JP2009289926A5 - - Google Patents

Info

Publication number
JP2009289926A5
JP2009289926A5 JP2008140078A JP2008140078A JP2009289926A5 JP 2009289926 A5 JP2009289926 A5 JP 2009289926A5 JP 2008140078 A JP2008140078 A JP 2008140078A JP 2008140078 A JP2008140078 A JP 2008140078A JP 2009289926 A5 JP2009289926 A5 JP 2009289926A5
Authority
JP
Japan
Prior art keywords
conductor
electronic component
resin layer
sealing
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008140078A
Other languages
Japanese (ja)
Other versions
JP5248918B2 (en
JP2009289926A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2008140078A priority Critical patent/JP5248918B2/en
Priority claimed from JP2008140078A external-priority patent/JP5248918B2/en
Publication of JP2009289926A publication Critical patent/JP2009289926A/en
Publication of JP2009289926A5 publication Critical patent/JP2009289926A5/ja
Application granted granted Critical
Publication of JP5248918B2 publication Critical patent/JP5248918B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (6)

配線基板と、A wiring board;
前記配線基板上に実装された電子部品と、Electronic components mounted on the wiring board;
前記配線基板上に実装され、その上面に導電性ワイヤがアーチ状に設けられた導体ポストと、A conductor post mounted on the wiring board and having an arch-like conductive wire on its upper surface;
前記導電性ワイヤを露出させて前記導体ポスト及び前記電子部品を被覆する樹脂層と、A resin layer that exposes the conductive wire and covers the conductor post and the electronic component; 前記樹脂層の表面を覆い、前記導電性ワイヤに電気的に接続されたシールド部材とを備えたことを特徴とする電子部品装置。An electronic component device comprising: a shield member that covers a surface of the resin layer and is electrically connected to the conductive wire. 配線基板上に電子部品と共に導体ポストを実装する工程と、
前記導体ポストの上面に、樹脂封止の際に用いる金型よりも軟らかい材料からなる導体を配設する工程と、
前記金型を用いて、該金型を前記導体に接触させながら前記電子部品及び前記導体ポストを樹脂封止する工程とを含むことを特徴とする電子部品装置の製造方法。 Mounting conductor posts along with electronic components on the wiring board;
A step of disposing a conductor made of a material softer than a mold used for resin sealing on the upper surface of the conductor post; and
And a step of resin-sealing the electronic component and the conductor post while bringing the die into contact with the conductor using the die. 前記導体は、前記導体ポストの上面に導電性ワイヤをアーチ状にボンディングすることによって配設されることを特徴とする請求項２に記載の電子部品装置の製造方法。   3. The method of manufacturing an electronic component device according to claim 2, wherein the conductor is disposed by bonding a conductive wire in an arch shape on an upper surface of the conductor post. 前記樹脂封止する工程後、封止樹脂層の表面から露出している前記導体上に導電性接続材料を付着させて、前記封止樹脂層の表面を覆うようにシールド部材を装着する工程を含むことを特徴とする請求項２に記載の電子部品装置の製造方法。   After the resin sealing step, a step of attaching a conductive connecting material on the conductor exposed from the surface of the sealing resin layer and mounting a shield member so as to cover the surface of the sealing resin layer The manufacturing method of the electronic component apparatus of Claim 2 characterized by the above-mentioned. 前記シールド部材を装着する工程において、前記導体上に前記導電性接続材料を付着させる際に、前記封止樹脂層上の前記導体が露出している部分以外の所要の箇所に接着性材料を付着させることを特徴とする請求項４に記載の電子部品装置の製造方法。   In the step of attaching the shield member, when the conductive connecting material is attached on the conductor, an adhesive material is attached to a required portion other than the exposed portion of the conductor on the sealing resin layer. The manufacturing method of the electronic component apparatus of Claim 4 characterized by the above-mentioned. 前記樹脂封止する工程後、前記シールド部材を装着する前に、前記封止樹脂層の表面から露出している前記導体の表面に粗化処理を施す工程を含むことを特徴とする請求項４に記載の電子部品装置の製造方法。   5. A step of roughening the surface of the conductor exposed from the surface of the sealing resin layer after mounting the resin and before mounting the shield member. The manufacturing method of the electronic component apparatus as described in any one of.
JP2008140078A 2008-05-28 2008-05-28 Electronic component device and manufacturing method thereof Expired - Fee Related JP5248918B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008140078A JP5248918B2 (en) 2008-05-28 2008-05-28 Electronic component device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008140078A JP5248918B2 (en) 2008-05-28 2008-05-28 Electronic component device and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2009289926A JP2009289926A (en) 2009-12-10
JP2009289926A5 true JP2009289926A5 (en) 2011-06-02
JP5248918B2 JP5248918B2 (en) 2013-07-31

Family

ID=41458869

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008140078A Expired - Fee Related JP5248918B2 (en) 2008-05-28 2008-05-28 Electronic component device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP5248918B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6444707B2 (en) 2014-11-28 2018-12-26 Ｔｏｗａ株式会社 Electronic component, manufacturing method and manufacturing apparatus
US10546819B2 (en) 2016-09-15 2020-01-28 Toshiba Memory Corporation Semiconductor device and method of manufacturing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07254654A (en) * 1994-03-15 1995-10-03 Fujitsu Ltd Method for manufacturing semiconductor device
JP3798620B2 (en) * 2000-12-04 2006-07-19 富士通株式会社 Manufacturing method of semiconductor device
JP2003174124A (en) * 2001-12-04 2003-06-20 Sainekkusu:Kk Method of forming external electrode of semiconductor device
JP2003249607A (en) * 2002-02-26 2003-09-05 Seiko Epson Corp Semiconductor device and its manufacturing method, circuit board, and electronic equipment
JP3972183B2 (en) * 2002-03-07 2007-09-05 セイコーエプソン株式会社 Semiconductor device and manufacturing method thereof, circuit board, and electronic apparatus

Similar Documents

Publication Publication Date Title
JP2012109350A5 (en)
TWI575617B (en) An electronic component, an electronic component manufacturing method, and an electronic component manufacturing apparatus
JP2008041930A5 (en)
JP2008042118A5 (en)
JP2010015550A5 (en)
JP2009539325A5 (en)
US9099450B2 (en) Package structure and method for manufacturing same
CN105895303B (en) Electrode structure, electronic component using the same, and manufacturing method thereof
JP2010192653A5 (en)
JP2016072492A5 (en)
HK1130946A1 (en) Method for manufacturing a semiconductor component and structure therefor
KR20150092625A (en) Embedded printed circuit substrate
JP2017011075A5 (en)
US8836108B2 (en) Circuit board structure and package structure
JP2010206162A5 (en)
JP2019083234A5 (en)
NZ587889A (en) Semiconductor device, and communication apparatus and electronic apparatus having the same
CN103579029B (en) Package structure and method for manufacturing the same
JP2009289926A5 (en)
CN102270585B (en) Circuit board structure, package structure and method for making circuit board
JP2009231815A5 (en)
CN102270584A (en) Circuit board structure, packaging structure and method for manufacturing circuit board
JP2004354384A5 (en)
JP2012182207A (en) Lead frame for led element and method for manufacturing the same
CN105023873B (en) Substrate structure and manufacturing method thereof