JP2009038304A - 照明用灯具 - Google Patents

照明用灯具 Download PDF

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Publication number
JP2009038304A
JP2009038304A JP2007203295A JP2007203295A JP2009038304A JP 2009038304 A JP2009038304 A JP 2009038304A JP 2007203295 A JP2007203295 A JP 2007203295A JP 2007203295 A JP2007203295 A JP 2007203295A JP 2009038304 A JP2009038304 A JP 2009038304A
Authority
JP
Japan
Prior art keywords
phosphor
light
led
led element
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007203295A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009038304A5 (enExample
Inventor
Daisuke Uchida
大祐 内田
Teiichiro Takano
貞一郎 高野
Toshiyuki Kondo
俊幸 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2007203295A priority Critical patent/JP2009038304A/ja
Publication of JP2009038304A publication Critical patent/JP2009038304A/ja
Publication of JP2009038304A5 publication Critical patent/JP2009038304A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
JP2007203295A 2007-08-03 2007-08-03 照明用灯具 Pending JP2009038304A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007203295A JP2009038304A (ja) 2007-08-03 2007-08-03 照明用灯具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007203295A JP2009038304A (ja) 2007-08-03 2007-08-03 照明用灯具

Publications (2)

Publication Number Publication Date
JP2009038304A true JP2009038304A (ja) 2009-02-19
JP2009038304A5 JP2009038304A5 (enExample) 2010-09-09

Family

ID=40439934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007203295A Pending JP2009038304A (ja) 2007-08-03 2007-08-03 照明用灯具

Country Status (1)

Country Link
JP (1) JP2009038304A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011014359A (ja) * 2009-07-01 2011-01-20 Isahiko Suzuki Ｌｅｄ照明器具
JP2012079671A (ja) * 2010-10-05 2012-04-19 Advanced Connectek Inc 補色式光源装置
JP2012099297A (ja) * 2010-11-01 2012-05-24 Keiji Iimura Ｌｅｄランプおよびｌｅｄ電球
JP2012520547A (ja) * 2009-03-10 2012-09-06 ネペス エルイーディー コーポレーション ランプカバー及びこれを利用したｌｅｄランプ
CN102901015A (zh) * 2011-07-26 2013-01-30 日立空调·家用电器株式会社 照明装置
JP2013175467A (ja) * 2013-03-30 2013-09-05 Keiji Iimura Ｌｅｄランプおよびｌｅｄ電球
JP2013187106A (ja) * 2012-03-09 2013-09-19 Panasonic Corp 照明器具
JP2015072910A (ja) * 2014-10-24 2015-04-16 日立アプライアンス株式会社 照明装置
JP2018147903A (ja) * 2018-07-02 2018-09-20 日立アプライアンス株式会社 照明装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031547A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面状光源
JP2005086051A (ja) * 2003-09-10 2005-03-31 Toshiba Lighting & Technology Corp 発光装置
JP2005537651A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー 効率が向上した被覆ｌｅｄ
JP2007066939A (ja) * 2005-08-29 2007-03-15 Matsushita Electric Ind Co Ltd 半導体発光装置
WO2007083907A1 (en) * 2006-01-17 2007-07-26 Lucimea Co., Ltd. Sheet type phosphors, preparation method thereof, and light emitting devices using these phosphors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031547A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面状光源
JP2005537651A (ja) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー 効率が向上した被覆ｌｅｄ
JP2005086051A (ja) * 2003-09-10 2005-03-31 Toshiba Lighting & Technology Corp 発光装置
JP2007066939A (ja) * 2005-08-29 2007-03-15 Matsushita Electric Ind Co Ltd 半導体発光装置
WO2007083907A1 (en) * 2006-01-17 2007-07-26 Lucimea Co., Ltd. Sheet type phosphors, preparation method thereof, and light emitting devices using these phosphors

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012520547A (ja) * 2009-03-10 2012-09-06 ネペス エルイーディー コーポレーション ランプカバー及びこれを利用したｌｅｄランプ
JP2011014359A (ja) * 2009-07-01 2011-01-20 Isahiko Suzuki Ｌｅｄ照明器具
JP2012079671A (ja) * 2010-10-05 2012-04-19 Advanced Connectek Inc 補色式光源装置
JP2012099297A (ja) * 2010-11-01 2012-05-24 Keiji Iimura Ｌｅｄランプおよびｌｅｄ電球
CN102901015A (zh) * 2011-07-26 2013-01-30 日立空调·家用电器株式会社 照明装置
JP2013026588A (ja) * 2011-07-26 2013-02-04 Hitachi Appliances Inc 照明装置
JP2013187106A (ja) * 2012-03-09 2013-09-19 Panasonic Corp 照明器具
JP2013175467A (ja) * 2013-03-30 2013-09-05 Keiji Iimura Ｌｅｄランプおよびｌｅｄ電球
JP2015072910A (ja) * 2014-10-24 2015-04-16 日立アプライアンス株式会社 照明装置
JP2018147903A (ja) * 2018-07-02 2018-09-20 日立アプライアンス株式会社 照明装置

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