JP2009094246A5 - - Google Patents
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- Publication number
- JP2009094246A5 JP2009094246A5 JP2007262595A JP2007262595A JP2009094246A5 JP 2009094246 A5 JP2009094246 A5 JP 2009094246A5 JP 2007262595 A JP2007262595 A JP 2007262595A JP 2007262595 A JP2007262595 A JP 2007262595A JP 2009094246 A5 JP2009094246 A5 JP 2009094246A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor device
- main surface
- electrode
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 97
- 238000001514 detection method Methods 0.000 claims 20
- 238000007789 sealing Methods 0.000 claims 20
- 239000010410 layer Substances 0.000 claims 8
- 239000011241 protective layer Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 230000000149 penetrating Effects 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive Effects 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 230000003287 optical Effects 0.000 claims 1
- 230000002093 peripheral Effects 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007262595A JP2009094246A (ja) | 2007-10-05 | 2007-10-05 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007262595A JP2009094246A (ja) | 2007-10-05 | 2007-10-05 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009094246A JP2009094246A (ja) | 2009-04-30 |
| JP2009094246A5 true JP2009094246A5 (de) | 2010-11-04 |
Family
ID=40665949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007262595A Pending JP2009094246A (ja) | 2007-10-05 | 2007-10-05 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009094246A (de) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004319530A (ja) * | 2003-02-28 | 2004-11-11 | Sanyo Electric Co Ltd | 光半導体装置およびその製造方法 |
| JP3990347B2 (ja) * | 2003-12-04 | 2007-10-10 | ローム株式会社 | 半導体チップおよびその製造方法、ならびに半導体装置 |
| JP2005347442A (ja) * | 2004-06-02 | 2005-12-15 | Sanyo Electric Co Ltd | 半導体装置 |
-
2007
- 2007-10-05 JP JP2007262595A patent/JP2009094246A/ja active Pending
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