JP2009085934A - ソケット基板上にスイッチ素子を有するテスト装置 - Google Patents
ソケット基板上にスイッチ素子を有するテスト装置 Download PDFInfo
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- JP2009085934A JP2009085934A JP2007278983A JP2007278983A JP2009085934A JP 2009085934 A JP2009085934 A JP 2009085934A JP 2007278983 A JP2007278983 A JP 2007278983A JP 2007278983 A JP2007278983 A JP 2007278983A JP 2009085934 A JP2009085934 A JP 2009085934A
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- test
- integrated circuit
- socket
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- socket substrate
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- 238000012360 testing method Methods 0.000 title claims abstract description 147
- 239000000758 substrate Substances 0.000 title claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 4
- 239000000523 sample Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
【解決手段】基板本体を含み、かつ前記基板本体に複数のテストソケットが配置され、前記テストソケット上の複数の導電素子を介し、少なくとも1つの被試験集積回路素子上の複数の金属端点を前記ソケット基板の底部に電気的に接続する集積回路素子をテストするソケット基板であって、前記ソケット基板の底部に、複数セットのテスト回路と、少なくとも1つのスイッチ素子とが配置され、前記スイッチ素子は、前記複数セットのテスト回路の間を切り替えることができることを特徴とする。
【選択図】図2
Description
320:半導体素子をソケット基板上のソケットに電気的に接続する。
330:スイッチ素子を切り替え、第1回路と導通させる。
340:被試験集積回路素子のテストを行い、テスト完了後にハンドラで分類を行う。
350:次のロットのピン規格が同じであるがピンの電気特性が異なる被試験集積回路素子をテストソケットに入れる。
360:スイッチ素子を切り替え、第2回路と導通させる。
370:被試験集積回路素子のテストを行い、テスト完了後にハンドラで分類を行う。
Claims (1)
- 基板本体を含み、かつ前記基板本体に複数のテストソケットが配置され、前記テストソケット上の複数の導電素子を介し、少なくとも1つの被試験集積回路素子上の複数の金属端点を前記ソケット基板の底部に電気的に接続する集積回路素子をテストするソケット基板であって、
前記ソケット基板の底部に、複数セットのテスト回路と、少なくとも1つのスイッチ素子とが配置され、
前記スイッチ素子は、前記複数セットのテスト回路の間を切り替えることができることを特徴とする、
集積回路素子をテストするソケット基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96135872A TWI339270B (en) | 2007-09-27 | 2007-09-27 | Socket boards with switch components on a testing apparatus |
TW096135872 | 2007-09-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009085934A true JP2009085934A (ja) | 2009-04-23 |
JP5319907B2 JP5319907B2 (ja) | 2013-10-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007278983A Active JP5319907B2 (ja) | 2007-09-27 | 2007-10-26 | ソケット基板上にスイッチ素子を有するテスト装置 |
Country Status (2)
Country | Link |
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JP (1) | JP5319907B2 (ja) |
TW (1) | TWI339270B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104991097A (zh) * | 2015-06-29 | 2015-10-21 | 上海华力微电子有限公司 | 一种探针卡 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI407125B (zh) * | 2011-02-18 | 2013-09-01 | Chroma Ate Inc | 一種電子元件測試系統及其切換裝置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07244115A (ja) * | 1994-03-04 | 1995-09-19 | Fujitsu Ltd | 半導体チップの試験装置 |
JPH09145788A (ja) * | 1995-11-28 | 1997-06-06 | Advantest Corp | Icテストシステム |
JPH11161511A (ja) * | 1997-11-25 | 1999-06-18 | Suzuka Fuji Xerox Co Ltd | 電気的特性測定装置 |
JP2001349925A (ja) * | 2000-06-09 | 2001-12-21 | Mitsubishi Electric Corp | 半導体集積回路の検査装置および検査方法 |
JP2002257892A (ja) * | 2001-02-05 | 2002-09-11 | Macronix Internatl Co Ltd | 汎用型バーンインボード |
JP2003028919A (ja) * | 2001-07-13 | 2003-01-29 | Canon Inc | 寿命試験用治具及び寿命試験方法 |
WO2007007658A1 (ja) * | 2005-07-07 | 2007-01-18 | Advantest Corporation | 試験装置 |
-
2007
- 2007-09-27 TW TW96135872A patent/TWI339270B/zh active
- 2007-10-26 JP JP2007278983A patent/JP5319907B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07244115A (ja) * | 1994-03-04 | 1995-09-19 | Fujitsu Ltd | 半導体チップの試験装置 |
JPH09145788A (ja) * | 1995-11-28 | 1997-06-06 | Advantest Corp | Icテストシステム |
JPH11161511A (ja) * | 1997-11-25 | 1999-06-18 | Suzuka Fuji Xerox Co Ltd | 電気的特性測定装置 |
JP2001349925A (ja) * | 2000-06-09 | 2001-12-21 | Mitsubishi Electric Corp | 半導体集積回路の検査装置および検査方法 |
JP2002257892A (ja) * | 2001-02-05 | 2002-09-11 | Macronix Internatl Co Ltd | 汎用型バーンインボード |
JP2003028919A (ja) * | 2001-07-13 | 2003-01-29 | Canon Inc | 寿命試験用治具及び寿命試験方法 |
WO2007007658A1 (ja) * | 2005-07-07 | 2007-01-18 | Advantest Corporation | 試験装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104991097A (zh) * | 2015-06-29 | 2015-10-21 | 上海华力微电子有限公司 | 一种探针卡 |
Also Published As
Publication number | Publication date |
---|---|
TW200914856A (en) | 2009-04-01 |
TWI339270B (en) | 2011-03-21 |
JP5319907B2 (ja) | 2013-10-16 |
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