JP2009071194A - 半導体製造装置、半導体製造方法及びデバイス製造方法 - Google Patents

半導体製造装置、半導体製造方法及びデバイス製造方法 Download PDF

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Publication number
JP2009071194A
JP2009071194A JP2007240180A JP2007240180A JP2009071194A JP 2009071194 A JP2009071194 A JP 2009071194A JP 2007240180 A JP2007240180 A JP 2007240180A JP 2007240180 A JP2007240180 A JP 2007240180A JP 2009071194 A JP2009071194 A JP 2009071194A
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JP
Japan
Prior art keywords
job
processed
article
reticle
semiconductor manufacturing
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Pending
Application number
JP2007240180A
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English (en)
Japanese (ja)
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JP2009071194A5 (https=
Inventor
Toshio Yabe
俊夫 矢部
Satoshi Sugiura
聡 杉浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2007240180A priority Critical patent/JP2009071194A/ja
Priority to US12/207,903 priority patent/US8175738B2/en
Publication of JP2009071194A publication Critical patent/JP2009071194A/ja
Publication of JP2009071194A5 publication Critical patent/JP2009071194A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32264—Setup time
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32265—Waiting, queue time, buffer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Library & Information Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2007240180A 2007-09-14 2007-09-14 半導体製造装置、半導体製造方法及びデバイス製造方法 Pending JP2009071194A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007240180A JP2009071194A (ja) 2007-09-14 2007-09-14 半導体製造装置、半導体製造方法及びデバイス製造方法
US12/207,903 US8175738B2 (en) 2007-09-14 2008-09-10 Device manufacturing apparatus and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007240180A JP2009071194A (ja) 2007-09-14 2007-09-14 半導体製造装置、半導体製造方法及びデバイス製造方法

Publications (2)

Publication Number Publication Date
JP2009071194A true JP2009071194A (ja) 2009-04-02
JP2009071194A5 JP2009071194A5 (https=) 2010-11-04

Family

ID=40454868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007240180A Pending JP2009071194A (ja) 2007-09-14 2007-09-14 半導体製造装置、半導体製造方法及びデバイス製造方法

Country Status (2)

Country Link
US (1) US8175738B2 (https=)
JP (1) JP2009071194A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9678505B2 (en) * 2013-10-14 2017-06-13 Invensys Systems, Inc. Line management in manufacturing execution system

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555103A (ja) * 1991-08-28 1993-03-05 Canon Inc 半導体製造装置
JPH097912A (ja) * 1995-04-18 1997-01-10 Nippondenso Co Ltd 半導体基板の生産制御装置
JPH11162827A (ja) * 1997-12-02 1999-06-18 Nikon Corp 露光装置
JP2000323391A (ja) * 1999-05-12 2000-11-24 Canon Inc 露光装置
JP2001307972A (ja) * 2000-04-21 2001-11-02 Canon Inc 半導体製造装置およびデバイス製造装置
JP2002057087A (ja) * 2000-08-09 2002-02-22 Nikon Corp 露光装置
JP2002534789A (ja) * 1998-12-31 2002-10-15 シリコン ヴァレイ グループ インコーポレイテッド 基板処理システムを同期化させるための方法及び装置
JP2003022962A (ja) * 2001-07-10 2003-01-24 Canon Inc 露光システム、デバイス製造方法、半導体製造工場および露光装置の保守方法
JP2005294473A (ja) * 2004-03-31 2005-10-20 Canon Inc 露光装置、デバイス製造方法及びデバイス
JP2006093431A (ja) * 2004-09-24 2006-04-06 Renesas Technology Corp フォトマスクの搬送方法、露光方法及び露光処理システム、並びに半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167562A (ja) 1994-12-09 1996-06-25 Canon Inc 半導体製造装置およびデバイス製造方法
US6360133B1 (en) * 1999-06-17 2002-03-19 Advanced Micro Devices, Inc. Method and apparatus for automatic routing for reentrant process
US6403905B1 (en) * 2000-02-02 2002-06-11 Advanced Micro Devices, Inc. Reticle stocking and sorting management system
US6351684B1 (en) * 2000-09-19 2002-02-26 Advanced Micro Devices, Inc. Mask identification database server
JP2002190443A (ja) * 2000-12-20 2002-07-05 Hitachi Ltd 露光方法およびその露光システム
JP3626448B2 (ja) * 2001-11-28 2005-03-09 株式会社東芝 露光方法
US7206652B2 (en) * 2004-08-20 2007-04-17 International Business Machines Corporation Method and system for intelligent automated reticle management
JP2006108474A (ja) * 2004-10-07 2006-04-20 Canon Inc 露光装置及びそれを用いたデバイス製造方法
JP2006339268A (ja) * 2005-05-31 2006-12-14 Canon Inc 半導体製造装置及びその制御方法並びにデバイス製造方法
US7089077B1 (en) * 2005-07-06 2006-08-08 International Business Machines Corporation Monitor wafer purchase and controls database
US8050793B1 (en) * 2006-04-04 2011-11-01 Advanced Micro Devices, Inc. Method and apparatus for linking reticle manufacturing data
US7194328B1 (en) * 2006-04-04 2007-03-20 Advanced Micro Devices, Inc. Method and apparatus for tracking reticle history
US7257459B1 (en) * 2006-12-27 2007-08-14 Advanced Micro Devices, Inc. Method and apparatus for scheduling pilot lots
US20080201003A1 (en) * 2007-02-20 2008-08-21 Tech Semiconductor Singapore Pte Ltd Method and system for reticle scheduling

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555103A (ja) * 1991-08-28 1993-03-05 Canon Inc 半導体製造装置
JPH097912A (ja) * 1995-04-18 1997-01-10 Nippondenso Co Ltd 半導体基板の生産制御装置
JPH11162827A (ja) * 1997-12-02 1999-06-18 Nikon Corp 露光装置
JP2002534789A (ja) * 1998-12-31 2002-10-15 シリコン ヴァレイ グループ インコーポレイテッド 基板処理システムを同期化させるための方法及び装置
JP2000323391A (ja) * 1999-05-12 2000-11-24 Canon Inc 露光装置
JP2001307972A (ja) * 2000-04-21 2001-11-02 Canon Inc 半導体製造装置およびデバイス製造装置
JP2002057087A (ja) * 2000-08-09 2002-02-22 Nikon Corp 露光装置
JP2003022962A (ja) * 2001-07-10 2003-01-24 Canon Inc 露光システム、デバイス製造方法、半導体製造工場および露光装置の保守方法
JP2005294473A (ja) * 2004-03-31 2005-10-20 Canon Inc 露光装置、デバイス製造方法及びデバイス
JP2006093431A (ja) * 2004-09-24 2006-04-06 Renesas Technology Corp フォトマスクの搬送方法、露光方法及び露光処理システム、並びに半導体装置の製造方法

Also Published As

Publication number Publication date
US20090075209A1 (en) 2009-03-19
US8175738B2 (en) 2012-05-08

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