JP2009088348A5 - - Google Patents

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Publication number
JP2009088348A5
JP2009088348A5 JP2007257768A JP2007257768A JP2009088348A5 JP 2009088348 A5 JP2009088348 A5 JP 2009088348A5 JP 2007257768 A JP2007257768 A JP 2007257768A JP 2007257768 A JP2007257768 A JP 2007257768A JP 2009088348 A5 JP2009088348 A5 JP 2009088348A5
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JP
Japan
Prior art keywords
substrate
heating unit
lamp
heating
semiconductor manufacturing
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Application number
JP2007257768A
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English (en)
Japanese (ja)
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JP2009088348A (ja
JP5465828B2 (ja
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Priority to JP2007257768A priority Critical patent/JP5465828B2/ja
Priority claimed from JP2007257768A external-priority patent/JP5465828B2/ja
Publication of JP2009088348A publication Critical patent/JP2009088348A/ja
Publication of JP2009088348A5 publication Critical patent/JP2009088348A5/ja
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Publication of JP5465828B2 publication Critical patent/JP5465828B2/ja
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JP2007257768A 2007-10-01 2007-10-01 基板処理装置及び半導体デバイスの製造方法 Active JP5465828B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007257768A JP5465828B2 (ja) 2007-10-01 2007-10-01 基板処理装置及び半導体デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007257768A JP5465828B2 (ja) 2007-10-01 2007-10-01 基板処理装置及び半導体デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2009088348A JP2009088348A (ja) 2009-04-23
JP2009088348A5 true JP2009088348A5 (enExample) 2010-11-18
JP5465828B2 JP5465828B2 (ja) 2014-04-09

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ID=40661355

Family Applications (1)

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JP2007257768A Active JP5465828B2 (ja) 2007-10-01 2007-10-01 基板処理装置及び半導体デバイスの製造方法

Country Status (1)

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JP (1) JP5465828B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6012933B2 (ja) * 2011-04-26 2016-10-25 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および基板処理方法
KR101331420B1 (ko) 2011-03-04 2013-11-21 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치 및 반도체 장치의 제조 방법
KR102696209B1 (ko) * 2019-03-20 2024-08-20 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 처리 용기, 반사체 및 반도체 장치의 제조 방법
KR102656121B1 (ko) * 2021-12-24 2024-04-12 (주)보부하이테크 용접 결함 및 크랙 발생을 개선한 히터 구조
WO2025069286A1 (ja) * 2023-09-27 2025-04-03 株式会社日立ハイテク ウエハ処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154618A (ja) * 1985-12-26 1987-07-09 Matsushita Electric Ind Co Ltd 気相成長装置
JPH0532956Y2 (enExample) * 1987-09-24 1993-08-23
JPH08292667A (ja) * 1995-04-21 1996-11-05 Tec Corp 加熱定着装置
JP2000114196A (ja) * 1998-08-06 2000-04-21 Ushio Inc 光照射式加熱装置の冷却構造
JP3733811B2 (ja) * 1999-02-16 2006-01-11 ウシオ電機株式会社 光照射式加熱処理装置
JP4004765B2 (ja) * 2000-10-10 2007-11-07 株式会社半導体エネルギー研究所 半導体装置の作製方法

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