JP2009272481A - Mounting device and mounting method for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device that surely mounts an electronic component on one surface of one end part of a substrate and the other surface of the other end part with flexible wiring sheets interposed therebetween. <P>SOLUTION: The mounting device includes a first crimping unit 22 which mounts the first electronic component 2 on the one surface of the one end part of the substrate 1 mounted on a first mounting palette 13 with the flexible wiring sheet 3 interposed therebetween, an inversion unit 25 which superposes a second mounting palette 26 on an upper surface of the first mounting palette mounted with the substrate, turns over them in the superposition state, and removes the first mounting palette on the upper side, and a second crimping unit 38 which mounts the second electronic component 5 through a flexible wiring sheet 6 on the other surface of the other end part of the substrate mounted on the turned-over second mounting palette. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting apparatus and a mounting method for mounting an electronic component on one surface of one end of a substrate and the other surface of the other end via a flexible connecting member.

  For example, a mobile phone as an electronic device is provided with a substrate on which an electronic circuit is formed. A first electronic component such as a liquid crystal display panel is connected to one surface of one end of the substrate, and a second electronic component such as a keyboard is connected (mounted) to the other surface of the other end. The

  When connecting the first and second electronic components to the substrate, a connector has conventionally been used as disclosed in Patent Document 1. However, the configuration in which the electronic component is connected to the substrate by the connector is expensive, and thus the cost may be significantly increased.

  Therefore, when mounting the first and second electronic components on one end of one surface of the substrate and the other end of the other surface, respectively, flexibility as a flexible connecting member instead of the connector The electronic component is connected to the substrate using a wiring sheet (FPC: Flexible Printed Circuit).

  When an electronic component is connected to a substrate using the FPC, an anisotropic conductive tape (ACF) having an adhesive property is attached to one end of one surface of the substrate, and the anisotropic conductivity The other end of the FPC having one end connected to the first electronic component is connected to the tape.

If the first electronic component is connected to one surface of one end of the substrate, the substrate is turned upside down, and the other end of the other end of the substrate is connected to the second electronic component. The other end of the connected FPC is connected.
JP-A-10-83873

  By the way, after connecting the first electronic component to one surface of one end portion of the board via the FPC, the second electronic component is connected to the other surface of the other end portion of the circuit board via the FPC. When the upper and lower surfaces of the substrate are reversed, it is inevitable that the FPC in which the first electronic component is connected to the substrate is greatly bent due to the weight of the first electronic component.

  If the FPC bends greatly, it becomes difficult to automate the reversing operation of the substrate on which the first electronic component is mounted. For this reason, conventionally, the inversion operation of the substrate has been performed manually, so that the productivity could not be improved sufficiently.

  When the second electronic component is mounted on the other end portion of the other surface of the substrate on which the first electronic component is mounted on one end portion of the one surface via the flexible wiring sheet, the substrate It is an object of the present invention to provide an electronic component mounting apparatus and mounting method capable of automating the reversing operation.

The present invention is a mounting device for mounting a first electronic component and a second electronic component on one surface of one end of a substrate and the other surface of the other end via flexible connecting members, respectively. ,
A first mounting pallet on which the substrate is placed with the one side facing up;
First mounting means for mounting the first electronic component on one surface of one end of the substrate via the connection member;
The second mounting pallet is superposed on the upper surface of the first mounting pallet on which the substrate on which the first electronic component is mounted is placed, and the mounting pallet is inverted in the superposed state to become the upper side. Reversing means for removing the first mounting pallet;
The second electronic component is mounted on the other surface of the other end portion of the substrate placed on the second mounting pallet by the reversing means via the connection member. An electronic component mounting apparatus comprising: 2 mounting means.

