JP2009507380A - 加工物移送装置 - Google Patents
加工物移送装置 Download PDFInfo
- Publication number
- JP2009507380A JP2009507380A JP2008529332A JP2008529332A JP2009507380A JP 2009507380 A JP2009507380 A JP 2009507380A JP 2008529332 A JP2008529332 A JP 2008529332A JP 2008529332 A JP2008529332 A JP 2008529332A JP 2009507380 A JP2009507380 A JP 2009507380A
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- transfer assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 11
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 230000007547 defect Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (13)
- 加工物の外側輪郭に対応する1つ以上の加工物係合部分を含む複数の協働アームを備える加工物移送アセンブリであって、
前記加工物係合部分が、加工物の外側輪郭の端部に係合できる加工物係合表面を有し、少なくとも1つの前記協働アームが、前記加工物係合表面から前記加工物の外側端部上に加わる圧力に応じて、前記加工物の端部から離れる方向に前記加工物係合表面の変形を可能にする1つ以上のたわみアセンブリを含んでいることを特徴とする加工物移送アセンブリ。 - 一対の協働アームを含んでいることを特徴とする請求項1記載の加工物移送アセンブリ。
- 前記一対の協働アームは、前記加工物の外側端部に係合して枢軸点のまわりに回転する、固定アームと移動アームを有することを特徴とする請求項2記載の加工物移送アセンブリ。
- 前記協働アームの各々は、2つの先端部のそれぞれに弓状部分を有し、かつ各協働アームは、枢軸点で連結されていることを特徴とする請求項3記載の加工物移送アセンブリ。
- 前記移動アームは、前記加工物係合表面の外側に、移動アームの一部分を形成するたわみアセンブリを含んでいることを特徴とする請求項3記載の加工物移送アセンブリ。
- 前記たわみアセンブリは、前記移動アームの枢軸部分と前記移動アームの加工物係合部分との間にノッチカット部を有することを特徴とする請求項5記載の加工物移送アセンブリ。
- 前記たわみアセンブリは、加工物係合表面を形成する可撓性フィンガーを含んでいることを特徴とする請求項3記載の加工物移送アセンブリ。
- 直線経路に沿って前記協働アームを移動するリニアアクチュエータを含んでいることを特徴とする請求項1記載の加工物移送アセンブリ。
- 前記枢軸のまわりに協働アームを回転させる大規模回転アクチュエータを含んでいることを特徴とする請求項3記載の加工物移送アセンブリ。
- 前記加工物を保持しかつ解放するために、前記固定アームに対して枢軸まわりに移動アームを回転させる小規模回転アクチュエータを含んでいることを特徴とする請求項3記載の加工物移送アセンブリ。
- 1つ以上の加工物を操作する方法であって、
1つまたは2つの協働アームに、少なくとも1つのたわみ要素を含む一対の前記協働アームを設け、
前記一対の協働アームの各々を、前記加工物の外側端部に近接するように配置し、
前記協働アームの他方に対して前記協働アームの一方を前記加工物の外側端部に係合するように前記加工物に向けて移動する各工程を含み、
前記少なくとも1つのたわみ要素が、前記外側端部に係合することによって生じた圧力に応じて屈曲し、前記圧力を解放することを特徴とする方法。 - 前記たわみ要素は、前記アームに設けられたノッチ部分を含んでいることを特徴とする請求項11記載の方法。
- 前記たわみ要素は、加工物係合表面を含む可撓性フィンガーから構成されることを特徴とする請求項11記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/219,281 US7344352B2 (en) | 2005-09-02 | 2005-09-02 | Workpiece transfer device |
US11/219,281 | 2005-09-02 | ||
PCT/US2006/034323 WO2007028074A2 (en) | 2005-09-02 | 2006-08-31 | Workpiece transfer device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009507380A true JP2009507380A (ja) | 2009-02-19 |
JP5293953B2 JP5293953B2 (ja) | 2013-09-18 |
Family
ID=37499657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008529332A Active JP5293953B2 (ja) | 2005-09-02 | 2006-08-31 | 加工物移送装置及びその方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7344352B2 (ja) |
EP (1) | EP1922750A2 (ja) |
JP (1) | JP5293953B2 (ja) |
KR (1) | KR101396623B1 (ja) |
CN (1) | CN101253616B (ja) |
TW (1) | TWI413200B (ja) |
WO (1) | WO2007028074A2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011119348A (ja) * | 2009-12-01 | 2011-06-16 | Kawasaki Heavy Ind Ltd | エッジグリップ装置、及びそれを備えるロボット。 |
