JP2009088229A5 - - Google Patents

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Publication number
JP2009088229A5
JP2009088229A5 JP2007255780A JP2007255780A JP2009088229A5 JP 2009088229 A5 JP2009088229 A5 JP 2009088229A5 JP 2007255780 A JP2007255780 A JP 2007255780A JP 2007255780 A JP2007255780 A JP 2007255780A JP 2009088229 A5 JP2009088229 A5 JP 2009088229A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007255780A
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JP2009088229A (ja
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Application filed filed Critical
Priority to JP2007255780A priority Critical patent/JP2009088229A/ja
Priority claimed from JP2007255780A external-priority patent/JP2009088229A/ja
Priority to KR1020107000200A priority patent/KR101268186B1/ko
Priority to PCT/JP2008/066455 priority patent/WO2009041282A1/ja
Priority to US12/680,088 priority patent/US20100272895A1/en
Priority to CN2008800251214A priority patent/CN101755325B/zh
Priority to TW97137277A priority patent/TW200935515A/zh
Publication of JP2009088229A publication Critical patent/JP2009088229A/ja
Publication of JP2009088229A5 publication Critical patent/JP2009088229A5/ja
Pending legal-status Critical Current

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JP2007255780A 2007-09-28 2007-09-28 成膜装置、成膜方法、記憶媒体及びガス供給装置 Pending JP2009088229A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007255780A JP2009088229A (ja) 2007-09-28 2007-09-28 成膜装置、成膜方法、記憶媒体及びガス供給装置
KR1020107000200A KR101268186B1 (ko) 2007-09-28 2008-09-11 성막 장치, 성막 방법, 기억 매체 및 가스 공급 장치
PCT/JP2008/066455 WO2009041282A1 (ja) 2007-09-28 2008-09-11 成膜装置、成膜方法、記憶媒体及びガス供給装置
US12/680,088 US20100272895A1 (en) 2007-09-28 2008-09-11 Film deposition apparatus, film deposition method, storage medium, and gas supply apparatus
CN2008800251214A CN101755325B (zh) 2007-09-28 2008-09-11 成膜装置、成膜方法、存储介质及气体供给装置
TW97137277A TW200935515A (en) 2007-09-28 2008-09-26 Film-forming apparatus, film forming method, storage medium, and gas supply apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007255780A JP2009088229A (ja) 2007-09-28 2007-09-28 成膜装置、成膜方法、記憶媒体及びガス供給装置

Publications (2)

Publication Number Publication Date
JP2009088229A JP2009088229A (ja) 2009-04-23
JP2009088229A5 true JP2009088229A5 (ja) 2010-07-15

Family

ID=40511171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007255780A Pending JP2009088229A (ja) 2007-09-28 2007-09-28 成膜装置、成膜方法、記憶媒体及びガス供給装置

Country Status (6)

Country Link
US (1) US20100272895A1 (ja)
JP (1) JP2009088229A (ja)
KR (1) KR101268186B1 (ja)
CN (1) CN101755325B (ja)
TW (1) TW200935515A (ja)
WO (1) WO2009041282A1 (ja)

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JP5990626B1 (ja) * 2015-05-26 2016-09-14 株式会社日本製鋼所 原子層成長装置
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US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
US10504754B2 (en) 2016-05-19 2019-12-10 Applied Materials, Inc. Systems and methods for improved semiconductor etching and component protection
JP6608332B2 (ja) * 2016-05-23 2019-11-20 東京エレクトロン株式会社 成膜装置
JP6685179B2 (ja) * 2016-06-01 2020-04-22 東京エレクトロン株式会社 基板処理方法
US10546729B2 (en) * 2016-10-04 2020-01-28 Applied Materials, Inc. Dual-channel showerhead with improved profile
US10431429B2 (en) 2017-02-03 2019-10-01 Applied Materials, Inc. Systems and methods for radial and azimuthal control of plasma uniformity
TWI605150B (zh) * 2017-02-03 2017-11-11 台灣積體電路製造股份有限公司 氣體供應裝置及方法
US10943834B2 (en) 2017-03-13 2021-03-09 Applied Materials, Inc. Replacement contact process
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