 積層体の製造方法
KR100726247B1 (ko) 기판 형성방법
JP2006176764A (ja) 電子機器用接着剤組成物、電子機器用接着剤シート、およびそれを用いた電子部品ならびに電子機器
JP4665414B2 (ja) 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム
KR101713201B1 (ko) 도전패턴 형성방법
JPH0251470B2 (cg-RX-API-DMAC7.html)
JP2523216B2 (ja) フレキシブルプリント配線板
JP3491377B2 (ja) インクジェットプリンタ用ヘッド及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100119

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110719

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20111019

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20111026

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120710

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20121010

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20121017

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20121108

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20121115

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121207

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130604