The present invention is a mounting device for mounting a first electronic component and a second electronic component on one surface of one end of a substrate and the other surface of the other end via flexible connecting members, respectively. ,
A first mounting pallet on which the substrate is placed with the one side facing up;
First mounting means for mounting the first electronic component on one surface of one end portion of the substrate placed on the first mounting pallet via the connection member;
The second mounting pallet is superposed on the upper surface of the first mounting pallet on which the substrate on which the first electronic component is mounted is placed, and the mounting pallet is inverted in the superposed state to become the upper side. Reversing means for removing the first mounting pallet;
The second electronic component is mounted on the other surface of the other end portion of the substrate placed on the second mounting pallet by the reversing means via the connection member. An electronic component mounting apparatus comprising: 2 mounting means.

The reversing means includes a sandwiching and reversing mechanism for sandwiching and reversing the superposed first mounting pallet and second mounting pallet;
It is preferable to be constituted by a removal mechanism that removes the first mounting pallet that is turned upside down by the holding and turning mechanism.

  The first mounting pallet is placed on the transport pallet and transported, and the second mounting pallet is superposed on the first mounting pallet on the transport pallet, and these pallets are inverted. Therefore, it is preferable that the first mounting pallet is removed and the second mounting pallet is transported by the transporting pallet.

The present invention is a mounting method for mounting a first electronic component and a second electronic component on one surface of one end of a substrate and the other surface of the other end via a flexible wiring sheet, respectively.
Placing the substrate on the first mounting pallet with the one side up;
Attaching an anisotropic conductive tape to one surface of one end of the substrate placed on the first mounting pallet;
Mounting the first electronic component on the anisotropic conductive tape attached to one surface of one end of the substrate via the flexible wiring sheet;
The second mounting pallet is superposed on the upper surface of the first mounting pallet on which the substrate on which the first electronic component is mounted is placed, and the mounting pallet is inverted in the superposed state to become the upper side. Removing the first mounting pallet;
Attaching an anisotropic conductive tape to the other surface of the other end of the substrate placed on the inverted second mounting pallet;
And mounting the second electronic component on the anisotropic conductive tape attached to the other surface of the other end of the substrate via the flexible wiring sheet. There is a part mounting method.

  According to this invention, if the board is placed on the first mounting pallet and the first electronic component is connected to one surface of the one end of the board via the flexible connecting member, the first The second mounting pallet is superposed on one mounting pallet, and the mounting pallets are inverted in a superposed state, then the upper first mounting pallet is removed, and the upper and lower surfaces are inverted. The second electronic component is connected to the other surface of the other end of the substrate via a flexible connecting member.

  Therefore, when the substrate is reversed, the first electronic component is held together with the substrate by the first and second mounting pallets, so that when the reversing operation is automated, the flexible connecting member is not bent. It is possible to invert the substrate to which the first electronic component is connected.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic configuration diagram of a mounting apparatus according to the present invention. In this mounting apparatus, a first electronic component 2 such as a first liquid crystal display panel is placed on one surface of one end of a substrate 1 (shown in FIG. 2) built in a mobile phone as an electronic device. 1st mounting part B1 mounted via the 1st flexible wiring sheet 3 as 1 flexible connection member, and 2nd electronic devices, such as a keyboard, on the other surface of the other end part of the said board | substrate 1 A second mounting portion B2 for mounting the component 5 via a second flexible wiring sheet 6 as a second flexible connecting member is provided.

  The first mounting part B1 is supplied with a first mounting pallet 13 placed on a transport pallet 12 (shown in FIGS. 3 and 4) from the loader part 11. Support pins 14 for projecting the first mounting pallet 13 at predetermined intervals are projected from the four corners of the upper surface of the transport pallet 12.

Further, when the first electronic component 2 is mounted on one surface of one end of the plurality of substrates 1 held on the first mounting pallet 13 on the upper surface of the transfer pallet 12 as described later. A plurality of backups 15 are provided to prevent the first mounting pallet 13 from bending downward.
Although not shown in the drawing, an engagement recess that engages with the support pin 14 is formed on the lower surface of the first mounting pallet 13.

