JP2009501088A - レーザリンク処理システムの加工レーザビームの歪みを抑制する方法 - Google Patents
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- H—ELECTRICITY
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- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
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- H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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Abstract
【解決手段】 レーザリンク処理システム(100)による処理のために提供されるターゲット見本(14)に入射するために方向付けられる加工レーザビーム(12‘)の歪みを抑制する方法は、加工レーザビームから迷光誘起歪みを除去するために空間フィルタ(102)を使用する。
【選択図】 図4
Description
著作権2006 Electro Scientific Industries, Inc. この特許書類の一部の開示内容は著作権保護に付される資料を含む。著作権者は、それが米国特許商標庁の特許ファイル又は記録物に表されているので、いずれかの者による特許書類又は特許開示内容のファクシミリによる複製に異論はないが、すべての著作権を保持する。37 CFR § 1.71(d).
Claims (16)
- レーザリンク処理システムによる処理のために提供されるターゲット見本に入射させるために方向付けされる加工レーザビームの歪みを抑制する方法であって、前記加工レーザビームは、レーザから伝播しかつ減衰器によって減衰されるレーザ出力ビームから派生され、前記レーザ及び前記減衰器は前記レーザリンク処理システムの一部を形成し、前記レーザビームの前記歪みは前記レーザ出力ビームの減衰量の増大に応じて優位にほぼ増加し、
減衰器出力ビームを形成するために前記減衰器に前記レーザ出力ビームを方向付けること、
焦点レンズ及びアパーチュアを含む空間フィルタを設けること、
前記焦点レンズに関連した焦点領域において焦点が合わされたビームを形成するために前記焦点レンズに前記減衰器出力ビームを方向付けすることを含み、前記焦点が合わされたビームは1次ビーム成分及び迷光成分を含み、前記迷光成分は前記減衰器出力ビームに結合するリンク処理システムの散乱光から生じ、前記1次ビーム成分は空間周波数に焦点を合わせ、前記迷光成分は前記1次ビーム成分の空間周波数より高い空間周波数に焦点を合わせ、
前記1次ビーム成分が遮られずに通過できかつ前記迷光成分を遮蔽でき、それにより前記加工レーザビームから迷光から迷光によって誘起される歪みを取り除くことができるように前記アパーチュアを前記焦点領域に、又は前記焦点領域の近くに配置することを含む、加工レーザビームの歪みの抑制方法。 - 前記レーザ出力ビームは、前記レーザ出力ビームの所望の波長を達成するために高調波発生によって形成されている、請求項1に記載の方法。
- 前記所望の波長は、約266nmと約532nmとの間の波長範囲内にある請求項2に記載の方法。
- 前記1次ビーム成分は実質的にガウス形状のビーム強度分布を有する請求項1に記載の方法。
- 前記ガウス形状を有する1次ビーム成分は前記アパーチュアを遮られずに通過する中央部分を含む、請求項4に記載の方法。
- 前記減衰器は音響光学変調器を含み、前記迷光成分は前記減衰器出力ビームを形成するために前記音響光学変調器の動作によって実質的に影響されない、請求項1に記載の方法。
- 前記迷光成分は前記減衰器出力ビームを形成するために前記音響光学変調器の動作によって実質的に影響されない、請求項1に記載の方法。
- 前記1次ビーム成分はビーム軸線に沿って伝播し、前記アパーチュアは前記ビーム軸線の周りにほぼ対称的に配置されている、請求項1に記載の方法。
- 前記1次ビーム成分はビーム軸線に沿って伝播し、前記アパーチュアは前記ビーム軸線の一方の側に実質的に配置されている、請求項1に記載の方法。
- 前記アパーチュアはオリフィスを有し、前記焦点領域は焦点を有し、前記オリフィスは前記焦点に実質的に位置付けされる、請求項1に記載の方法。
- 前記焦点が合わせられたビームは、前記焦点領域において前記減衰器出力ビームの回折限界に達する十分小さいスポットサイズを示す、請求項1に記載の方法。
- 前記1次ビーム成分はビームウエストを有し、前記アパーチュアは、前記1次ビーム成分の前記ビームウエストが遮られず通過できるように位置付けされる、請求項1に記載の方法。
- 前記ビームウエストから前記1次ビーム成分を平行にすることを含む、請求項12に記載の方法。
- 前記加工レーザビームの処理は前記ターゲット見本に設けられた位置合わせターゲットを走査することを含む、請求項1に記載の方法。
- 前記空間フィルタがない場合、前記減衰器出力ビームを形成するための前記減衰器の前記動作は、前記1次ビーム成分の前記強度に対して前記迷光成分の強度の値を増大させる、前記レーザ出力ビームに与えられる減衰量の増加に応じて位置合わせエラーを生じる、請求項14に記載の方法。
- 前記空間フィルタがない場合、前記減衰器出力ビームを形成するための前記減衰器の前記動作は、前記1次ビーム成分の前記強度に対して前記迷光成分の強度の値を増大させる、前記レーザ出力ビームに与えられる減衰量の増加に応じてレーザ出力ビームスポットサイズの歪みを生じ、それによって前記加工レーザビームのスポットサイズ測定の精度を低下させる、請求項1に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70003105P | 2005-07-15 | 2005-07-15 | |
US60/700,031 | 2005-07-15 | ||
US11/440,696 US7423818B2 (en) | 2005-07-15 | 2006-05-24 | Method of suppressing distortion of a working laser beam of a laser link processing system |
US11/440,696 | 2006-05-24 | ||
PCT/US2006/027032 WO2007011604A1 (en) | 2005-07-15 | 2006-07-11 | Method of suppressing distortion of a working laser beam of a laser link processing system |
Publications (2)
Publication Number | Publication Date |
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JP2009501088A true JP2009501088A (ja) | 2009-01-15 |
JP5225083B2 JP5225083B2 (ja) | 2013-07-03 |
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JP2008521562A Expired - Fee Related JP5225083B2 (ja) | 2005-07-15 | 2006-07-11 | レーザリンク処理システムの加工レーザビームの歪みを抑制する方法 |
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Country | Link |
