JP2009098272A5 - - Google Patents

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Publication number
JP2009098272A5
JP2009098272A5 JP2007267943A JP2007267943A JP2009098272A5 JP 2009098272 A5 JP2009098272 A5 JP 2009098272A5 JP 2007267943 A JP2007267943 A JP 2007267943A JP 2007267943 A JP2007267943 A JP 2007267943A JP 2009098272 A5 JP2009098272 A5 JP 2009098272A5
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JP
Japan
Prior art keywords
paste
pressure
gas
coating apparatus
syringe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007267943A
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English (en)
Japanese (ja)
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JP2009098272A (ja
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Publication date
Application filed filed Critical
Priority to JP2007267943A priority Critical patent/JP2009098272A/ja
Priority claimed from JP2007267943A external-priority patent/JP2009098272A/ja
Publication of JP2009098272A publication Critical patent/JP2009098272A/ja
Publication of JP2009098272A5 publication Critical patent/JP2009098272A5/ja
Pending legal-status Critical Current

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JP2007267943A 2007-10-15 2007-10-15 ペースト塗布装置 Pending JP2009098272A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007267943A JP2009098272A (ja) 2007-10-15 2007-10-15 ペースト塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007267943A JP2009098272A (ja) 2007-10-15 2007-10-15 ペースト塗布装置

Publications (2)

Publication Number Publication Date
JP2009098272A JP2009098272A (ja) 2009-05-07
JP2009098272A5 true JP2009098272A5 (cg-RX-API-DMAC10.html) 2011-02-17

Family

ID=40701371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007267943A Pending JP2009098272A (ja) 2007-10-15 2007-10-15 ペースト塗布装置

Country Status (1)

Country Link
JP (1) JP2009098272A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110678270B (zh) 2017-05-25 2022-06-17 武藏工业株式会社 液体材料涂布装置及液体材料涂布方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131178A (ja) * 1991-09-30 1993-05-28 Atsugi Unisia Corp 被加工物洗浄装置
JPH05265013A (ja) * 1992-03-24 1993-10-15 Toshiba Corp 液晶パネルの組立装置
JP3260511B2 (ja) * 1993-09-13 2002-02-25 株式会社日立製作所 シール剤描画方法
JPH1099756A (ja) * 1996-10-01 1998-04-21 Fuji Mach Mfg Co Ltd 接着剤ディスペンサ
JPH1115536A (ja) * 1997-06-23 1999-01-22 Advantest Corp 空気圧制御装置
JP2004319731A (ja) * 2003-04-16 2004-11-11 Matsushita Electric Ind Co Ltd 配線基板の製造方法とそれを用いた製造装置
JP2005218971A (ja) * 2004-02-06 2005-08-18 Hitachi Industries Co Ltd ペースト塗布機と塗布方法
JP2007167791A (ja) * 2005-12-22 2007-07-05 Shibaura Mechatronics Corp ペースト塗布装置、これを用いた表示パネルの製造装置、及び、ペースト塗布方法
JP2007262911A (ja) * 2006-03-27 2007-10-11 Asahi Sunac Corp 塗料圧送システム及び塗料圧送方法

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