JP2022524014A - 円形ウェハ横方向位置決め装置 - Google Patents
円形ウェハ横方向位置決め装置 Download PDFInfo
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- JP2022524014A JP2022524014A JP2021552735A JP2021552735A JP2022524014A JP 2022524014 A JP2022524014 A JP 2022524014A JP 2021552735 A JP2021552735 A JP 2021552735A JP 2021552735 A JP2021552735 A JP 2021552735A JP 2022524014 A JP2022524014 A JP 2022524014A
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- 230000007246 mechanism Effects 0.000 claims abstract description 77
- 230000033001 locomotion Effects 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 8
- 229920002530 polyetherether ketone Polymers 0.000 claims description 8
- 238000010586 diagram Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 132
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 238000005452 bending Methods 0.000 description 11
- 239000012530 fluid Substances 0.000 description 10
- 239000002131 composite material Substances 0.000 description 9
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (20)
- ウェハ位置決め装置であって、
チャックの表面上のクランプ位置の周縁部に位置決めされる少なくとも1つの固定された停止部と、
伸展可能なフィンガーと、
前記フィンガーを前記チャック表面の中心に向かって外側に伸展し、前記フィンガーを前記チャック表面の前記中心から後退させるためのフィンガー伸展機構と
を含み、
前記フィンガーは、ウェハが前記チャック表面に載置されて前記フィンガー伸展機構が前記フィンガーを外側に伸展するように動作するときに、前記フィンガーの遠位端が前記クランプ位置の前記周縁部にある状態で前記ウェハの端部が前記少なくとも1つの固定された停止部に接触するまで前記ウェハを前記少なくとも1つの固定された停止部に向かって横方向に押すように構成されている装置。 - 前記クランプ位置の前記周縁部が円形である請求項1に記載の装置。
- 前記少なくとも1つの固定された停止部が、前記チャックの前記表面の平面から外側に延びる少なくとも1つのピンを含む請求項1又は請求項2に記載の装置。
- 前記ピンが、前記チャックの前記表面に対して実質的に垂直に延びる請求項3に記載の装置。
- 前記少なくとも1つのピンが、前記クランプ位置の前記周縁部の異なる方位角位置に2つのピンを含む請求項3又は請求項4に記載の装置。
- 前記少なくとも1つのピンがポリエーテルエーテルケトン(PEEK)を含む請求項3から請求項5のいずれか1項に記載の装置。
- 前記フィンガー伸展機構が、回転可能なアームと、前記アームを回転させるための回転機構とを含み、前記フィンガーが、前記アームを1つの方向に回転させるための前記回転機構の動作が前記フィンガーを前記チャック表面の前記中心に向かって外側に伸展し、前記アームを反対方向に回転させるための前記回転機構の動作が前記フィンガーを前記チャック表面の前記中心から後退させるように、前記アームに取り付けられている請求項1から請求項6のいずれか1項に記載のウェハ位置決め装置。
- 前記アームが、回転可能な柱状部に結合されている請求項7に記載の装置。
- 前記アームの近位端が、前記回転可能な柱状部に結合されている請求項8に記載の装置。
- 前記回転機構が空気圧で動作する請求項7から請求項9のいずれか1項に記載の装置。
- 前記回転機構が2つの空気圧入口に接続されており、前記空気圧入口の一方に加圧ガスを印加すると、回転機構が前記アームを前記1つの方向に回転させ、他方の空気圧入口に加圧ガスを印加すると、回転機構が前記アームを前記反対方向に回転させる請求項10に記載の装置。
- 前記回転機構及びアームが、前記チャック表面上にウェハが載置されていない状態で前記フィンガーが完全に伸展されるように前記アームが回転されたときに、前記フィンガーの前記遠位端が前記クランプ位置の前記周縁部内に位置するように構成されている請求項7から請求項10のいずれか1項に記載の装置。
- 前記アームが、柔軟性を有しかつ弾力性を有する請求項12に記載の装置。
- 前記アームがU字型の屈曲部を含む請求項13に記載の装置。
- 前記アームが、2つの実質的に平行なフィンガーアーム又は渦巻き状アームを含む請求項13に記載の装置。
- 前記回転機構及びアームが、前記フィンガーが完全に後退するように前記アームが回転されたときに、前記フィンガーの前記遠位端が前記クランプ位置の前記周縁部の外部にあるように構成されている請求項7から請求項15のいずれか1項に記載の装置。
- 前記アームのハウジングが、前記フィンガーが完全に後退しているときに前記チャック表面上での前記ウェハの横方向の移動を制限するための遠位突起を含む請求項16に記載の装置。
- 前記フィンガー伸展機構が、長手方向に並進可能なアームを含み、前記フィンガーが、弾性要素によって前記アームに取り付けられている請求項1から請求項6のいずれか1項に記載の装置。
- 前記フィンガー伸展機構が、2つの脚部を有するアームを含み、前記脚部の一方の近位端にある足部が固定されており、他方の脚部の近位端にある足部が直線的に並進可能である請求項1から請求項6のいずれか1項に記載の装置。
- 前記チャックをさらに含む請求項1から請求項19のいずれか1項に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962817605P | 2019-03-13 | 2019-03-13 | |
US62/817,605 | 2019-03-13 | ||
PCT/IL2020/050284 WO2020183464A1 (en) | 2019-03-13 | 2020-03-11 | Circular wafer lateral positioning device |
Publications (2)
Publication Number | Publication Date |
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JP2022524014A true JP2022524014A (ja) | 2022-04-27 |
