JP2009283872A5 - - Google Patents
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- Publication number
- JP2009283872A5 JP2009283872A5 JP2008137169A JP2008137169A JP2009283872A5 JP 2009283872 A5 JP2009283872 A5 JP 2009283872A5 JP 2008137169 A JP2008137169 A JP 2008137169A JP 2008137169 A JP2008137169 A JP 2008137169A JP 2009283872 A5 JP2009283872 A5 JP 2009283872A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- metal layer
- metal
- mass
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229910052751 metal Inorganic materials 0.000 claims description 343
- 239000002184 metal Substances 0.000 claims description 343
- 239000010410 layer Substances 0.000 claims description 250
- 229920005989 resin Polymers 0.000 claims description 138
- 239000011347 resin Substances 0.000 claims description 138
- 239000011651 chromium Substances 0.000 claims description 81
- 239000010949 copper Substances 0.000 claims description 81
- 229910052804 chromium Inorganic materials 0.000 claims description 80
- 229910052802 copper Inorganic materials 0.000 claims description 80
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 79
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 68
- 239000000243 solution Substances 0.000 claims description 68
- 238000005530 etching Methods 0.000 claims description 67
- 238000003486 chemical etching Methods 0.000 claims description 62
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 57
- 239000011247 coating layer Substances 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 57
- VEXZGXHMUGYJMC-UHFFFAOYSA-N HCl Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 55
- ORTQZVOHEJQUHG-UHFFFAOYSA-L Copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 41
- 239000007864 aqueous solution Substances 0.000 claims description 40
- 229910052759 nickel Inorganic materials 0.000 claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 229960003280 cupric chloride Drugs 0.000 claims description 24
- 229910052750 molybdenum Inorganic materials 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 24
- RBTARNINKXHZNM-UHFFFAOYSA-K Iron(III) chloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 21
- 229910045601 alloy Inorganic materials 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 20
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims description 19
- ZOKXTWBITQBERF-UHFFFAOYSA-N molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 17
- 239000011733 molybdenum Substances 0.000 claims description 17
- -1 cyanide compound Chemical class 0.000 claims description 16
- 230000002378 acidificating Effects 0.000 claims description 15
- 238000004544 sputter deposition Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive Effects 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052720 vanadium Inorganic materials 0.000 claims description 12
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 229920001721 Polyimide Polymers 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-M chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 10
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052748 manganese Inorganic materials 0.000 claims description 10
- 239000011572 manganese Substances 0.000 claims description 10
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium(0) Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 9
- AEIXRCIKZIZYPM-UHFFFAOYSA-M hydroxy(oxo)iron Chemical compound [O][Fe]O AEIXRCIKZIZYPM-UHFFFAOYSA-M 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 5
- 238000007733 ion plating Methods 0.000 claims description 4
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920000069 poly(p-phenylene sulfide) Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 239000011528 polyamide (building material) Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 33
- 239000010953 base metal Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 238000005260 corrosion Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 14
- VZJVWSHVAAUDKD-UHFFFAOYSA-N Potassium permanganate Chemical compound [K+].[O-][Mn](=O)(=O)=O VZJVWSHVAAUDKD-UHFFFAOYSA-N 0.000 description 10
