JP2009190101A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009190101A5 JP2009190101A5 JP2008031307A JP2008031307A JP2009190101A5 JP 2009190101 A5 JP2009190101 A5 JP 2009190101A5 JP 2008031307 A JP2008031307 A JP 2008031307A JP 2008031307 A JP2008031307 A JP 2008031307A JP 2009190101 A5 JP2009190101 A5 JP 2009190101A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008031307A JP5199691B2 (ja) | 2008-02-13 | 2008-02-13 | 研磨装置 |
KR1020107017423A KR101554969B1 (ko) | 2008-02-13 | 2009-02-09 | 폴리싱장치 |
US12/747,225 US8357029B2 (en) | 2008-02-13 | 2009-02-09 | Polishing apparatus |
PCT/JP2009/052456 WO2009102047A1 (en) | 2008-02-13 | 2009-02-09 | Polishing apparatus |
TW098104433A TWI441710B (zh) | 2008-02-13 | 2009-02-12 | 研磨裝置 |
JP2013022986A JP5572730B2 (ja) | 2008-02-13 | 2013-02-08 | 研磨装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008031307A JP5199691B2 (ja) | 2008-02-13 | 2008-02-13 | 研磨装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013022986A Division JP5572730B2 (ja) | 2008-02-13 | 2013-02-08 | 研磨装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009190101A JP2009190101A (ja) | 2009-08-27 |
JP2009190101A5 true JP2009190101A5 (ja) | 2011-11-24 |
JP5199691B2 JP5199691B2 (ja) | 2013-05-15 |
Family
ID=40957077
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008031307A Active JP5199691B2 (ja) | 2008-02-13 | 2008-02-13 | 研磨装置 |
JP2013022986A Active JP5572730B2 (ja) | 2008-02-13 | 2013-02-08 | 研磨装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013022986A Active JP5572730B2 (ja) | 2008-02-13 | 2013-02-08 | 研磨装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8357029B2 (ja) |
JP (2) | JP5199691B2 (ja) |
KR (1) | KR101554969B1 (ja) |
TW (1) | TWI441710B (ja) |
WO (1) | WO2009102047A1 (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200460151Y1 (ko) * | 2009-09-07 | 2012-05-07 | 시너스(주) | 화학기계적 연마장치용 리테이너 링 구조물 |
TWI574785B (zh) * | 2010-08-06 | 2017-03-21 | 應用材料股份有限公司 | 內扣環及外扣環 |
TWI613037B (zh) * | 2011-07-19 | 2018-02-01 | 荏原製作所股份有限公司 | 硏磨方法 |
JP5964064B2 (ja) * | 2012-01-31 | 2016-08-03 | 株式会社荏原製作所 | 基板保持装置、研磨装置、および研磨方法 |
TWI639485B (zh) * | 2012-01-31 | 2018-11-01 | 日商荏原製作所股份有限公司 | Substrate holding device, polishing device, and polishing method |
JP5922965B2 (ja) * | 2012-03-29 | 2016-05-24 | 株式会社荏原製作所 | 基板保持装置、研磨装置、および研磨方法 |
JP5976522B2 (ja) * | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
US10702972B2 (en) | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
KR101346995B1 (ko) * | 2012-08-27 | 2014-01-16 | 주식회사 케이씨텍 | 화학 기계적 연마 장치의 캐리어 헤드 |
JP2015062956A (ja) * | 2012-09-19 | 2015-04-09 | 株式会社荏原製作所 | 研磨装置 |
JP6403981B2 (ja) | 2013-11-13 | 2018-10-10 | 株式会社荏原製作所 | 基板保持装置、研磨装置、研磨方法、およびリテーナリング |
JP6232297B2 (ja) | 2014-01-21 | 2017-11-15 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
KR102173323B1 (ko) | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
SG10201604105TA (en) * | 2015-05-25 | 2016-12-29 | Ebara Corp | Polishing apparatus, polishing head and retainer ring |
KR102424495B1 (ko) * | 2015-11-09 | 2022-07-26 | 주식회사 케이씨텍 | 화학 기계적 연마 장치용 연마 헤드 |
JP6258529B2 (ja) * | 2016-02-08 | 2018-01-10 | 株式会社荏原製作所 | 基板保持装置、研磨装置、および研磨方法 |
KR101841364B1 (ko) | 2016-11-04 | 2018-03-22 | 주식회사 씨티에스 | 씨엠피 해드 및 이를 포함하는 씨엠피 장치 |
JP6894805B2 (ja) * | 2017-08-21 | 2021-06-30 | 株式会社荏原製作所 | 基板研磨装置および基板研磨装置における研磨液吐出方法 |
JP7074606B2 (ja) * | 2018-08-02 | 2022-05-24 | 株式会社荏原製作所 | 基板を保持するためのトップリングおよび基板処理装置 |
TWI837213B (zh) * | 2018-11-21 | 2024-04-01 | 美商應用材料股份有限公司 | 拋光系統、載具頭組件及拋光基板的方法 |
CN111266993B (zh) * | 2018-12-05 | 2023-06-30 | 凯斯科技股份有限公司 | 化学机械式研磨装置用承载头的卡环及具备其的承载头 |
JP7306021B2 (ja) | 2019-03-29 | 2023-07-11 | 株式会社富士通ゼネラル | 電動機 |
KR20210006550A (ko) | 2019-07-08 | 2021-01-19 | 삼성전자주식회사 | 회전체 모듈 및 이를 구비하는 화학 기계적 연마 장치 |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
JP2023516875A (ja) | 2020-11-10 | 2023-04-21 | アプライド マテリアルズ インコーポレイテッド | 局所的なウエハ圧力を有する研磨ヘッド |
CN112705716B (zh) * | 2020-12-10 | 2023-04-18 | 九江市钒宇新材料股份有限公司 | 一种钒氮合金加工设备的卸料机构 |
TWI797532B (zh) * | 2020-12-31 | 2023-04-01 | 創技工業股份有限公司 | 半導體加工的方法及裝置 |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4270314A (en) * | 1979-09-17 | 1981-06-02 | Speedfam Corporation | Bearing mount for lapping machine pressure plate |
JPH01172625A (ja) * | 1987-12-28 | 1989-07-07 | Taiho Kogyo Co Ltd | 球面軸受 |
US5205082A (en) * | 1991-12-20 | 1993-04-27 | Cybeq Systems, Inc. | Wafer polisher head having floating retainer ring |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US5681215A (en) * | 1995-10-27 | 1997-10-28 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
US5795215A (en) * | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
US5762544A (en) * | 1995-10-27 | 1998-06-09 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
JP3807807B2 (ja) * | 1997-02-27 | 2006-08-09 | 株式会社荏原製作所 | ポリッシング装置 |
JPH10329014A (ja) * | 1997-05-26 | 1998-12-15 | Tokyo Seimitsu Co Ltd | 断熱機構付きウェーハ研磨装置 |
JPH11188618A (ja) * | 1997-12-22 | 1999-07-13 | Sumitomo Metal Ind Ltd | ウェーハの研磨方法と研磨用ウェーハホルダー |
US5993302A (en) * | 1997-12-31 | 1999-11-30 | Applied Materials, Inc. | Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
US6390904B1 (en) * | 1998-05-21 | 2002-05-21 | Applied Materials, Inc. | Retainers and non-abrasive liners used in chemical mechanical polishing |
JP2000094309A (ja) * | 1998-09-18 | 2000-04-04 | Toshiba Corp | ポリッシング装置 |
US6409585B1 (en) * | 1998-12-21 | 2002-06-25 | Ebara Corporation | Polishing apparatus and holder for holding an article to be polished |
TW436378B (en) * | 1999-02-05 | 2001-05-28 | Mitsubishi Materials Corp | Wafer polishing apparatus and method for making a wafer |
US20020173242A1 (en) * | 1999-04-19 | 2002-11-21 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6231428B1 (en) * | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6113468A (en) * | 1999-04-06 | 2000-09-05 | Speedfam-Ipec Corporation | Wafer planarization carrier having floating pad load ring |
KR100355224B1 (ko) | 1999-06-22 | 2002-10-11 | 삼성전자 주식회사 | 연마 헤드의 리테이너 링과 이를 구비한 화학기계적 연마장치 |
US6206768B1 (en) * | 1999-07-29 | 2001-03-27 | Chartered Semiconductor Manufacturing, Ltd. | Adjustable and extended guide rings |
SG90746A1 (en) * | 1999-10-15 | 2002-08-20 | Ebara Corp | Apparatus and method for polishing workpiece |
JP3753577B2 (ja) * | 1999-11-16 | 2006-03-08 | 株式会社荏原製作所 | 基板保持装置及び該基板保持装置を備えたポリッシング装置 |
US6354928B1 (en) * | 2000-04-21 | 2002-03-12 | Agere Systems Guardian Corp. | Polishing apparatus with carrier ring and carrier head employing like polarities |
US6506105B1 (en) * | 2000-05-12 | 2003-01-14 | Multi-Planar Technologies, Inc. | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control |
TW579319B (en) * | 2000-05-12 | 2004-03-11 | Multi Planar Technologies Inc | System and method for CMP head having multi-pressure annular zone subcarrier material removal control |
US6558232B1 (en) * | 2000-05-12 | 2003-05-06 | Multi-Planar Technologies, Inc. | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
JP2001338901A (ja) * | 2000-05-26 | 2001-12-07 | Hitachi Ltd | 平坦化加工方法及び、装置並びに,半導体装置の製造方法 |
US6540592B1 (en) * | 2000-06-29 | 2003-04-01 | Speedfam-Ipec Corporation | Carrier head with reduced moment wear ring |
US6443815B1 (en) | 2000-09-22 | 2002-09-03 | Lam Research Corporation | Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing |
US6503129B1 (en) | 2000-10-06 | 2003-01-07 | Lam Research Corporation | Activated slurry CMP system and methods for implementing the same |
JP3849918B2 (ja) * | 2000-12-04 | 2006-11-22 | 株式会社東京精密 | ウェーハ研磨装置 |
JP3330370B2 (ja) * | 2001-01-10 | 2002-09-30 | 廣田 重義 | 低摩擦球面軸受 |
US6709322B2 (en) | 2001-03-29 | 2004-03-23 | Lam Research Corporation | Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing |
JP3977037B2 (ja) * | 2001-08-08 | 2007-09-19 | 株式会社荏原製作所 | 四辺形基板の研磨装置 |
US6796887B2 (en) * | 2002-11-13 | 2004-09-28 | Speedfam-Ipec Corporation | Wear ring assembly |
JP2005088171A (ja) * | 2003-09-19 | 2005-04-07 | Tokyo Seimitsu Co Ltd | ワーク保持ヘッド及び該ワーク保持ヘッドを有する研磨装置 |
KR101044739B1 (ko) * | 2004-11-01 | 2011-06-28 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 및 폴리싱방법 |
JP4597634B2 (ja) | 2004-11-01 | 2010-12-15 | 株式会社荏原製作所 | トップリング、基板の研磨装置及び研磨方法 |
JP4817687B2 (ja) | 2005-03-18 | 2011-11-16 | 株式会社荏原製作所 | 研磨装置 |
US7186171B2 (en) | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
JP2007053164A (ja) * | 2005-08-16 | 2007-03-01 | Sumco Techxiv株式会社 | 研磨装置および研磨ヘッド |
JP2007053163A (ja) * | 2005-08-16 | 2007-03-01 | Sumco Techxiv株式会社 | 研磨装置および研磨ヘッド |
JP4814677B2 (ja) | 2006-03-31 | 2011-11-16 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
JP2008023603A (ja) * | 2006-07-18 | 2008-02-07 | Nippon Seimitsu Denshi Co Ltd | 2層構造のリテーナリング |
JP5464820B2 (ja) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | 研磨装置 |
-
2008
- 2008-02-13 JP JP2008031307A patent/JP5199691B2/ja active Active
-
2009
- 2009-02-09 US US12/747,225 patent/US8357029B2/en active Active
- 2009-02-09 WO PCT/JP2009/052456 patent/WO2009102047A1/en active Application Filing
- 2009-02-09 KR KR1020107017423A patent/KR101554969B1/ko active IP Right Grant
- 2009-02-12 TW TW098104433A patent/TWI441710B/zh active
-
2013
- 2013-02-08 JP JP2013022986A patent/JP5572730B2/ja active Active