JP7541991B2 JP7541991B2 (ja) | 2024-08-29 |
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JP2021552735A Active JP7541991B2 (ja) | 2019-03-13 | 2020-03-11 | 円形ウェハ横方向位置決め装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US12020974B2 (ja) |
EP (1) | EP3939075A4 (ja) |
JP (1) | JP7541991B2 (ja) |
KR (1) | KR20210137081A (ja) |
CN (1) | CN113557599A (ja) |
WO (1) | WO2020183464A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3989270B1 (en) * | 2020-10-20 | 2022-10-05 | Semsysco GmbH | Clipping mechanism for fastening a substrate for a surface treatment of the substrate |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5485679A (en) * | 1977-12-20 | 1979-07-07 | Canon Inc | Wafer aligning unit |
JPS6267203U (ja) | 1985-10-17 | 1987-04-27 | ||
US6692219B2 (en) * | 2000-11-29 | 2004-02-17 | Tokyo Electron Limited | Reduced edge contact wafer handling system and method of retrofitting and using same |
JP4488646B2 (ja) | 2001-04-23 | 2010-06-23 | 株式会社トプコン | ウェーハ保持装置 |
US6678581B2 (en) | 2002-01-14 | 2004-01-13 | Taiwan Semiconductor Manufacturing Co. Ltd | Method of calibrating a wafer edge gripping end effector |
US7256132B2 (en) * | 2002-07-31 | 2007-08-14 | Applied Materials, Inc. | Substrate centering apparatus and method |
US7499767B2 (en) * | 2003-02-20 | 2009-03-03 | Applied Materials, Inc. | Methods and apparatus for positioning a substrate relative to a support stage |
EP1450398A3 (en) | 2003-02-20 | 2004-11-10 | Applied Materials, Inc. | A method and an apparatus for positioning a substrate relative to a support stage |
JP4362414B2 (ja) | 2003-12-18 | 2009-11-11 | 株式会社リコー | ワークセンタリング・クランプ装置、回転駆動装置及び電子ビーム露光装置 |
DE102007010224B4 (de) * | 2007-02-28 | 2010-08-05 | Vistec Semiconductor Systems Jena Gmbh | Vorrichtung zum Haltern von scheibenförmigen Objekten |
US8528886B2 (en) | 2009-02-02 | 2013-09-10 | Corning Incorporated | Material sheet handling system and processing methods |
JP5731838B2 (ja) | 2010-02-10 | 2015-06-10 | キヤノンアネルバ株式会社 | トレイ式基板搬送システム、成膜方法及び電子装置の製造方法 |
JP6267203B2 (ja) | 2012-08-31 | 2018-01-24 | セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド | 多機能ウェハー及びフィルムフレームハンドリングシステム |
US10068792B2 (en) * | 2016-05-31 | 2018-09-04 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
JP2018120935A (ja) | 2017-01-25 | 2018-08-02 | 東レエンジニアリング株式会社 | ウエーハ保持装置 |
KR102217780B1 (ko) * | 2018-06-12 | 2021-02-19 | 피에스케이홀딩스 (주) | 정렬 장치 |
-
2020
- 2020-03-11 CN CN202080020552.2A patent/CN113557599A/zh active Pending
- 2020-03-11 KR KR1020217031403A patent/KR20210137081A/ko active Search and Examination
- 2020-03-11 WO PCT/IL2020/050284 patent/WO2020183464A1/en unknown
- 2020-03-11 EP EP20771105.2A patent/EP3939075A4/en not_active Withdrawn
- 2020-03-11 US US17/437,005 patent/US12020974B2/en active Active
- 2020-03-11 JP JP2021552735A patent/JP7541991B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP3939075A1 (en) | 2022-01-19 |
EP3939075A4 (en) | 2022-11-30 |
WO2020183464A1 (en) | 2020-09-17 |
US20220181191A1 (en) | 2022-06-09 |
JP7541991B2 (ja) | 2024-08-29 |
US12020974B2 (en) | 2024-06-25 |
CN113557599A (zh) | 2021-10-26 |
TW202038370A (zh) | 2020-10-16 |
KR20210137081A (ko) | 2021-11-17 |
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