  In the first mounting pallet 13, a plurality of mounting recesses 17 are formed in parallel at predetermined intervals as shown in FIG. 3 in this embodiment. One end of each mounting recess 17 is about half the thickness of the first mounting pallet 13 and the other end is an opening penetrating in the thickness direction of the first mounting pallet 13. It has become a part.

  As shown in FIG. 4A, the mounting recesses 17 face one side of the substrate 1 facing downward, and have one end and the other end in the longitudinal direction for the first mounting. It is placed in engagement with the upper surface of the pallet 13.

  A mounting component P such as an IC is mounted in advance on one surface and the other surface of the substrate 1. Therefore, when the substrate 1 is placed at a position corresponding to each placement recess 17 of the first mounting pallet 13, the mounting component P escapes into the placement recess 17. The mounting pallet 13 can be reliably supported on the upper surface.

  The first mounting pallet 13 supported on the transport pallet 12 is transported to the first tape adhering means 18 of the first mounting part B1 by a transport mechanism (not shown) such as a conveyor. In the first tape adhering means 18, as shown in FIG. 4 (a), double-sided adhesive is applied to one surface of the plurality of substrates 1 held on the first mounting pallet 13 facing upward. 1st anisotropic conductive tape 19 is stuck.

  Next, the first mounting pallet 13 supported on the transport pallet 12 is transported to the first temporary press-bonding portion 21 and is attached to the substrate 1 as shown in FIG. 4B. The other end portion of the first flexible wiring sheet 3 whose one end portion is connected to the first electronic component 2 is temporarily pressure-bonded to the first anisotropic conductive tape 19 as the first connecting means. .

  Next, the first mounting pallet 13 is conveyed to the first main crimping portion 22. When the first mounting pallet 13 is conveyed to the first main crimping portion 22, the first mounting pallet is temporarily crimped to one end portion of one surface of the substrate 1 held by the first mounting pallet 13. The other end portion of the flexible wiring sheet 3 is finally crimped. The first temporary crimping portion 21 and the first final crimping portion 22 constitute a first mounting means.

  The main pressure bonding of the first flexible wiring sheet 3 is performed at a higher temperature and for a longer time than the temporary pressure bonding. Therefore, the first main crimping part 22 is provided with two crimping heads for pressurizing and heating the other end of the first flexible wiring sheet 3.

  As a result, the first temporary crimping section 21 temporarily crimps the first flexible wiring sheet 3 to the two substrates 1 one by one, and the first final crimping section 22 performs two crimping. The work time for simultaneously subjecting the first flexible wiring sheet 3 to the two substrates 1 simultaneously with the head is substantially the same.

  Therefore, the processing capability (tact time) of the first temporary crimping portion 21 and the first final crimping portion 22 is substantially the same. That is, the substrate 1 on which the first flexible wiring sheet 3 is temporarily press-bonded by the first temporary press-bonding part 21 can be conveyed to the first main press-bonding part 22 without waiting time.

  When the first flexible wiring sheet 3 for mounting the first electronic component 2 is finally crimped to the substrate 1 held on the first mounting pallet 13 by the first permanent crimping portion 22, Before the first mounting pallet 13 is transported to the second mounting part B2, the first mounting pallet 13 is transported to the reversing part 25 as a reversing means provided between the first mounting part B1 and the second mounting part B2. Is done. As shown in FIG. 5A, the second mounting pallet 26 having the same structure as the first mounting pallet 13 is superposed on the first mounting pallet 13 carried into the reversing unit 25. Note that the mounting recess 17 formed in the second mounting pallet 26 has only an opening.

  Engaging pins 23 are provided at the four corners of the upper surface of the first mounting pallet 13, and engaging recesses (not shown) in which the engaging pins 23 are engaged with the lower surface of the second mounting pallet 26. ) Is formed. As a result, the second mounting pallet 26 is positioned and superposed on the first mounting pallet 13.

