JP2009212760A - 弾性表面波デバイス - Google Patents
弾性表面波デバイス Download PDFInfo
- Publication number
- JP2009212760A JP2009212760A JP2008052995A JP2008052995A JP2009212760A JP 2009212760 A JP2009212760 A JP 2009212760A JP 2008052995 A JP2008052995 A JP 2008052995A JP 2008052995 A JP2008052995 A JP 2008052995A JP 2009212760 A JP2009212760 A JP 2009212760A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- acoustic wave
- surface acoustic
- resin cover
- wave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011256 inorganic filler Substances 0.000 claims abstract description 22
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 230000005284 excitation Effects 0.000 claims abstract description 7
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000010295 mobile communication Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 description 17
- 229910003460 diamond Inorganic materials 0.000 description 9
- 239000010432 diamond Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
【解決手段】本発明は、圧電基板1と、圧電基板1上に設けられた櫛形電極2およびパッド電極7と、櫛形電極2上の励振空間4を覆う樹脂カバー8と、樹脂カバー8の表面に設けられた外部電極5と、樹脂カバー8を貫通しパッド電極7と外部電極5を接続する柱状電極6を備えた弾性波表面デバイスにおいて、樹脂カバー8を形成する樹脂に無機フィラー14を含有させた。
【選択図】図2
Description
2 櫛形電極
4 励振空間
5 外部電極
6 柱状電極
7 パッド電極
8 樹脂カバー
14 無機フィラー
Claims (2)
- 圧電基板と、この圧電基板上に設けられた櫛形電極およびパッド電極と、前記圧電基板上において前記櫛形電極上の励振空間を覆う樹脂カバーと、前記樹脂カバーの表面に設けられた外部電極と、前記樹脂カバーを貫通し前記パッド電極と前記外部電極を接続する柱状電極を備え、前記樹脂カバーを形成する樹脂に無機フィラーを含有させたことを特徴とする弾性表面波デバイス。
- 樹脂カバーにおける無機フィラーの含有量を85〜95重量パーセントとしたことを特徴とする請求項1に記載の弾性表面波デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008052995A JP5176603B2 (ja) | 2008-03-04 | 2008-03-04 | 弾性表面波デバイスおよびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008052995A JP5176603B2 (ja) | 2008-03-04 | 2008-03-04 | 弾性表面波デバイスおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009212760A true JP2009212760A (ja) | 2009-09-17 |
JP5176603B2 JP5176603B2 (ja) | 2013-04-03 |
Family
ID=41185493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008052995A Active JP5176603B2 (ja) | 2008-03-04 | 2008-03-04 | 弾性表面波デバイスおよびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5176603B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013031117A (ja) * | 2011-07-29 | 2013-02-07 | Kyocera Corp | 弾性波装置を有する電子部品 |
JP2014057124A (ja) * | 2012-09-11 | 2014-03-27 | Panasonic Corp | 弾性表面波デバイスおよびその製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332654A (ja) * | 2000-03-17 | 2001-11-30 | Matsushita Electric Ind Co Ltd | 電気素子内蔵モジュール及びその製造方法 |
JP2003115734A (ja) * | 2001-10-09 | 2003-04-18 | Matsushita Electric Ind Co Ltd | 弾性表面波装置とその製造方法 |
WO2007052597A1 (ja) * | 2005-11-02 | 2007-05-10 | Matsushita Electric Industrial Co., Ltd. | 電子部品パッケージ |
JP2007173284A (ja) * | 2005-12-19 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 電子部品パッケージ |
JP2007243916A (ja) * | 2006-02-07 | 2007-09-20 | Matsushita Electric Ind Co Ltd | 電子部品パッケージ |
WO2008018452A1 (fr) * | 2006-08-07 | 2008-02-14 | Kyocera Corporation | Procédé de fabrication d'un dispositif à ondes acoustiques de surface |
WO2009096563A1 (ja) * | 2008-01-30 | 2009-08-06 | Kyocera Corporation | 弾性波装置およびその製造方法 |
-
2008
- 2008-03-04 JP JP2008052995A patent/JP5176603B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332654A (ja) * | 2000-03-17 | 2001-11-30 | Matsushita Electric Ind Co Ltd | 電気素子内蔵モジュール及びその製造方法 |
JP2003115734A (ja) * | 2001-10-09 | 2003-04-18 | Matsushita Electric Ind Co Ltd | 弾性表面波装置とその製造方法 |
WO2007052597A1 (ja) * | 2005-11-02 | 2007-05-10 | Matsushita Electric Industrial Co., Ltd. | 電子部品パッケージ |
JP2007173284A (ja) * | 2005-12-19 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 電子部品パッケージ |
JP2007243916A (ja) * | 2006-02-07 | 2007-09-20 | Matsushita Electric Ind Co Ltd | 電子部品パッケージ |
WO2008018452A1 (fr) * | 2006-08-07 | 2008-02-14 | Kyocera Corporation | Procédé de fabrication d'un dispositif à ondes acoustiques de surface |
WO2009096563A1 (ja) * | 2008-01-30 | 2009-08-06 | Kyocera Corporation | 弾性波装置およびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013031117A (ja) * | 2011-07-29 | 2013-02-07 | Kyocera Corp | 弾性波装置を有する電子部品 |
JP2014057124A (ja) * | 2012-09-11 | 2014-03-27 | Panasonic Corp | 弾性表面波デバイスおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5176603B2 (ja) | 2013-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5077714B2 (ja) | 弾性波装置及びその製造方法 | |
WO2016103925A1 (ja) | 弾性波装置及びその製造方法 | |
WO2016042928A1 (ja) | 圧電デバイスとその製造方法 | |
EP2230764B1 (en) | Surface wave device and method of manufacturing the same | |
JPWO2015098678A1 (ja) | 弾性波装置 | |
JP2011103645A (ja) | 弾性波素子、およびこれを用いた電子機器 | |
KR20100127725A (ko) | 압전 부품 및 그 제조방법 | |
JP2010157956A (ja) | 弾性表面波デバイス | |
JP2016066989A (ja) | 圧電デバイスとその製造方法 | |
JP2010278971A (ja) | 弾性波装置 | |
JP2004135193A (ja) | 表面実装型sawデバイス、及びその製造方法 | |
JP6026829B2 (ja) | 弾性表面波デバイス | |
JP5176603B2 (ja) | 弾性表面波デバイスおよびその製造方法 | |
JP5046770B2 (ja) | 圧電部品 | |
JP5104518B2 (ja) | 弾性表面波デバイスとその製造方法 | |
JP6851239B2 (ja) | 樹脂封止型半導体装置およびその製造方法 | |
JP5104392B2 (ja) | 弾性表面波デバイス | |
JP5713224B1 (ja) | 弾性表面波デバイス及びその製造方法 | |
JP5217836B2 (ja) | 弾性表面波デバイス | |
JP2009232172A (ja) | 弾性表面波デバイス、及びその製造方法 | |
JP2004207674A (ja) | 電子部品装置の製造方法 | |
JP2004096456A (ja) | 表面実装型sawデバイス、及びその製造方法 | |
JP6185125B2 (ja) | 弾性表面波デバイスの製造方法 | |
JP6251031B2 (ja) | 電子デバイス及びその製造方法 | |
JP2008124785A (ja) | 弾性表面波デバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110217 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20110314 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120830 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121101 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121211 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121224 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5176603 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160118 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |