JP2009104372A - 配線基板及びこれを用いたタッチパネル - Google Patents
配線基板及びこれを用いたタッチパネル Download PDFInfo
- Publication number
- JP2009104372A JP2009104372A JP2007274977A JP2007274977A JP2009104372A JP 2009104372 A JP2009104372 A JP 2009104372A JP 2007274977 A JP2007274977 A JP 2007274977A JP 2007274977 A JP2007274977 A JP 2007274977A JP 2009104372 A JP2009104372 A JP 2009104372A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring
- wiring board
- conductive layer
- touch panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/052—Branched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Laminated Bodies (AREA)
- Push-Button Switches (AREA)
Abstract
【解決手段】複数の配線パターン22の両端を基材21の端部より内方に形成し、配線パターン22と基材21端部の間に引出パターン23を設けて配線基板24を形成すると共に、この配線パターン24の配線パターン22上端を、上基板5の上導電層7両端と、これと直交方向の下基板6の下導電層8両端に接続してタッチパネルを構成することによって、配線基板の製作時に生じる金属バリ等の、配線パターン22両端への付着を防ぐことができるため、製作が容易に行え、安価で確実な操作が可能なものを得ることができる。
【選択図】図1
Description
図1は本発明の一実施の形態によるタッチパネルの平面図であり、同図において、21はポリイミドやポリエチレンテレフタレート等のフィルム状の基材で、上端中央部には切欠部21Aが設けられると共に、基材21上面には金メッキされた銅等によって、複数の配線パターン22が形成されている。
6 下基板
7 上導電層
8 下導電層
9 スペーサ
21 基材
21A 切欠部
22 配線パターン
23 引出パターン
24 配線基板
25 接着剤
26 ベースシート
Claims (2)
- フィルム状の基材と、この基材の上面または下面の少なくとも一方に形成された複数の配線パターンからなり、上記配線パターンの両端を上記基材の端部より内方に形成すると共に、上記配線パターンと上記基材端部の間に引出パターンを設けた配線基板。
- 請求項1記載の配線基板と、下面に上導電層が形成された上基板と、上面に上記上導電層と所定の間隙を空けて対向する下導電層が形成された下基板からなり、上記上基板の上記上導電層両端と、これと直交方向の上記下基板の上記下導電層両端に、上記配線基板の配線パターンの一端を接続したタッチパネル。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007274977A JP5217358B2 (ja) | 2007-10-23 | 2007-10-23 | タッチパネル |
CN200810189890XA CN101483972B (zh) | 2007-10-23 | 2008-10-20 | 布线基板及使用此布线基板的触摸屏 |
US12/255,981 US20090102812A1 (en) | 2007-10-23 | 2008-10-22 | Wiring board and touch panel using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007274977A JP5217358B2 (ja) | 2007-10-23 | 2007-10-23 | タッチパネル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009104372A true JP2009104372A (ja) | 2009-05-14 |
JP5217358B2 JP5217358B2 (ja) | 2013-06-19 |
Family
ID=40563035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007274977A Active JP5217358B2 (ja) | 2007-10-23 | 2007-10-23 | タッチパネル |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090102812A1 (ja) |
JP (1) | JP5217358B2 (ja) |
CN (1) | CN101483972B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103677368B (zh) * | 2012-09-20 | 2016-11-23 | 瀚宇彩晶股份有限公司 | 触控面板与软性电路板的接合结构 |
CN103226427A (zh) * | 2012-11-30 | 2013-07-31 | 深圳市骏达光电有限公司 | 一种电阻触摸屏用fpc、电阻触摸屏及电子设备 |
US10716221B2 (en) * | 2016-03-04 | 2020-07-14 | Samsung Display Co., Ltd. | Method of manufacturing electronic device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003271311A (ja) * | 2002-03-18 | 2003-09-26 | Alps Electric Co Ltd | 座標入力装置およびこれを用いた液晶表示装置 |
JP2003280820A (ja) * | 2002-03-22 | 2003-10-02 | Fujitsu Component Ltd | 入力装置及び電子装置 |
JP2006286760A (ja) * | 2005-03-31 | 2006-10-19 | Matsushita Electric Ind Co Ltd | 配線基板及びこれを用いた入力装置とその製造方法 |
JP2007213118A (ja) * | 2006-02-07 | 2007-08-23 | Matsushita Electric Ind Co Ltd | タッチパネル |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3258218B2 (ja) * | 1995-11-17 | 2002-02-18 | アルプス電気株式会社 | タブレット |
JP2002041231A (ja) * | 2000-05-17 | 2002-02-08 | Hitachi Ltd | 画面入力型表示装置 |
JP2003004562A (ja) * | 2001-06-18 | 2003-01-08 | Alps Electric Co Ltd | 入力装置ならびに検出装置 |
JP2003140181A (ja) * | 2001-11-02 | 2003-05-14 | Nec Corp | 液晶表示装置 |
JP4777759B2 (ja) * | 2005-12-01 | 2011-09-21 | 富士フイルム株式会社 | 配線基板及び配線基板接続装置 |
JP2007172025A (ja) * | 2005-12-19 | 2007-07-05 | Matsushita Electric Ind Co Ltd | タッチパネル |
-
2007
- 2007-10-23 JP JP2007274977A patent/JP5217358B2/ja active Active
-
2008
- 2008-10-20 CN CN200810189890XA patent/CN101483972B/zh active Active
- 2008-10-22 US US12/255,981 patent/US20090102812A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003271311A (ja) * | 2002-03-18 | 2003-09-26 | Alps Electric Co Ltd | 座標入力装置およびこれを用いた液晶表示装置 |
JP2003280820A (ja) * | 2002-03-22 | 2003-10-02 | Fujitsu Component Ltd | 入力装置及び電子装置 |
JP2006286760A (ja) * | 2005-03-31 | 2006-10-19 | Matsushita Electric Ind Co Ltd | 配線基板及びこれを用いた入力装置とその製造方法 |
JP2007213118A (ja) * | 2006-02-07 | 2007-08-23 | Matsushita Electric Ind Co Ltd | タッチパネル |
Also Published As
Publication number | Publication date |
---|---|
US20090102812A1 (en) | 2009-04-23 |
CN101483972B (zh) | 2011-03-23 |
JP5217358B2 (ja) | 2013-06-19 |
CN101483972A (zh) | 2009-07-15 |
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