  In FIG. 5A, a considerable gap is formed between the upper surface of the first mounting pallet 13 and the lower surface of the second mounting pallet 26, but the substrate 1 and the first electronic component 2 are Since the thickness is small, the second mounting pallet 26 is superposed on the first mounting pallet 13 without causing a large gap therebetween.

  The superposed first and second mounting pallets 13 and 26 are reversed 180 degrees in the vertical direction by the sandwiching and reversing mechanism 27 shown in FIG. The clamping / reversing mechanism 27 has a pair of clamping claws 28. The pair of clamping claws 28 are driven in an opening / closing direction (contact / separation direction) by an opening / closing drive unit 29.

  The opening / closing drive unit 29 is connected to the rotation drive unit 32 via a rotating body 31. The rotation driving unit 32 drives the rotating body 31 in the rotation direction around the axis O shown in FIG. The rotation drive unit 32 is connected to an arm 33 such as a robot. This arm 33 is driven in the X, Y and Z directions. Thereby, the pair of clamping claws 28 can be driven in the opening / closing direction, the rotation direction, the X, Y direction, and the Z direction.

  When the second mounting pallet 26 is superposed on the first mounting pallet 13, the pallets 13 and 26 are clamped by a pair of clamping claws 28 as shown in FIG. Next, as shown in FIG. 5B, the pair of clamping claws 28 are driven in the upward direction to raise the pair of mounting pallets 13 and 26 from the conveying pallet 12, and then the pair of clamping claws 28 rotate. It is rotated 180 degrees by the drive unit 32.

  As a result, the first mounting pallet 13 is on the upper side and the second mounting pallet 26 is on the lower side. In this state, the pair of clamping claws 28 are driven in the downward direction, and the superposed first and second mounting pallets 13 and 26 are placed on the transport pallet 12.

  When the inverted first and second mounting pallets 13 and 26 are placed on the transfer pallet 12, the upper first mounting pallet 13 is removed by a robot hand (not shown) as a removal mechanism. Is done. The robot hand holds the periphery of the first mounting pallet 13 and is driven in the upward direction to remove the first mounting pallet 13. FIG. 5C shows a state where the first mounting pallet 13 is removed from the second mounting pallet 26.

  When the first mounting pallet 13 is removed, the first electronic component 5 is placed on one surface of one end on the upper surface of the second mounting pallet 26 remaining on the transport pallet 12. From the state where the plurality of substrates 1 mounted by the flexible wiring sheet 3 are held on the first mounting pallet 13, the upper and lower surfaces are held reversed.

  The second mounting pallet 26 removed from the first mounting pallet 13 and placed on the transporting pallet 12 is transported to the second mounting part B2. The second mounting portion B2 is provided with a second tape adhering means 35. In the second tape adhering means 35, the second anisotropic conductive tape 36 as the second connecting means is adhered to the other surface of the substrate 1 facing the other end.

  Next, the transport pallet 12 is transported to the second temporary press-bonding portion 37, where the second anisotropic conductive tape 36 attached to the substrate 1 is applied to the second anisotropic conductive tape 36 as shown in FIG. The other end portion of the second flexible wiring sheet 6 whose one end portion is connected to the electronic component 5 is temporarily pressure-bonded.

  When the other end portion of the second flexible wiring sheet 6 is temporarily crimped to the substrate 1, the second mounting pallet 26 is conveyed to the second final crimping portion 38. When the second mounting pallet 26 is conveyed to the second main crimping portion 38, the second mounting pallet is temporarily crimped to the other end of the other surface of the substrate 1 held by the second mounting pallet 26. The other end of the flexible wiring sheet 6 is finally pressure-bonded. The second temporary crimping portion 37 and the second final crimping portion 38 constitute a second mounting means.

  The second main crimping section 38 has two crimping heads, like the first main crimping section 22. Accordingly, the second temporary crimping portion 37 temporarily press-bonds the second flexible wiring sheet 6 to the two substrates 1, and the second final crimping portion 38 uses the two crimping heads to provide two substrates 1. On the other hand, the processing time (tact time) in which the second flexible wiring sheet 6 is simultaneously press-bonded simultaneously is substantially the same.

