TWI366492B - Method of suppressing distortion of a working laser beam of a laser link processing system - Google Patents

Method of suppressing distortion of a working laser beam of a laser link processing system

Info

Publication number
TWI366492B
TWI366492B TW095125647A TW95125647A TWI366492B TW I366492 B TWI366492 B TW I366492B TW 095125647 A TW095125647 A TW 095125647A TW 95125647 A TW95125647 A TW 95125647A TW I366492 B TWI366492 B TW I366492B
Authority
TW
Taiwan
Prior art keywords
processing system
link processing
laser beam
suppressing distortion
laser
Prior art date
Application number
TW095125647A
Other languages
English (en)
Other versions
TW200709882A (en
Inventor
David Martin Hemenway
Brady Nilsen
Ho Wai Lo
Keith Grant
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW200709882A publication Critical patent/TW200709882A/zh
Application granted granted Critical
Publication of TWI366492B publication Critical patent/TWI366492B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76892—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern
    • H01L21/76894—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances modifying the pattern using a laser, e.g. laser cutting, laser direct writing, laser repair
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/485—Adaptation of interconnections, e.g. engineering charges, repair techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
TW095125647A 2005-07-15 2006-07-13 Method of suppressing distortion of a working laser beam of a laser link processing system TWI366492B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70003105P 2005-07-15 2005-07-15
US11/440,696 US7423818B2 (en) 2005-07-15 2006-05-24 Method of suppressing distortion of a working laser beam of a laser link processing system

Publications (2)

Publication Number Publication Date
TW200709882A TW200709882A (en) 2007-03-16
TWI366492B true TWI366492B (en) 2012-06-21

Family

ID=37660728

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125647A TWI366492B (en) 2005-07-15 2006-07-13 Method of suppressing distortion of a working laser beam of a laser link processing system

Country Status (8)

Country Link
US (1) US7423818B2 (zh)
JP (1) JP5225083B2 (zh)
KR (1) KR101266177B1 (zh)
CN (1) CN101223628B (zh)
DE (1) DE112006001869T5 (zh)
GB (1) GB2442677B (zh)
TW (1) TWI366492B (zh)
WO (1) WO2007011604A1 (zh)

Families Citing this family (9)

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Publication number Priority date Publication date Assignee Title
US7616669B2 (en) * 2003-06-30 2009-11-10 Electro Scientific Industries, Inc. High energy pulse suppression method
US8178818B2 (en) * 2008-03-31 2012-05-15 Electro Scientific Industries, Inc. Photonic milling using dynamic beam arrays
US9080991B2 (en) * 2008-09-29 2015-07-14 Kla-Tencor Corp. Illuminating a specimen for metrology or inspection
JP5905257B2 (ja) 2008-09-29 2016-04-20 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ 計測システムの照明サブシステム、計測システム、および計測測定のために試験片を照明するための方法
US8031414B1 (en) * 2009-04-24 2011-10-04 Jefferson Science Associates, Llc Single lens laser beam shaper
DE112012002844T5 (de) 2011-07-05 2014-04-24 Electronic Scientific Industries, Inc. Verfahren zur Laserbearbeitung mit einem thermisch stabilisierten akustooptischen Strahlablenker und thermisch stabilisiertes Hochgeschwindigkeits-Laserbearbeitungssystem
JP6193305B2 (ja) 2014-07-29 2017-09-06 ウルトラテック インク 高性能線形成光学システム及び方法
DE102016120244A1 (de) * 2016-10-24 2018-04-26 Cl Schutzrechtsverwaltungs Gmbh Vorrichtung zur additiven Herstellung dreidimensionaler Objekte
DE102021112833A1 (de) 2021-05-18 2022-11-24 Precitec Gmbh & Co. Kg Blende für einen Laserbearbeitungskopf

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Publication number Priority date Publication date Assignee Title
DE2146729A1 (de) * 1971-09-18 1973-03-22 Philips Patentverwaltung Verfahren und anordnung zur vielfachfilterung
NZ202721A (en) * 1981-12-21 1985-12-13 Merck & Co Inc Diflunisal derivatives and pharmaceutical compositions
JPS63230284A (ja) * 1987-03-18 1988-09-26 Nec Corp レ−ザ−トリミング装置
JPH026089A (ja) * 1988-06-21 1990-01-10 Matsushita Electric Ind Co Ltd レーザトリミング装置
JP2599439B2 (ja) * 1988-08-25 1997-04-09 松下電器産業株式会社 レーザトリミング装置およびトリミング方法
US5020111A (en) * 1988-10-14 1991-05-28 The United States Of America As Represented By The Secretary Of The Army Spatial symmetry cueing image processing method and apparatus
JP2799080B2 (ja) * 1991-03-18 1998-09-17 株式会社日立製作所 レーザ加工方法とその装置並びに透過型液晶素子、配線パターン欠陥修正方法とその装置
US5642183A (en) 1993-08-27 1997-06-24 Sharp Kabushiki Kaisha Spatial filter used in a reduction-type projection printing apparatus
JP3141715B2 (ja) * 1994-12-22 2001-03-05 松下電器産業株式会社 レーザ加工方法
JP3216987B2 (ja) * 1996-03-15 2001-10-09 三菱電機株式会社 レーザ転写加工装置およびレーザ転写加工方法
DE69739456D1 (de) 1996-07-30 2009-07-30 Siemens Healthcare Diagnostics Optisches System für Blutanalysegerät
EP0881515B1 (en) 1997-05-29 2004-03-17 Corning Incorporated Spatial filter for high power laser beam
JPH10328873A (ja) * 1997-06-04 1998-12-15 Nikon Corp レーザ加工装置
JP2002120080A (ja) * 2000-10-18 2002-04-23 Hitachi Via Mechanics Ltd レーザ加工装置
US6888875B2 (en) * 2002-01-28 2005-05-03 Fuji Photo Film Co., Ltd. Light source apparatus equipped with a GaN type semiconductor laser, a method of eliminating stray light, and an image forming apparatus
TW594336B (en) * 2002-01-30 2004-06-21 Sanyo Electric Co Semiconductor display device, method for making the same, and active matrix type display device
JP4408607B2 (ja) * 2002-06-11 2010-02-03 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライブ装置
JP2004130754A (ja) * 2002-10-15 2004-04-30 Noritsu Koki Co Ltd 写真プリント装置
JP3876237B2 (ja) * 2003-07-17 2007-01-31 住友重機械工業株式会社 レーザ加工装置
KR100514996B1 (ko) * 2004-04-19 2005-09-15 주식회사 이오테크닉스 레이저 가공 장치

Also Published As

Publication number Publication date
DE112006001869T5 (de) 2008-05-15
WO2007011604A1 (en) 2007-01-25
US20070012667A1 (en) 2007-01-18
CN101223628A (zh) 2008-07-16
GB2442677B (en) 2011-02-09
US7423818B2 (en) 2008-09-09
CN101223628B (zh) 2012-03-28
KR101266177B1 (ko) 2013-05-21
JP2009501088A (ja) 2009-01-15
TW200709882A (en) 2007-03-16
KR20080026163A (ko) 2008-03-24
GB2442677A (en) 2008-04-09
GB0802259D0 (en) 2008-03-12
JP5225083B2 (ja) 2013-07-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees