JP2009180746A5 - - Google Patents

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Publication number
JP2009180746A5
JP2009180746A5 JP2009120413A JP2009120413A JP2009180746A5 JP 2009180746 A5 JP2009180746 A5 JP 2009180746A5 JP 2009120413 A JP2009120413 A JP 2009120413A JP 2009120413 A JP2009120413 A JP 2009120413A JP 2009180746 A5 JP2009180746 A5 JP 2009180746A5
Authority
JP
Japan
Prior art keywords
pressure sensor
sensor package
package according
conductive portion
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009120413A
Other languages
English (en)
Japanese (ja)
Other versions
JP4991788B2 (ja
JP2009180746A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009120413A priority Critical patent/JP4991788B2/ja
Priority claimed from JP2009120413A external-priority patent/JP4991788B2/ja
Publication of JP2009180746A publication Critical patent/JP2009180746A/ja
Publication of JP2009180746A5 publication Critical patent/JP2009180746A5/ja
Application granted granted Critical
Publication of JP4991788B2 publication Critical patent/JP4991788B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009120413A 2006-01-19 2009-05-18 圧力センサパッケージ及び電子部品 Expired - Fee Related JP4991788B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009120413A JP4991788B2 (ja) 2006-01-19 2009-05-18 圧力センサパッケージ及び電子部品

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006010961 2006-01-19
JP2006010961 2006-01-19
JP2006256003 2006-09-21
JP2006256003 2006-09-21
JP2009120413A JP4991788B2 (ja) 2006-01-19 2009-05-18 圧力センサパッケージ及び電子部品

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007533809A Division JPWO2007083748A1 (ja) 2006-01-19 2007-01-19 圧力センサパッケージ及び電子部品

Publications (3)

Publication Number Publication Date
JP2009180746A JP2009180746A (ja) 2009-08-13
JP2009180746A5 true JP2009180746A5 (https=) 2009-10-08
JP4991788B2 JP4991788B2 (ja) 2012-08-01

Family

ID=38287698

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007533809A Pending JPWO2007083748A1 (ja) 2006-01-19 2007-01-19 圧力センサパッケージ及び電子部品
JP2009120413A Expired - Fee Related JP4991788B2 (ja) 2006-01-19 2009-05-18 圧力センサパッケージ及び電子部品

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2007533809A Pending JPWO2007083748A1 (ja) 2006-01-19 2007-01-19 圧力センサパッケージ及び電子部品

Country Status (5)

Country Link
US (1) US7549344B2 (https=)
EP (1) EP1975587A1 (https=)
JP (2) JPWO2007083748A1 (https=)
CN (1) CN101375146B (https=)
WO (1) WO2007083748A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008065883A1 (en) 2006-11-29 2008-06-05 Fujikura Ltd. Pressure sensor module
US8673769B2 (en) * 2007-06-20 2014-03-18 Lam Research Corporation Methods and apparatuses for three dimensional integrated circuits
JP5331546B2 (ja) * 2008-04-24 2013-10-30 株式会社フジクラ 圧力センサモジュール及び電子部品
JP2010199148A (ja) * 2009-02-23 2010-09-09 Fujikura Ltd 半導体センサデバイス及びその製造方法、パッケージ及びその製造方法、モジュール及びその製造方法、並びに電子機器
JP5216041B2 (ja) * 2010-04-07 2013-06-19 ダイキン工業株式会社 透明圧電シートをそれぞれ有するフレーム付透明圧電シート、タッチパネル、および電子装置
US8378435B2 (en) 2010-12-06 2013-02-19 Wai Yew Lo Pressure sensor and method of assembling same
CN102589753B (zh) 2011-01-05 2016-05-04 飞思卡尔半导体公司 压力传感器及其封装方法
US8511171B2 (en) * 2011-05-23 2013-08-20 General Electric Company Device for measuring environmental forces and method of fabricating the same
US9029999B2 (en) 2011-11-23 2015-05-12 Freescale Semiconductor, Inc. Semiconductor sensor device with footed lid
JP5935352B2 (ja) * 2012-01-27 2016-06-15 富士電機株式会社 Ｓｏｎ構造を有する物理量センサの製造方法。
US9297713B2 (en) 2014-03-19 2016-03-29 Freescale Semiconductor,Inc. Pressure sensor device with through silicon via
US9362479B2 (en) 2014-07-22 2016-06-07 Freescale Semiconductor, Inc. Package-in-package semiconductor sensor device
CN107527874B (zh) 2016-06-20 2023-08-01 恩智浦美国有限公司 腔式压力传感器器件
CN107941407B (zh) * 2017-11-19 2019-05-21 东北大学 一种微压高过载传感器芯片

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0495740A (ja) * 1990-08-06 1992-03-27 Toyota Autom Loom Works Ltd 半導体装置
JPH08210935A (ja) * 1995-02-07 1996-08-20 Tokai Rika Co Ltd 圧力センサ
US6809421B1 (en) * 1996-12-02 2004-10-26 Kabushiki Kaisha Toshiba Multichip semiconductor device, chip therefor and method of formation thereof
JP4074051B2 (ja) 1999-08-31 2008-04-09 株式会社東芝 半導体基板およびその製造方法
JP2002082009A (ja) * 2000-06-30 2002-03-22 Denso Corp 圧力センサ
JP4250868B2 (ja) 2000-09-05 2009-04-08 株式会社デンソー 半導体圧力センサの製造方法
JP2002340714A (ja) 2001-05-15 2002-11-27 Matsushita Electric Works Ltd 半導体圧力センサ及びその製造方法
JP2004170148A (ja) * 2002-11-18 2004-06-17 Fujikura Ltd 絶対圧タイプ圧力センサモジュール
JP4322508B2 (ja) * 2003-01-15 2009-09-02 新光電気工業株式会社 半導体装置の製造方法
US7284443B2 (en) 2003-01-30 2007-10-23 Fujikura Ltd. Semiconductor pressure sensor and process for fabricating the same
JP2006010961A (ja) 2004-06-24 2006-01-12 Mitsubishi Cable Ind Ltd フォトニッククリスタルファイバおよびレーザ加工機
JP2006105624A (ja) * 2004-09-30 2006-04-20 Sumitomo Osaka Cement Co Ltd ダイアフラムチップとそれを用いた圧力センサ及びダイアフラムチップの製造方法
JP2006256003A (ja) 2005-03-16 2006-09-28 Honda Motor Co Ltd 構造板
JP2006324320A (ja) * 2005-05-17 2006-11-30 Renesas Technology Corp 半導体装置
JP2007234881A (ja) * 2006-03-01 2007-09-13 Oki Electric Ind Co Ltd 半導体チップを積層した半導体装置及びその製造方法
JP4955349B2 (ja) * 2006-09-07 2012-06-20 新光電気工業株式会社 半導体装置

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