  In this way, the first and second electronic components 2 and 5 are respectively connected by the first and second anisotropic conductive tapes 19 and 36 via the first and second flexible wiring sheets 3 and 6. The mounted substrate 1 is taken out from the second mounting pallet 26 and stored in the unloader unit 41.

  The first mounting pallet 13 removed by the reversing unit 25 is returned to the loader unit 11, where the substrate 1 is placed at a position corresponding to the mounting recess 17 after being mounted on the transporting pallet 12. Placed.

  On the other hand, the second mounting pallet 13 emptied by storing the substrate 1 in the unloader unit 41 is returned to the reversing unit 25, and after mounting the first electronic component 5 on the substrate 1, When the mounting pallet 13 is inverted, it is superposed on the first mounting pallet 13.

  According to the mounting apparatus having such a configuration, the first electronic component 2 is placed on the substrate 1 placed on the upper surface of the first mounting pallet 13 in the first mounting portion B1. 3, the second mounting pallet 26 is placed on the first mounting pallet 13 by the reversing unit 25 provided between the first mounting part B1 and the second mounting part B2. Polymerized.

  Next, the first and second mounting pallets 13 and 26 are inverted 180 degrees so that the top and bottom are reversed by the sandwiching and reversing mechanism 27, and then the first mounting pallet 13 on the upper side is removed. .

  As a result, the plurality of substrates 1 on which the first electronic component 2 is mounted on one surface of one end portion by the first flexible wiring sheet 3 has the second surface facing the second mounting pallet 26. Therefore, the second electronic component 5 can be mounted on the other surface of the other end portion of the substrate 1 by the second flexible wiring sheet 6.

  That is, the substrate 1 on which the first electronic component 2 is mounted on one surface of the one end portion by the first flexible wiring sheet 3 is sandwiched between the first mounting pallet 13 and the second mounting pallet 26. Therefore, the reversing operation of the substrate 1 can be reliably and automatically performed by the sandwiching and reversing mechanism 27 without bending the first flexible wiring sheet 3.

  The first mounting pallet 13 is placed on the transfer pallet 12 for transfer. Therefore, by supporting the first mounting pallet 13 with the support pins 14 provided on the transporting pallet 12, the clamping claws 28 of the clamping reversing mechanism 27 can be inserted into the lower surface of the first mounting pallet 13. Thus, the first mounting pallet 13 and the second mounting pallet 26 superposed on the first mounting pallet 13 can be sandwiched and reversed by the pair of sandwiching claws 28.

  That is, since the first mounting pallet 13 is placed on the transport pallet 12, the second mounting pallet 26 is superposed on the first mounting pallet 13, and then the pair of mounting pallets. 13 and 26 can be reliably reversed by the sandwiching and reversing mechanism 27.

  In the above-described embodiment, the first and second mounting portions are temporarily bonded to the substrate after the flexible wiring sheet is temporarily bonded to the anisotropic conductive tape. You may make it carry out this pressure bonding immediately without performing.

