JP2009521131A - 半導体装置とその形成方法 - Google Patents

半導体装置とその形成方法 Download PDF

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Publication number
JP2009521131A
JP2009521131A JP2008550308A JP2008550308A JP2009521131A JP 2009521131 A JP2009521131 A JP 2009521131A JP 2008550308 A JP2008550308 A JP 2008550308A JP 2008550308 A JP2008550308 A JP 2008550308A JP 2009521131 A JP2009521131 A JP 2009521131A
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Japan
Prior art keywords
semiconductor
region
semiconductor region
layer
concentration
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Pending
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JP2008550308A
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English (en)
Japanese (ja)
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JP2009521131A5 (enExample
Inventor
ケムカ、ヴィシュヌ
エム． ピゴット、ジョン
シュ、ロンファ
ボーズ、アミタバ
シー． グレイ、ランドール
ジェイ． ブラウン、ジェフリー
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NXP USA Inc
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NXP USA Inc
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Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2009521131A publication Critical patent/JP2009521131A/ja
Publication of JP2009521131A5 publication Critical patent/JP2009521131A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65—Lateral DMOS [LDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0221—Manufacture or treatment of FETs having insulated gates [IGFET] having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended-drain MOSFETs [EDMOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0281—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of lateral DMOS [LDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs  having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H10D62/115—Dielectric isolations, e.g. air gaps
    • H10D62/116—Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149—Source or drain regions of field-effect devices
    • H10D62/151—Source or drain regions of field-effect devices of IGFETs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/351—Substrate regions of field-effect devices
    • H10D62/357—Substrate regions of field-effect devices of FETs
    • H10D62/364—Substrate regions of field-effect devices of FETs of IGFETs
    • H10D62/371—Inactive supplementary semiconductor regions, e.g. for preventing punch-through, improving capacity effect or leakage current

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  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Bipolar Transistors (AREA)
JP2008550308A 2005-10-31 2006-10-18 半導体装置とその形成方法 Pending JP2009521131A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/264,068 US7276419B2 (en) 2005-10-31 2005-10-31 Semiconductor device and method for forming the same
PCT/US2006/040873 WO2008076092A2 (en) 2005-10-31 2006-10-18 Semiconductor device and method for forming the same

Publications (2)

Publication Number Publication Date
JP2009521131A true JP2009521131A (ja) 2009-05-28
JP2009521131A5 JP2009521131A5 (enExample) 2009-12-03

Family

ID=37995144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008550308A Pending JP2009521131A (ja) 2005-10-31 2006-10-18 半導体装置とその形成方法

Country Status (6)

Country Link
US (1) US7276419B2 (enExample)
EP (1) EP1966826A4 (enExample)
JP (1) JP2009521131A (enExample)
KR (1) KR20080073313A (enExample)
TW (1) TWI409946B (enExample)
WO (1) WO2008076092A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258226A (ja) * 2009-04-24 2010-11-11 Renesas Electronics Corp 半導体装置およびその製造方法
JP2011108758A (ja) * 2009-11-13 2011-06-02 Fujitsu Semiconductor Ltd 高耐圧ｍｏｓトランジスタおよび半導体集積回路装置、高耐圧半導体装置
JP2013145792A (ja) * 2012-01-13 2013-07-25 Toshiba Corp 半導体装置
JP2014143363A (ja) * 2013-01-25 2014-08-07 Rohm Co Ltd ｎチャネル二重拡散ＭＯＳ型トランジスタおよび半導体複合素子

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100875159B1 (ko) * 2007-05-25 2008-12-22 주식회사 동부하이텍 반도체 소자 및 그의 제조 방법
KR20090007053A (ko) * 2007-07-13 2009-01-16 매그나칩 반도체 유한회사 고전압 소자 및 그 제조방법
JP5338433B2 (ja) * 2008-09-30 2013-11-13 富士電機株式会社 窒化ガリウム半導体装置およびその製造方法
US8471340B2 (en) * 2009-11-30 2013-06-25 International Business Machines Corporation Silicon-on-insulator (SOI) structure configured for reduced harmonics and method of forming the structure
US8698244B2 (en) * 2009-11-30 2014-04-15 International Business Machines Corporation Silicon-on-insulator (SOI) structure configured for reduced harmonics, design structure and method
TWI668864B (zh) 2018-08-09 2019-08-11 江啟文 具有電流路徑方向控制的半導體結構
CN117457747B (zh) * 2023-12-22 2024-06-04 粤芯半导体技术股份有限公司 一种嵌入式闪存工艺的demos结构及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000260988A (ja) * 1999-03-12 2000-09-22 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2001168210A (ja) * 1999-10-27 2001-06-22 Texas Instr Inc <Ti> 集積回路用ドレイン拡張型トランジスタ
JP2003197791A (ja) * 2001-12-28 2003-07-11 Sanyo Electric Co Ltd 半導体装置及びその製造方法
WO2004042826A2 (en) * 2002-10-31 2004-05-21 Freescale Semiconductor, Inc. Semiconductor component comprising a resur transistor and method of manufacturing same
JP2007027641A (ja) * 2005-07-21 2007-02-01 Toshiba Corp 半導体装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387553A (en) * 1992-03-24 1995-02-07 International Business Machines Corporation Method for forming a lateral bipolar transistor with dual collector, circular symmetry and composite structure
US6573562B2 (en) * 2001-10-31 2003-06-03 Motorola, Inc. Semiconductor component and method of operation
KR100958421B1 (ko) * 2002-09-14 2010-05-18 페어차일드코리아반도체 주식회사 전력 소자 및 그 제조방법
US6693339B1 (en) * 2003-03-14 2004-02-17 Motorola, Inc. Semiconductor component and method of manufacturing same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000260988A (ja) * 1999-03-12 2000-09-22 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2001168210A (ja) * 1999-10-27 2001-06-22 Texas Instr Inc <Ti> 集積回路用ドレイン拡張型トランジスタ
JP2003197791A (ja) * 2001-12-28 2003-07-11 Sanyo Electric Co Ltd 半導体装置及びその製造方法
WO2004042826A2 (en) * 2002-10-31 2004-05-21 Freescale Semiconductor, Inc. Semiconductor component comprising a resur transistor and method of manufacturing same
JP2007027641A (ja) * 2005-07-21 2007-02-01 Toshiba Corp 半導体装置及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258226A (ja) * 2009-04-24 2010-11-11 Renesas Electronics Corp 半導体装置およびその製造方法
JP2011108758A (ja) * 2009-11-13 2011-06-02 Fujitsu Semiconductor Ltd 高耐圧ｍｏｓトランジスタおよび半導体集積回路装置、高耐圧半導体装置
JP2013145792A (ja) * 2012-01-13 2013-07-25 Toshiba Corp 半導体装置
JP2014143363A (ja) * 2013-01-25 2014-08-07 Rohm Co Ltd ｎチャネル二重拡散ＭＯＳ型トランジスタおよび半導体複合素子
US9812565B2 (en) 2013-01-25 2017-11-07 Rohm Co., Ltd. N-channel double diffusion MOS transistor with p-type buried layer underneath n-type drift and drain layers, and semiconductor composite device

Also Published As

Publication number Publication date
EP1966826A4 (en) 2013-06-19
WO2008076092A2 (en) 2008-06-26
US20070096225A1 (en) 2007-05-03
TWI409946B (zh) 2013-09-21
EP1966826A2 (en) 2008-09-10
WO2008076092A3 (en) 2009-02-12
TW200725889A (en) 2007-07-01
US7276419B2 (en) 2007-10-02
KR20080073313A (ko) 2008-08-08

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