JP2013158895A (ja) * | 2012-02-08 | 2013-08-19 | Kawasaki Heavy Ind Ltd | 板状部材を搬送するエンドエフェクタ及び該エンドエフェクタを備える基板搬送用ロボット |
KR20150067134A (ko) * | 2012-08-03 | 2015-06-17 | 액셀리스 테크놀러지스, 인크. | 진공식 고속 예냉 스테이션 및 후열 스테이션 |
JP2015523704A (ja) * | 2013-10-02 | 2015-08-13 | アクセリス テクノロジーズ, インコーポレイテッド | 真空下での高速前冷却および後加熱ステーション |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5043021B2 (ja) * | 2005-10-04 | 2012-10-10 | アプライド マテリアルズ インコーポレイテッド | 基板を乾燥するための方法及び装置 |
KR100947480B1 (ko) * | 2007-10-08 | 2010-03-17 | 세메스 주식회사 | 스핀 헤드 및 이에 사용되는 척 핀, 그리고 상기 스핀헤드를 사용하여 기판을 처리하는 방법 |
KR101160172B1 (ko) * | 2008-11-26 | 2012-06-28 | 세메스 주식회사 | 스핀 헤드 |
TWI452277B (zh) | 2011-12-07 | 2014-09-11 | Hon Hai Prec Ind Co Ltd | 鏡頭模組測試系統 |
JP6594177B2 (ja) * | 2015-11-24 | 2019-10-23 | 平田機工株式会社 | ハンド部材およびハンド |
KR102448440B1 (ko) * | 2016-09-27 | 2022-09-27 | 호도가야 가가쿠 고교 가부시키가이샤 | 증감 색소, 광전 변환용 증감 색소 및 그것을 사용한 광전 변환 소자 그리고 색소 증감 태양 전지 |
KR20210106022A (ko) | 2019-01-18 | 2021-08-27 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 처리 툴들 및 그의 방법들 |
CN114433444B (zh) * | 2022-04-11 | 2022-07-01 | 四川上特科技有限公司 | 用于晶圆涂覆玻璃粉的盛料转移装置 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63132444A (ja) * | 1986-11-21 | 1988-06-04 | Nissin Electric Co Ltd | ウエハハンドリング装置 |
JPS63293849A (ja) * | 1987-05-27 | 1988-11-30 | Hitachi Ltd | ウェハ用キャリヤ |
JPH07335173A (ja) * | 1993-12-22 | 1995-12-22 | Eaton Corp | イオン注入機用の走査及び傾動装置 |
US6190103B1 (en) * | 1999-03-31 | 2001-02-20 | Gasonics International Corporation | Wafer transfer device and method |
JP2001093968A (ja) * | 1999-09-21 | 2001-04-06 | Olympus Optical Co Ltd | 円板状部材の保持装置 |
US6513848B1 (en) * | 1999-09-17 | 2003-02-04 | Applied Materials, Inc. | Hydraulically actuated wafer clamp |
US6578893B2 (en) * | 2000-10-02 | 2003-06-17 | Ajs Automation, Inc. | Apparatus and methods for handling semiconductor wafers |
JP2003524881A (ja) * | 1999-05-04 | 2003-08-19 | エーディーイー コーポレーション | エッジグリッピングエンドエフェクタウエーハハンドリング装置 |
JP2003282666A (ja) * | 2002-03-25 | 2003-10-03 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板処理装置 |
JP2004524709A (ja) * | 2001-04-28 | 2004-08-12 | ライカ マイクロシステムス イェーナ ゲゼルシャフト ミット ベシュレンクテル ハフツング | ウェーハ用保持装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4020846A (en) * | 1975-09-26 | 1977-05-03 | Stokes Henry W | Splinter puller |
US5172951A (en) | 1990-08-06 | 1992-12-22 | University Of Utah Research Foundation | Robotic grasping apparatus |
US5229615A (en) | 1992-03-05 | 1993-07-20 | Eaton Corporation | End station for a parallel beam ion implanter |
JPH0890477A (ja) | 1994-09-29 | 1996-04-09 | Shimadzu Corp | マイクログリップ |
JP2001312928A (ja) * | 2000-04-28 | 2001-11-09 | Tyco Electronics Amp Kk | ハーネス収納装置 |
-
2005
- 2005-09-02 US US11/219,281 patent/US7344352B2/en active Active
-
2006
- 2006-08-31 CN CN200680031580.4A patent/CN101253616B/zh active Active
- 2006-08-31 EP EP06802849A patent/EP1922750A2/en not_active Withdrawn
- 2006-08-31 WO PCT/US2006/034323 patent/WO2007028074A2/en active Application Filing
- 2006-08-31 JP JP2008529332A patent/JP5293953B2/ja active Active
- 2006-08-31 KR KR1020087007131A patent/KR101396623B1/ko active IP Right Grant
- 2006-09-04 TW TW095132540A patent/TWI413200B/zh active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63132444A (ja) * | 1986-11-21 | 1988-06-04 | Nissin Electric Co Ltd | ウエハハンドリング装置 |
JPS63293849A (ja) * | 1987-05-27 | 1988-11-30 | Hitachi Ltd | ウェハ用キャリヤ |
JPH07335173A (ja) * | 1993-12-22 | 1995-12-22 | Eaton Corp | イオン注入機用の走査及び傾動装置 |
US6190103B1 (en) * | 1999-03-31 | 2001-02-20 | Gasonics International Corporation | Wafer transfer device and method |
JP2003524881A (ja) * | 1999-05-04 | 2003-08-19 | エーディーイー コーポレーション | エッジグリッピングエンドエフェクタウエーハハンドリング装置 |
US6513848B1 (en) * | 1999-09-17 | 2003-02-04 | Applied Materials, Inc. | Hydraulically actuated wafer clamp |
JP2001093968A (ja) * | 1999-09-21 | 2001-04-06 | Olympus Optical Co Ltd | 円板状部材の保持装置 |
US6578893B2 (en) * | 2000-10-02 | 2003-06-17 | Ajs Automation, Inc. | Apparatus and methods for handling semiconductor wafers |
JP2004524709A (ja) * | 2001-04-28 | 2004-08-12 | ライカ マイクロシステムス イェーナ ゲゼルシャフト ミット ベシュレンクテル ハフツング | ウェーハ用保持装置 |
JP2003282666A (ja) * | 2002-03-25 | 2003-10-03 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板処理装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011119348A (ja) * | 2009-12-01 | 2011-06-16 | Kawasaki Heavy Ind Ltd | エッジグリップ装置、及びそれを備えるロボット。 |
JP2013158895A (ja) * | 2012-02-08 | 2013-08-19 | Kawasaki Heavy Ind Ltd | 板状部材を搬送するエンドエフェクタ及び該エンドエフェクタを備える基板搬送用ロボット |
KR20150067134A (ko) * | 2012-08-03 | 2015-06-17 | 액셀리스 테크놀러지스, 인크. | 진공식 고속 예냉 스테이션 및 후열 스테이션 |
KR102126367B1 (ko) * | 2012-08-03 | 2020-06-24 | 액셀리스 테크놀러지스, 인크. | 진공식 고속 예냉 스테이션 및 후열 스테이션 |
JP2015523704A (ja) * | 2013-10-02 | 2015-08-13 | アクセリス テクノロジーズ, インコーポレイテッド | 真空下での高速前冷却および後加熱ステーション |
Also Published As
Publication number | Publication date |
---|---|
WO2007028074A2 (en) | 2007-03-08 |
TW200721356A (en) | 2007-06-01 |
CN101253616B (zh) | 2014-08-06 |
CN101253616A (zh) | 2008-08-27 |
US7344352B2 (en) | 2008-03-18 |
US20070065267A1 (en) | 2007-03-22 |
TWI413200B (zh) | 2013-10-21 |
KR101396623B1 (ko) | 2014-05-16 |
KR20080040775A (ko) | 2008-05-08 |
EP1922750A2 (en) | 2008-05-21 |
JP5293953B2 (ja) | 2013-09-18 |
WO2007028074A3 (en) | 2007-05-31 |
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