  In addition, the anisotropic conductive tape is used as the connection means for connecting the first and second flexible wiring sheets, which are flexible connection members, to the substrate. Instead of tape, solder, metal bumps melted by ultrasonic vibration, connectors, adhesives, or the like may be used.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. The side view which shows the state by which the electronic component was mounted via the flexible wiring sheet in the one surface of the one end part of a board | substrate, and the other surface of the other end part, respectively. The perspective view which decomposes | disassembles and shows the pallet for conveyance, the 1st mounting pallet, the board | substrate with which the 1st electronic component was mounted, and the 2nd mounting pallet. (A) is explanatory drawing which shows the state which crimped | bonded the 1st anisotropic conductive tape to the board | substrate mounted in the 1st mounting pallet, (b) is the state which mounted the 1st electronic component on the said board | substrate. (C) is explanatory drawing of the state which superposed | stacked the 2nd mounting pallet on the 1st mounting pallet. (A) is an explanatory view of a state where the superposed first and second mounting pallets are clamped by the clamping claws of the clamping and reversing mechanism, and (b) is a diagram illustrating the first and second mounting pallets clamped by the clamping claws. Explanatory drawing of the state which raised from the conveyance pallet and reversed, (c) is for the first mounting located on the upper side from the first and second mounting pallets reversed and placed on the conveyance pallet Explanatory drawing of the state where the pallet is removed.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... 1st electronic component, 3 ... 1st flexible wiring sheet, 5 ... 2nd electronic component, 6 ... 2nd flexible wiring sheet, 11 ... Loader part, 12 ... Conveyance Pallet, 18 ... first tape adhering means, 19 ... first anisotropic conductive tape, 21 ... first temporary crimping part, 22 ... first final crimping part, 25 ... reversing part, 26 ... first 2 mounting pallets, 27... Sandwiching and reversing mechanism, 28... Sandwiching claw, 29... Opening / closing drive unit, 35... Second tape attaching means, 36. Crimp part, 41 ... unloader part.

Claims (5)

A mounting apparatus for mounting a first electronic component and a second electronic component on one surface of one end of a substrate and the other surface of the other end via a flexible connecting member,
A first mounting pallet on which the substrate is placed with the one side facing up;
First mounting means for mounting the first electronic component on one surface of one end of the substrate via the connection member;
The second mounting pallet is superposed on the upper surface of the first mounting pallet on which the substrate on which the first electronic component is mounted is placed, and the mounting pallet is inverted in the superposed state to become the upper side. Reversing means for removing the first mounting pallet;
The second electronic component is mounted on the other surface of the other end portion of the substrate placed on the second mounting pallet by the reversing means via the connection member. An electronic component mounting apparatus comprising: 2 mounting means. A mounting apparatus for mounting a first electronic component and a second electronic component on one surface of one end of a substrate and the other surface of the other end via a flexible connecting member,
A first mounting pallet on which the substrate is placed with the one side facing up;
First mounting means for mounting the first electronic component on one surface of one end portion of the substrate placed on the first mounting pallet via the connection member;
The second mounting pallet is superposed on the upper surface of the first mounting pallet on which the substrate on which the first electronic component is mounted is placed, and the mounting pallet is inverted in the superposed state to become the upper side. Reversing means for removing the first mounting pallet;
The second electronic component is mounted on the other surface of the other end portion of the substrate placed on the second mounting pallet by the reversing means via the connection member. An electronic component mounting apparatus comprising: 2 mounting means. The reversing means includes a sandwiching and reversing mechanism for sandwiching and reversing the superposed first mounting pallet and second mounting pallet;
2. The electronic component mounting apparatus according to claim 1, further comprising a removal mechanism that removes the first mounting pallet that is turned upside down by the holding and turning mechanism.   The first mounting pallet is placed on the transport pallet and transported, and the second mounting pallet is superposed on the first mounting pallet on the transport pallet, and these pallets are inverted. 2. The electronic component mounting apparatus according to claim 1, wherein the first mounting pallet is removed and the second mounting pallet is transported by the transporting pallet. A mounting method for mounting a first electronic component and a second electronic component on one surface of one end of the substrate and the other surface of the other end via flexible connecting members,
Placing the substrate on the first mounting pallet with the one side up;
Mounting the first electronic component on one surface of the one end of the substrate placed on the first mounting pallet via the connection member;
The second mounting pallet is superposed on the upper surface of the first mounting pallet on which the substrate on which the first electronic component is mounted is placed, and the mounting pallet is inverted in the superposed state to become the upper side. Removing the first mounting pallet;
Mounting the second electronic component on the other surface of the other end of the substrate placed on the inverted second mounting pallet via the connection member. Electronic component mounting method.

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