JP2009289926A5 - - Google Patents

Info

Publication number
JP2009289926A5
JP2009289926A5 JP2008140078A JP2008140078A JP2009289926A5 JP 2009289926 A5 JP2009289926 A5 JP 2009289926A5 JP 2008140078 A JP2008140078 A JP 2008140078A JP 2008140078 A JP2008140078 A JP 2008140078A JP 2009289926 A5 JP2009289926 A5 JP 2009289926A5
Authority
JP
Japan
Prior art keywords
conductor
electronic component
resin layer
sealing
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008140078A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009289926A (ja
JP5248918B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008140078A priority Critical patent/JP5248918B2/ja
Priority claimed from JP2008140078A external-priority patent/JP5248918B2/ja
Publication of JP2009289926A publication Critical patent/JP2009289926A/ja
Publication of JP2009289926A5 publication Critical patent/JP2009289926A5/ja
Application granted granted Critical
Publication of JP5248918B2 publication Critical patent/JP5248918B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008140078A 2008-05-28 2008-05-28 電子部品装置及びその製造方法 Expired - Fee Related JP5248918B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008140078A JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008140078A JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009289926A JP2009289926A (ja) 2009-12-10
JP2009289926A5 true JP2009289926A5 (cg-RX-API-DMAC7.html) 2011-06-02
JP5248918B2 JP5248918B2 (ja) 2013-07-31

Family

ID=41458869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008140078A Expired - Fee Related JP5248918B2 (ja) 2008-05-28 2008-05-28 電子部品装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP5248918B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6444707B2 (ja) 2014-11-28 2018-12-26 Ｔｏｗａ株式会社 電子部品、その製造方法及び製造装置
US10546819B2 (en) 2016-09-15 2020-01-28 Toshiba Memory Corporation Semiconductor device and method of manufacturing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254654A (ja) * 1994-03-15 1995-10-03 Fujitsu Ltd 半導体装置の製造方法
JP3798620B2 (ja) * 2000-12-04 2006-07-19 富士通株式会社 半導体装置の製造方法
JP2003174124A (ja) * 2001-12-04 2003-06-20 Sainekkusu:Kk 半導体装置の外部電極形成方法
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP3972183B2 (ja) * 2002-03-07 2007-09-05 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器

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