JP2009523633A5 - - Google Patents
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- Publication number
- JP2009523633A5 JP2009523633A5 JP2008551391A JP2008551391A JP2009523633A5 JP 2009523633 A5 JP2009523633 A5 JP 2009523633A5 JP 2008551391 A JP2008551391 A JP 2008551391A JP 2008551391 A JP2008551391 A JP 2008551391A JP 2009523633 A5 JP2009523633 A5 JP 2009523633A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- crosslinkable precursor
- adhesive film
- adjacent
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002243 precursor Substances 0.000 claims 7
- 239000002313 adhesive film Substances 0.000 claims 6
- 229920001187 thermosetting polymer Polymers 0.000 claims 4
- 229920001400 block copolymer Polymers 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 3
- -1 aromatic diene Chemical class 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/334,892 US20070165075A1 (en) | 2006-01-19 | 2006-01-19 | Flexible circuits having ink-resistant covercoats |
| US11/624,638 US7871150B2 (en) | 2006-01-19 | 2007-01-18 | Flexible circuits having ink-resistant covercoats |
| PCT/US2007/001339 WO2007084619A1 (en) | 2006-01-19 | 2007-01-19 | Flexible circuits having ink-resistant covercoats |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009523633A JP2009523633A (ja) | 2009-06-25 |
| JP2009523633A5 true JP2009523633A5 (cg-RX-API-DMAC7.html) | 2010-04-02 |
Family
ID=38262774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008551391A Pending JP2009523633A (ja) | 2006-01-19 | 2007-01-19 | 耐インク性カバーコートを有するフレキシブル回路 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US20070165075A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2009523633A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20080093996A (cg-RX-API-DMAC7.html) |
| CN (1) | CN101370661B (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101834023B1 (ko) | 2010-05-20 | 2018-03-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 가요성 회로 커버필름 부착성 향상 |
| CN102451798A (zh) * | 2010-10-14 | 2012-05-16 | 研能科技股份有限公司 | 单孔喷嘴装置 |
| US8794743B2 (en) * | 2011-11-30 | 2014-08-05 | Xerox Corporation | Multi-film adhesive design for interfacial bonding printhead structures |
| US8529022B2 (en) * | 2011-12-07 | 2013-09-10 | Xerox Corporation | Reduction of arc-tracking in chip on flexible circuit substrates |
| US20140370724A1 (en) * | 2012-04-18 | 2014-12-18 | Hewlett-Packard Development Company, L.P. | Flexible circuit cable with floating contact |
| US8740357B1 (en) | 2013-02-05 | 2014-06-03 | Xerox Corporation | Method and structure for sealing fine fluid features in a printing device |
| WO2015145439A1 (en) | 2014-03-25 | 2015-10-01 | Stratasys Ltd. | Method and system for fabricating cross-layer pattern |
| WO2016151586A1 (en) * | 2015-03-25 | 2016-09-29 | Stratasys Ltd. | Method and system for in situ sintering of conductive ink |
| US11938477B2 (en) * | 2019-07-17 | 2024-03-26 | The Procter & Gamble Company | Microfluidic cartridge comprising silicone pressure-sensitive adhesive |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5874974A (en) | 1992-04-02 | 1999-02-23 | Hewlett-Packard Company | Reliable high performance drop generator for an inkjet printhead |
| US5751323A (en) | 1994-10-04 | 1998-05-12 | Hewlett-Packard Company | Adhesiveless printhead attachment for ink-jet pen |
| WO1998055316A1 (en) | 1997-06-06 | 1998-12-10 | Minnesota Mining And Manufacturing Company | Bonding system in an inkjet printer pen and method for providing the same |
| US6294270B1 (en) * | 1998-12-23 | 2001-09-25 | 3M Innovative Properties Company | Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| US6489042B2 (en) * | 1998-12-23 | 2002-12-03 | 3M Innovative Properties Company | Photoimageable dielectric material for circuit protection |
| US6915566B2 (en) * | 1999-03-01 | 2005-07-12 | Texas Instruments Incorporated | Method of fabricating flexible circuits for integrated circuit interconnections |
| JP4662598B2 (ja) | 1999-09-06 | 2011-03-30 | 積水化学工業株式会社 | 反応性ホットメルト接着剤組成物 |
| US6320137B1 (en) * | 2000-04-11 | 2001-11-20 | 3M Innovative Properties Company | Flexible circuit with coverplate layer and overlapping protective layer |
| JP2001311009A (ja) * | 2000-04-28 | 2001-11-09 | Daicel Chem Ind Ltd | 熱融着性熱可塑性弾性体組成物及び複層成形体 |
| JP2001316594A (ja) * | 2000-05-10 | 2001-11-16 | Daicel Chem Ind Ltd | 耐久性に優れた熱可塑性弾性体組成物 |
| US6800169B2 (en) * | 2001-01-08 | 2004-10-05 | Fujitsu Limited | Method for joining conductive structures and an electrical conductive article |
| JP2002344130A (ja) * | 2001-05-15 | 2002-11-29 | Canon Inc | フレキシブル配線基板の接着方法、フレキシブル配線基板、該フレキシブル配線基板を用いたインクジェットヘッドユニット、およびインクジェット記録装置 |
| TW508310B (en) | 2001-09-25 | 2002-11-01 | Acer Comm & Amp Multimedia Inc | Ink cartridge and method of using flexible circuit board color to represent ink color in the ink cartridge |
| JP2003306651A (ja) * | 2002-04-15 | 2003-10-31 | Hitachi Chem Co Ltd | 多層接着フィルム |
| US20050126697A1 (en) * | 2003-12-11 | 2005-06-16 | International Business Machines Corporation | Photochemically and thermally curable adhesive formulations |
| US7629537B2 (en) * | 2004-07-09 | 2009-12-08 | Finisar Corporation | Single layer flex circuit |
| TW200718300A (en) | 2005-08-29 | 2007-05-01 | Innovex Inc | Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing |
-
2006
- 2006-01-19 US US11/334,892 patent/US20070165075A1/en not_active Abandoned
-
2007
- 2007-01-18 US US11/624,638 patent/US7871150B2/en not_active Expired - Fee Related
- 2007-01-19 CN CN2007800025365A patent/CN101370661B/zh not_active Expired - Fee Related
- 2007-01-19 KR KR1020087017525A patent/KR20080093996A/ko not_active Withdrawn
- 2007-01-19 JP JP2008551391A patent/JP2009523633A/ja active Pending