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US (1) | US7423818B2 (ja) |
JP (1) | JP5225083B2 (ja) |
KR (1) | KR101266177B1 (ja) |
CN (1) | CN101223628B (ja) |
DE (1) | DE112006001869T5 (ja) |
GB (1) | GB2442677B (ja) |
TW (1) | TWI366492B (ja) |
WO (1) | WO2007011604A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020097786A (ja) * | 2016-10-24 | 2020-06-25 | ツェーエル・シュッツレヒツフェアヴァルトゥングス・ゲゼルシャフト・ミト・べシュレンクテル・ハフツング | 三次元の物体を付加製造するための装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7616669B2 (en) * | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
US8178818B2 (en) * | 2008-03-31 | 2012-05-15 | Electro Scientific Industries, Inc. | Photonic milling using dynamic beam arrays |
US9080991B2 (en) * | 2008-09-29 | 2015-07-14 | Kla-Tencor Corp. | Illuminating a specimen for metrology or inspection |
US9080990B2 (en) | 2008-09-29 | 2015-07-14 | Kla-Tencor Corp. | Illumination subsystems of a metrology system, metrology systems, and methods for illuminating a specimen for metrology measurements |
US8031414B1 (en) * | 2009-04-24 | 2011-10-04 | Jefferson Science Associates, Llc | Single lens laser beam shaper |
KR102138223B1 (ko) | 2011-07-05 | 2020-07-28 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 사용 중 음향-광학 빔 편향기와 음향-광학 변조기에 온도 안정성을 제공하기 위한 시스템 및 방법 |
JP6193305B2 (ja) | 2014-07-29 | 2017-09-06 | ウルトラテック インク | 高性能線形成光学システム及び方法 |
DE102021112833A1 (de) | 2021-05-18 | 2022-11-24 | Precitec Gmbh & Co. Kg | Blende für einen Laserbearbeitungskopf |
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- 2006-05-24 US US11/440,696 patent/US7423818B2/en active Active
- 2006-07-11 GB GB0802259A patent/GB2442677B/en not_active Expired - Fee Related
- 2006-07-11 WO PCT/US2006/027032 patent/WO2007011604A1/en active Application Filing
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Patent Citations (11)
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JPS63230284A (ja) * | 1987-03-18 | 1988-09-26 | Nec Corp | レ−ザ−トリミング装置 |
JPH026089A (ja) * | 1988-06-21 | 1990-01-10 | Matsushita Electric Ind Co Ltd | レーザトリミング装置 |
JPH0259187A (ja) * | 1988-08-25 | 1990-02-28 | Matsushita Electric Ind Co Ltd | レーザトリミング装置およびトリミング方法 |
JPH04288988A (ja) * | 1991-03-18 | 1992-10-14 | Hitachi Ltd | レーザ加工方法とその装置並びに透過型液晶素子、配線パターン欠陥修正方法とその装置 |
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JPH10328873A (ja) * | 1997-06-04 | 1998-12-15 | Nikon Corp | レーザ加工装置 |
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JP2004130754A (ja) * | 2002-10-15 | 2004-04-30 | Noritsu Koki Co Ltd | 写真プリント装置 |
JP2005034859A (ja) * | 2003-07-17 | 2005-02-10 | Sumitomo Heavy Ind Ltd | レーザ加工装置 |
JP2007532322A (ja) * | 2004-04-19 | 2007-11-15 | イーオー テクニクス カンパニー リミテッド | レーザー加工装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020097786A (ja) * | 2016-10-24 | 2020-06-25 | ツェーエル・シュッツレヒツフェアヴァルトゥングス・ゲゼルシャフト・ミト・べシュレンクテル・ハフツング | 三次元の物体を付加製造するための装置 |
Also Published As
Publication number | Publication date |
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US7423818B2 (en) | 2008-09-09 |
CN101223628B (zh) | 2012-03-28 |
TW200709882A (en) | 2007-03-16 |
KR101266177B1 (ko) | 2013-05-21 |
DE112006001869T5 (de) | 2008-05-15 |
CN101223628A (zh) | 2008-07-16 |
GB2442677A (en) | 2008-04-09 |
JP5225083B2 (ja) | 2013-07-03 |
KR20080026163A (ko) | 2008-03-24 |
GB0802259D0 (en) | 2008-03-12 |
US20070012667A1 (en) | 2007-01-18 |
WO2007011604A1 (en) | 2007-01-25 |
GB2442677B (en) | 2011-02-09 |
TWI366492B (en) | 2012-06-21 |
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