JP2009102704A - 複数の金属層を有する金属板から該金属層を剥離する方法 - Google Patents
複数の金属層を有する金属板から該金属層を剥離する方法 Download PDFInfo
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- JP2009102704A JP2009102704A JP2007276400A JP2007276400A JP2009102704A JP 2009102704 A JP2009102704 A JP 2009102704A JP 2007276400 A JP2007276400 A JP 2007276400A JP 2007276400 A JP2007276400 A JP 2007276400A JP 2009102704 A JP2009102704 A JP 2009102704A
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- metal
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- peeling
- metal layer
- gold
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- 238000000034 method Methods 0.000 title claims abstract description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052737 gold Inorganic materials 0.000 claims abstract description 39
- 239000010931 gold Substances 0.000 claims abstract description 39
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 37
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 33
- 239000011651 chromium Substances 0.000 claims abstract description 33
- 229910052709 silver Inorganic materials 0.000 claims abstract description 25
- 239000004332 silver Substances 0.000 claims abstract description 25
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 20
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 18
- 239000000243 solution Substances 0.000 claims abstract description 14
- 239000012670 alkaline solution Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims description 135
- 239000002184 metal Substances 0.000 claims description 135
- 239000003513 alkali Substances 0.000 claims description 9
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 claims description 2
- 150000002825 nitriles Chemical class 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 22
- 238000007598 dipping method Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 102
- 239000013078 crystal Substances 0.000 description 7
- 238000004090 dissolution Methods 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- SLAMLWHELXOEJZ-UHFFFAOYSA-N 2-nitrobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1[N+]([O-])=O SLAMLWHELXOEJZ-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- -1 cyanide compound Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IKCLCGXPQILATA-UHFFFAOYSA-N 2-chlorobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1Cl IKCLCGXPQILATA-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- 229940106681 chloroacetic acid Drugs 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
【解決手段】 本発明は、金又は銀からなる少なくとも1層の第1の金属層と、クロム又はニッケルからなる少なくとも1層の第2の金属層とが交互に積層した金属板から、前記第1の金属層及び前記第2の金属層を剥離する方法であって、前記金属板をシアン系アルカリ溶液に浸漬すると共に、前記金属板を陽極として通電と無通電とを交互に繰り返すパルス電解をかける工程を備える金属基板からの金属剥離方法である。ここで、パルス電解の通電時の電流値および電圧は、1mA/cm2〜1A/cm2、1V〜100Vとすると共に、通電時間は0.1秒〜60秒、無通電時間は1秒〜10分とするのが好ましい。
【選択図】 図1
Description
・サンプルNo.1〜6、9,10:通電時間30秒、無通電時間30秒
・サンプルNo.7、8:通電時間5秒、無通電時間5秒
111 金属基板
112 金層
113 クロム層
Claims (6)
- 金又は銀からなる少なくとも1層の第1の金属層と、クロム又はニッケルからなる少なくとも1層の第2の金属層とが交互に積層した金属板から、前記第1の金属層及び前記第2の金属層を剥離する方法であって、
前記金属板をシアン系アルカリ溶液に浸漬すると共に、前記金属板を陽極として通電と無通電とを交互に繰り返すパルス電解をかける工程を備える金属基板からの金属剥離方法。 - パルス電解の通電時の電流値および電圧を、1mA/cm2〜1A/cm2、1V〜100Vとする請求項1に記載の金属基板からの金属剥離方法。
- パルス電解の通電時間は0.1秒〜60秒、無通電時間は1秒〜10分とする請求項1又は請求項2に記載の金属基板からの金属剥離方法。
- シアン系アルカリ溶液は、シアン化化合物としてKCN、NaCNを含む請求項1〜請求項3のいずれか一項記載の金属基板からの金属剥離方法。
- シアン系アルカリ溶液は、シアン濃度が0.1%〜30%であることを特徴とする請求項1〜請求項4のいずれか一項記載の金属基板からの金属剥離方法。
- 第1の金属層及び前記第2の金属層の膜厚は、1nm〜10μmである請求項1〜請求項5のいずれか一項記載の金属基板からの金属剥離方法。
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JP2007276400A JP4949994B2 (ja) | 2007-10-24 | 2007-10-24 | 複数の金属層を有する金属板から該金属層を剥離する方法 |
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JP2007276400A JP4949994B2 (ja) | 2007-10-24 | 2007-10-24 | 複数の金属層を有する金属板から該金属層を剥離する方法 |
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JP4949994B2 JP4949994B2 (ja) | 2012-06-13 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011052259A (ja) * | 2009-09-01 | 2011-03-17 | Shinko Electric Ind Co Ltd | 置換めっき層の剥離方法 |
JP2011052258A (ja) * | 2009-09-01 | 2011-03-17 | Shinko Electric Ind Co Ltd | 置換めっき層の剥離方法 |
JP2021046567A (ja) * | 2019-09-17 | 2021-03-25 | アサヒプリテック株式会社 | 電解装置及び剥離方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01156500A (ja) * | 1987-12-14 | 1989-06-20 | Shinriyou Denshi Kk | 銀の電解除去方法 |
JPH02182886A (ja) * | 1989-01-09 | 1990-07-17 | Hitachi Cable Ltd | 銀めっき剥離方法 |
JPH10102268A (ja) * | 1996-09-24 | 1998-04-21 | Kanehiro Metaraijingu:Kk | 装飾品 |
JP2000001800A (ja) * | 1998-06-18 | 2000-01-07 | Sumitomo Metal Mining Co Ltd | 電解剥離方法 |
-
2007
- 2007-10-24 JP JP2007276400A patent/JP4949994B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01156500A (ja) * | 1987-12-14 | 1989-06-20 | Shinriyou Denshi Kk | 銀の電解除去方法 |
JPH02182886A (ja) * | 1989-01-09 | 1990-07-17 | Hitachi Cable Ltd | 銀めっき剥離方法 |
JPH10102268A (ja) * | 1996-09-24 | 1998-04-21 | Kanehiro Metaraijingu:Kk | 装飾品 |
JP2000001800A (ja) * | 1998-06-18 | 2000-01-07 | Sumitomo Metal Mining Co Ltd | 電解剥離方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011052259A (ja) * | 2009-09-01 | 2011-03-17 | Shinko Electric Ind Co Ltd | 置換めっき層の剥離方法 |
JP2011052258A (ja) * | 2009-09-01 | 2011-03-17 | Shinko Electric Ind Co Ltd | 置換めっき層の剥離方法 |
JP2021046567A (ja) * | 2019-09-17 | 2021-03-25 | アサヒプリテック株式会社 | 電解装置及び剥離方法 |
JP7330831B2 (ja) | 2019-09-17 | 2023-08-22 | アサヒプリテック株式会社 | 電解装置及び剥離方法 |
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