- 230000000875 corresponding Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000005755 formation reaction Methods 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- MIMJFNVDBPUTPB-UHFFFAOYSA-N potassium hexacyanoferrate(3-) Chemical compound [K+].[K+].[K+].N#C[Fe-3](C#N)(C#N)(C#N)(C#N)C#N MIMJFNVDBPUTPB-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 5
- NPDODHDPVPPRDJ-UHFFFAOYSA-N permanganate Chemical compound [O-][Mn](=O)(=O)=O NPDODHDPVPPRDJ-UHFFFAOYSA-N 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910000599 Cr alloy Inorganic materials 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000004429 atoms Chemical group 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000001965 increased Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000004445 quantitative analysis Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 239000000788 chromium alloy Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000002632 lipids Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- OXBLHERUFWYNTN-UHFFFAOYSA-M Copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 101700016776 XENO Proteins 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-M chloride;hydrochloride Chemical compound Cl.[Cl-] IXCSERBJSXMMFS-UHFFFAOYSA-M 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052803 cobalt Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 230000001590 oxidative Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000001637 plasma atomic emission spectroscopy Methods 0.000 description 1
- 238000000918 plasma mass spectrometry Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000001187 sodium carbonate Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008137169A JP5517019B2 (ja) | 2008-05-26 | 2008-05-26 | プリント配線基板およびプリント配線基板の製造方法 |
| KR1020090041308A KR101086141B1 (ko) | 2008-05-26 | 2009-05-12 | 프린트 배선 기판 및 프린트 배선 기판의 제조 방법 |
| TW098117258A TW201006337A (en) | 2008-05-26 | 2009-05-25 | Printing wiring cardinal plate and method for producing the same |
| CN2009102028481A CN101594737B (zh) | 2008-05-26 | 2009-05-26 | 印刷配线基板及印刷配线基板的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008137169A JP5517019B2 (ja) | 2008-05-26 | 2008-05-26 | プリント配線基板およびプリント配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009283872A JP2009283872A (ja) | 2009-12-03 |
| JP2009283872A5 true JP2009283872A5 (zh) | 2011-06-30 |
| JP5517019B2 JP5517019B2 (ja) | 2014-06-11 |
Family
ID=41409097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008137169A Active JP5517019B2 (ja) | 2008-05-26 | 2008-05-26 | プリント配線基板およびプリント配線基板の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5517019B2 (zh) |
| KR (1) | KR101086141B1 (zh) |
| CN (1) | CN101594737B (zh) |
| TW (1) | TW201006337A (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101886297B1 (ko) * | 2011-11-09 | 2018-08-09 | 엘지이노텍 주식회사 | 폴리이미드 코어를 이용한 박형 다층 인쇄회로기판 및 그 제조방법 |
| KR20150008703A (ko) * | 2013-07-15 | 2015-01-23 | (주)이엔에이치 | 정전용량 방식의 터치스크린 패널 및 그 제조방법 |
| CN104427755A (zh) * | 2013-08-23 | 2015-03-18 | 富葵精密组件(深圳)有限公司 | 软性电路板及其制作方法 |
| KR102001374B1 (ko) * | 2015-01-10 | 2019-07-18 | 미쯔비시 케미컬 주식회사 | 양면 금속적층 필름 |
| CN108700969B (zh) * | 2016-04-18 | 2022-04-08 | 住友金属矿山株式会社 | 导电性基板、导电性基板的制造方法 |
| JP7049759B2 (ja) * | 2016-07-12 | 2022-04-07 | 住友金属鉱山株式会社 | 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法 |
| CN111472000B (zh) * | 2020-04-15 | 2021-07-27 | 苏州华星光电技术有限公司 | 一种铜钼膜层的蚀刻方法、阵列基板 |
| US11756797B2 (en) | 2020-04-15 | 2023-09-12 | Tcl China Star Optoelectronics Technology Co., Ltd. | Etching method of copper-molybdenum film and array substrate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002252257A (ja) * | 2000-12-18 | 2002-09-06 | Mitsui Mining & Smelting Co Ltd | 半導体キャリア用フィルム及びその製造方法 |
| JP2003318532A (ja) * | 2002-04-24 | 2003-11-07 | Toyo Metallizing Co Ltd | フレキシブルプリント配線用基板 |
| JP4008388B2 (ja) * | 2003-06-30 | 2007-11-14 | シャープ株式会社 | 半導体キャリア用フィルムおよびそれを用いた半導体装置、液晶モジュール |
| CN1899002A (zh) * | 2003-12-26 | 2007-01-17 | 三井金属矿业株式会社 | 印刷电路板、其制造方法以及电路装置 |
| JP2007069561A (ja) * | 2005-09-09 | 2007-03-22 | Sumitomo Metal Mining Co Ltd | ２層フレキシブル基板とその製造方法 |
-
2008
- 2008-05-26 JP JP2008137169A patent/JP5517019B2/ja active Active
-
2009
- 2009-05-12 KR KR1020090041308A patent/KR101086141B1/ko active IP Right Grant
- 2009-05-25 TW TW098117258A patent/TW201006337A/zh unknown
- 2009-05-26 CN CN2009102028481A patent/CN101594737B/zh active Active
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