JP2009098272A - ペースト塗布装置 - Google Patents

ペースト塗布装置 Download PDF

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Publication number
JP2009098272A
JP2009098272A JP2007267943A JP2007267943A JP2009098272A JP 2009098272 A JP2009098272 A JP 2009098272A JP 2007267943 A JP2007267943 A JP 2007267943A JP 2007267943 A JP2007267943 A JP 2007267943A JP 2009098272 A JP2009098272 A JP 2009098272A
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JP
Japan
Prior art keywords
paste
pressure
syringe
compressed gas
nozzle
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Pending
Application number
JP2007267943A
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English (en)
Japanese (ja)
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JP2009098272A5 (cg-RX-API-DMAC10.html
Inventor
Hiroki Wajima
博樹 輪嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2007267943A priority Critical patent/JP2009098272A/ja
Publication of JP2009098272A publication Critical patent/JP2009098272A/ja
Publication of JP2009098272A5 publication Critical patent/JP2009098272A5/ja
Pending legal-status Critical Current

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  • Liquid Crystal (AREA)
JP2007267943A 2007-10-15 2007-10-15 ペースト塗布装置 Pending JP2009098272A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007267943A JP2009098272A (ja) 2007-10-15 2007-10-15 ペースト塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007267943A JP2009098272A (ja) 2007-10-15 2007-10-15 ペースト塗布装置

Publications (2)

Publication Number Publication Date
JP2009098272A true JP2009098272A (ja) 2009-05-07
JP2009098272A5 JP2009098272A5 (cg-RX-API-DMAC10.html) 2011-02-17

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ID=40701371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007267943A Pending JP2009098272A (ja) 2007-10-15 2007-10-15 ペースト塗布装置

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JP (1) JP2009098272A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10786827B2 (en) 2017-05-25 2020-09-29 Musashi Engineering, Inc. Liquid material application apparatus and liquid material application method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131178A (ja) * 1991-09-30 1993-05-28 Atsugi Unisia Corp 被加工物洗浄装置
JPH05265013A (ja) * 1992-03-24 1993-10-15 Toshiba Corp 液晶パネルの組立装置
JPH0784268A (ja) * 1993-09-13 1995-03-31 Hitachi Ltd シール剤描画方法
JPH1099756A (ja) * 1996-10-01 1998-04-21 Fuji Mach Mfg Co Ltd 接着剤ディスペンサ
JPH1115536A (ja) * 1997-06-23 1999-01-22 Advantest Corp 空気圧制御装置
JP2004319731A (ja) * 2003-04-16 2004-11-11 Matsushita Electric Ind Co Ltd 配線基板の製造方法とそれを用いた製造装置
JP2005218971A (ja) * 2004-02-06 2005-08-18 Hitachi Industries Co Ltd ペースト塗布機と塗布方法
JP2007167791A (ja) * 2005-12-22 2007-07-05 Shibaura Mechatronics Corp ペースト塗布装置、これを用いた表示パネルの製造装置、及び、ペースト塗布方法
JP2007262911A (ja) * 2006-03-27 2007-10-11 Asahi Sunac Corp 塗料圧送システム及び塗料圧送方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131178A (ja) * 1991-09-30 1993-05-28 Atsugi Unisia Corp 被加工物洗浄装置
JPH05265013A (ja) * 1992-03-24 1993-10-15 Toshiba Corp 液晶パネルの組立装置
JPH0784268A (ja) * 1993-09-13 1995-03-31 Hitachi Ltd シール剤描画方法
JPH1099756A (ja) * 1996-10-01 1998-04-21 Fuji Mach Mfg Co Ltd 接着剤ディスペンサ
JPH1115536A (ja) * 1997-06-23 1999-01-22 Advantest Corp 空気圧制御装置
JP2004319731A (ja) * 2003-04-16 2004-11-11 Matsushita Electric Ind Co Ltd 配線基板の製造方法とそれを用いた製造装置
JP2005218971A (ja) * 2004-02-06 2005-08-18 Hitachi Industries Co Ltd ペースト塗布機と塗布方法
JP2007167791A (ja) * 2005-12-22 2007-07-05 Shibaura Mechatronics Corp ペースト塗布装置、これを用いた表示パネルの製造装置、及び、ペースト塗布方法
JP2007262911A (ja) * 2006-03-27 2007-10-11 Asahi Sunac Corp 塗料圧送システム及び塗料圧送方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10786827B2 (en) 2017-05-25 2020-09-29 Musashi Engineering, Inc. Liquid material application apparatus and liquid material application method
US11396028B2 (en) 2017-05-25 2022-07-26 Musashi Engineering, Inc. Liquid material application apparatus and liquid material application method
US12162027B2 (en) 2017-05-25 2024-12-10 Musashi Engineering, Inc. Liquid material application apparatus and liquid material application method

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